ATE11858T1 - Material fuer unterlagen zur herstellung von bohrungen in leiterplatten. - Google Patents

Material fuer unterlagen zur herstellung von bohrungen in leiterplatten.

Info

Publication number
ATE11858T1
ATE11858T1 AT80303821T AT80303821T ATE11858T1 AT E11858 T1 ATE11858 T1 AT E11858T1 AT 80303821 T AT80303821 T AT 80303821T AT 80303821 T AT80303821 T AT 80303821T AT E11858 T1 ATE11858 T1 AT E11858T1
Authority
AT
Austria
Prior art keywords
core
backup material
circuit board
underlays
circuit boards
Prior art date
Application number
AT80303821T
Other languages
English (en)
Inventor
James P. Block
Original Assignee
Lcoa Laminating Company Of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lcoa Laminating Company Of America filed Critical Lcoa Laminating Company Of America
Application granted granted Critical
Publication of ATE11858T1 publication Critical patent/ATE11858T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • B23B35/005—Measures for preventing splittering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
AT80303821T 1980-10-28 1980-10-28 Material fuer unterlagen zur herstellung von bohrungen in leiterplatten. ATE11858T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP80303821A EP0050693B1 (de) 1980-10-28 1980-10-28 Material für Unterlagen zur Herstellung von Bohrungen in Leiterplatten

Publications (1)

Publication Number Publication Date
ATE11858T1 true ATE11858T1 (de) 1985-02-15

Family

ID=8187282

Family Applications (1)

Application Number Title Priority Date Filing Date
AT80303821T ATE11858T1 (de) 1980-10-28 1980-10-28 Material fuer unterlagen zur herstellung von bohrungen in leiterplatten.

Country Status (3)

Country Link
EP (1) EP0050693B1 (de)
AT (1) ATE11858T1 (de)
DE (1) DE3070174D1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6573251B2 (ja) * 2015-03-20 2019-09-11 セイコータイムシステム株式会社 孔開け装置
WO2021225051A1 (ja) * 2020-05-08 2021-11-11 三菱瓦斯化学株式会社 繊維強化複合材加工用補助テープ及び切削加工方法
EP4147810A4 (de) * 2020-05-08 2023-10-25 Mitsubishi Gas Chemical Company, Inc. Trägermaterial zur verarbeitung von faserverstärkten verbundstoffen und bearbeitungsverfahren
CN117799008A (zh) * 2024-01-19 2024-04-02 萍乡市联锦成科技有限公司 一种高密度互连印制电路板的压合开孔设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1625061A (en) * 1925-02-19 1927-04-19 Philip H Trout Welded composite corrugated sheet
US2258858A (en) * 1939-03-15 1941-10-14 Budd Edward G Mfg Co Sheathing
US2963128A (en) * 1958-04-21 1960-12-06 Thompson Ramo Wooldridge Inc Sandwich-type structural element
US3696452A (en) * 1970-03-25 1972-10-10 Dow Chemical Co Hull construction for vessels and the like
US3719113A (en) * 1970-12-03 1973-03-06 Gerber Garment Technology Inc Penetrable bed used for cutting sheet material and method for treating same
US3781124A (en) * 1972-02-22 1973-12-25 Domtar Ltd Paper plug removal from drilled reams
US4019826A (en) * 1973-06-18 1977-04-26 Lcoa Laminating Company Of America Method for drilling circuit boards

Also Published As

Publication number Publication date
DE3070174D1 (en) 1985-03-28
EP0050693A2 (de) 1982-05-05
EP0050693B1 (de) 1985-02-13
EP0050693A3 (en) 1982-08-04

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee