ATE120069T1 - Verfahren zur orientierung mindestens eines auf einer leiterplatte aufgesetzten elektronischen bauelementes. - Google Patents
Verfahren zur orientierung mindestens eines auf einer leiterplatte aufgesetzten elektronischen bauelementes.Info
- Publication number
- ATE120069T1 ATE120069T1 AT91120661T AT91120661T ATE120069T1 AT E120069 T1 ATE120069 T1 AT E120069T1 AT 91120661 T AT91120661 T AT 91120661T AT 91120661 T AT91120661 T AT 91120661T AT E120069 T1 ATE120069 T1 AT E120069T1
- Authority
- AT
- Austria
- Prior art keywords
- circuit board
- printed
- electronic component
- board
- orientation
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 230000000717 retained effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K10/00—Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Credit Cards Or The Like (AREA)
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9015313A FR2670352B1 (fr) | 1990-12-06 | 1990-12-06 | Procede d'orientation d'au moins un composant electronique place sur une carte de circuit imprime. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE120069T1 true ATE120069T1 (de) | 1995-04-15 |
Family
ID=9402979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT91120661T ATE120069T1 (de) | 1990-12-06 | 1991-12-02 | Verfahren zur orientierung mindestens eines auf einer leiterplatte aufgesetzten elektronischen bauelementes. |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0489384B1 (de) |
| KR (1) | KR920014386A (de) |
| AT (1) | ATE120069T1 (de) |
| DE (1) | DE69108190T2 (de) |
| ES (1) | ES2071894T3 (de) |
| FR (1) | FR2670352B1 (de) |
| PT (1) | PT99692B (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2723500B1 (fr) * | 1994-08-03 | 1996-09-20 | Sagem | Carte electronique de circuit imprime. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2061623A (en) * | 1979-10-23 | 1981-05-13 | Tektronix Inc | Interconnecting conductive paths between a main circuit board and adjacent circuit boards |
| GB2160366B (en) * | 1984-06-15 | 1987-09-09 | Kenton Lab Limited | A printed circuit board |
| FR2626999B1 (fr) * | 1988-02-05 | 1993-08-27 | Jaeger | Dispositif comprenant un element d'affichage passif transmissif notamment pour montre electronique de vehicule automobile |
-
1990
- 1990-12-06 FR FR9015313A patent/FR2670352B1/fr not_active Expired - Fee Related
-
1991
- 1991-12-02 ES ES91120661T patent/ES2071894T3/es not_active Expired - Lifetime
- 1991-12-02 DE DE69108190T patent/DE69108190T2/de not_active Expired - Fee Related
- 1991-12-02 EP EP91120661A patent/EP0489384B1/de not_active Expired - Lifetime
- 1991-12-02 AT AT91120661T patent/ATE120069T1/de not_active IP Right Cessation
- 1991-12-05 PT PT99692A patent/PT99692B/pt not_active IP Right Cessation
- 1991-12-06 KR KR1019910022317A patent/KR920014386A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| PT99692B (pt) | 1999-02-26 |
| FR2670352B1 (fr) | 1994-04-01 |
| PT99692A (pt) | 1994-01-31 |
| EP0489384A3 (en) | 1993-02-24 |
| KR920014386A (ko) | 1992-07-30 |
| EP0489384A2 (de) | 1992-06-10 |
| EP0489384B1 (de) | 1995-03-15 |
| ES2071894T3 (es) | 1995-07-01 |
| DE69108190D1 (de) | 1995-04-20 |
| FR2670352A1 (fr) | 1992-06-12 |
| DE69108190T2 (de) | 1995-08-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification | ||
| REN | Ceased due to non-payment of the annual fee |