ATE120069T1 - Verfahren zur orientierung mindestens eines auf einer leiterplatte aufgesetzten elektronischen bauelementes. - Google Patents

Verfahren zur orientierung mindestens eines auf einer leiterplatte aufgesetzten elektronischen bauelementes.

Info

Publication number
ATE120069T1
ATE120069T1 AT91120661T AT91120661T ATE120069T1 AT E120069 T1 ATE120069 T1 AT E120069T1 AT 91120661 T AT91120661 T AT 91120661T AT 91120661 T AT91120661 T AT 91120661T AT E120069 T1 ATE120069 T1 AT E120069T1
Authority
AT
Austria
Prior art keywords
circuit board
printed
electronic component
board
orientation
Prior art date
Application number
AT91120661T
Other languages
English (en)
Inventor
Bernard Boin
Philippe Benard Michel Lebedel
Denis Christian Henri Bellier
Original Assignee
Moulinex Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moulinex Sa filed Critical Moulinex Sa
Application granted granted Critical
Publication of ATE120069T1 publication Critical patent/ATE120069T1/de

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K10/00Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/0909Preformed cutting or breaking line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10477Inverted
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Liquid Crystal (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
AT91120661T 1990-12-06 1991-12-02 Verfahren zur orientierung mindestens eines auf einer leiterplatte aufgesetzten elektronischen bauelementes. ATE120069T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9015313A FR2670352B1 (fr) 1990-12-06 1990-12-06 Procede d'orientation d'au moins un composant electronique place sur une carte de circuit imprime.

Publications (1)

Publication Number Publication Date
ATE120069T1 true ATE120069T1 (de) 1995-04-15

Family

ID=9402979

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91120661T ATE120069T1 (de) 1990-12-06 1991-12-02 Verfahren zur orientierung mindestens eines auf einer leiterplatte aufgesetzten elektronischen bauelementes.

Country Status (7)

Country Link
EP (1) EP0489384B1 (de)
KR (1) KR920014386A (de)
AT (1) ATE120069T1 (de)
DE (1) DE69108190T2 (de)
ES (1) ES2071894T3 (de)
FR (1) FR2670352B1 (de)
PT (1) PT99692B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2723500B1 (fr) * 1994-08-03 1996-09-20 Sagem Carte electronique de circuit imprime.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2061623A (en) * 1979-10-23 1981-05-13 Tektronix Inc Interconnecting conductive paths between a main circuit board and adjacent circuit boards
GB2160366B (en) * 1984-06-15 1987-09-09 Kenton Lab Limited A printed circuit board
FR2626999B1 (fr) * 1988-02-05 1993-08-27 Jaeger Dispositif comprenant un element d'affichage passif transmissif notamment pour montre electronique de vehicule automobile

Also Published As

Publication number Publication date
PT99692B (pt) 1999-02-26
FR2670352B1 (fr) 1994-04-01
PT99692A (pt) 1994-01-31
EP0489384A3 (en) 1993-02-24
KR920014386A (ko) 1992-07-30
EP0489384A2 (de) 1992-06-10
EP0489384B1 (de) 1995-03-15
ES2071894T3 (es) 1995-07-01
DE69108190D1 (de) 1995-04-20
FR2670352A1 (fr) 1992-06-12
DE69108190T2 (de) 1995-08-03

Similar Documents

Publication Publication Date Title
DE68915833D1 (de) Abgeschirmter elektrischer Verbinder zur Montage auf gedruckte Schaltungsplatten.
EP0854549A3 (de) Oberflächenmontierbarer Verbinder mit integrierter Leiterplattenanordnung
ATE166495T1 (de) Verbinderblock
EP0394588A3 (de) Lötstift
DE69410575D1 (de) Elektrische Verbinderanordnung zum Montieren auf gedruckte Leiterplatten
EP0344793A3 (en) Device for mounting and/or soldering or gluing electronic components, particularly smd-components on printed circuit boards
EP0126164A4 (de) Verfahren zum verbinden doppelseitiger schaltungen.
ES2056267T3 (es) Aparato de ajuste capacitivo unitario.
FR2652703B1 (fr) Procede de montage d'un composant electronique sur une carte de circuit imprime.
GB2261121A (en) Electrical interconnect apparatus
ATE120069T1 (de) Verfahren zur orientierung mindestens eines auf einer leiterplatte aufgesetzten elektronischen bauelementes.
EP0524812A3 (de) Verfahren und Vorrichtung zur Befestigung eines Geräts auf einer Leiterplatte
ATE268452T1 (de) Lampenanordnung und zugehöriges testverfahren
ATE111682T1 (de) Verfahren und anordnung zum auflöten von oberflächenbefestigbaren bausteinen auf leiterplatten.
EP0763843A3 (de) Elektrisches Bauelement, insbesondere relais, und Verfahren zu dessen Einbau in eine Leiterplatte
DE50012680D1 (de) Zur Montage auf eine Leiterplatte ausgelegtes Bauteil
JPH04174979A (ja) プリント配線基板
KR910007302Y1 (ko) 전자부품 내장구조
JPS5943651Y2 (ja) 印刷配線基板
DE59204251D1 (de) Lötsystem zum Auflöten von oberflächenbefestigbaren Bauteilen auf Leiterplatten.
FR2556551B1 (fr) Dispositif d'interconnexion electrique de cartes de circuit imprime
JPH06252526A (ja) プリント基板装置
KR970058433A (ko) 양면 대응이 가능한 플렉시블 인쇄회로기판
JPS649687A (en) Printed wiring board
IT8667195A1 (it) Metodo per montare parti elettroniche su predeterminate posizioni di un pannello di circuito stampato.

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee