ATE120806T1 - Verfahren zum beschichten von substraten mit verbindungen auf siliziumbasis. - Google Patents
Verfahren zum beschichten von substraten mit verbindungen auf siliziumbasis.Info
- Publication number
- ATE120806T1 ATE120806T1 AT90917735T AT90917735T ATE120806T1 AT E120806 T1 ATE120806 T1 AT E120806T1 AT 90917735 T AT90917735 T AT 90917735T AT 90917735 T AT90917735 T AT 90917735T AT E120806 T1 ATE120806 T1 AT E120806T1
- Authority
- AT
- Austria
- Prior art keywords
- silicon
- based compounds
- coating substrates
- sputtering
- troublesome
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title abstract 2
- 239000002210 silicon-based material Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 238000005546 reactive sputtering Methods 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/433,690 US5047131A (en) | 1989-11-08 | 1989-11-08 | Method for coating substrates with silicon based compounds |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE120806T1 true ATE120806T1 (de) | 1995-04-15 |
Family
ID=23721176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT90917735T ATE120806T1 (de) | 1989-11-08 | 1990-11-07 | Verfahren zum beschichten von substraten mit verbindungen auf siliziumbasis. |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5047131A (de) |
| EP (1) | EP0502068B1 (de) |
| JP (1) | JP3164364B2 (de) |
| KR (1) | KR100199663B1 (de) |
| AT (1) | ATE120806T1 (de) |
| AU (1) | AU631710B2 (de) |
| CA (1) | CA2069329C (de) |
| DE (1) | DE69018479T2 (de) |
| DK (1) | DK0502068T3 (de) |
| ES (1) | ES2070343T3 (de) |
| WO (1) | WO1991007519A1 (de) |
Families Citing this family (103)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5377045A (en) * | 1990-05-10 | 1994-12-27 | The Boc Group, Inc. | Durable low-emissivity solar control thin film coating |
| BE1003701A3 (fr) * | 1990-06-08 | 1992-05-26 | Saint Roch Glaceries | Cathode rotative. |
| US5427665A (en) * | 1990-07-11 | 1995-06-27 | Leybold Aktiengesellschaft | Process and apparatus for reactive coating of a substrate |
| CA2089149C (en) * | 1990-08-10 | 2002-11-26 | Eric R. Dickey | Shielding for arc suppression in rotating magnetron sputtering systems |
| US5106474A (en) * | 1990-11-21 | 1992-04-21 | Viratec Thin Films, Inc. | Anode structures for magnetron sputtering apparatus |
| US5171411A (en) * | 1991-05-21 | 1992-12-15 | The Boc Group, Inc. | Rotating cylindrical magnetron structure with self supporting zinc alloy target |
| US5364518A (en) * | 1991-05-28 | 1994-11-15 | Leybold Aktiengesellschaft | Magnetron cathode for a rotating target |
| JPH0586462A (ja) * | 1991-06-28 | 1993-04-06 | Mitsubishi Materials Corp | スパツタリング用ターゲツト及びその製造方法 |
| GB9121665D0 (en) * | 1991-10-11 | 1991-11-27 | Boc Group Plc | Sputtering processes and apparatus |
| TW221703B (de) * | 1992-03-04 | 1994-03-11 | Boc Group Inc | |
| BE1007067A3 (nl) * | 1992-07-15 | 1995-03-07 | Emiel Vanderstraeten Besloten | Sputterkathode en werkwijze voor het vervaardigen van deze kathode. |
| US5270248A (en) * | 1992-08-07 | 1993-12-14 | Mobil Solar Energy Corporation | Method for forming diffusion junctions in solar cell substrates |
| US5946013A (en) * | 1992-12-22 | 1999-08-31 | Canon Kabushiki Kaisha | Ink jet head having a protective layer with a controlled argon content |
| US5425860A (en) * | 1993-04-07 | 1995-06-20 | The Regents Of The University Of California | Pulsed energy synthesis and doping of silicon carbide |
| CA2120875C (en) * | 1993-04-28 | 1999-07-06 | The Boc Group, Inc. | Durable low-emissivity solar control thin film coating |
| CA2123479C (en) * | 1993-07-01 | 1999-07-06 | Peter A. Sieck | Anode structure for magnetron sputtering systems |
| US5403458A (en) * | 1993-08-05 | 1995-04-04 | Guardian Industries Corp. | Sputter-coating target and method of use |
| FR2714917B1 (fr) * | 1994-01-07 | 1996-03-01 | Pechiney Recherche | Bande à base d'aluminium revêtue, résistant à la corrosion et déformable, procédé d'obtention et applications. |
| US5616225A (en) * | 1994-03-23 | 1997-04-01 | The Boc Group, Inc. | Use of multiple anodes in a magnetron for improving the uniformity of its plasma |
| US5521765A (en) | 1994-07-07 | 1996-05-28 | The Boc Group, Inc. | Electrically-conductive, contrast-selectable, contrast-improving filter |
| US5510155A (en) * | 1994-09-06 | 1996-04-23 | Becton, Dickinson And Company | Method to reduce gas transmission |
| FR2728559B1 (fr) * | 1994-12-23 | 1997-01-31 | Saint Gobain Vitrage | Substrats en verre revetus d'un empilement de couches minces a proprietes de reflexion dans l'infrarouge et/ou dans le domaine du rayonnement solaire |
| FR2730990B1 (fr) * | 1995-02-23 | 1997-04-04 | Saint Gobain Vitrage | Substrat transparent a revetement anti-reflets |
| EP0822996B1 (de) * | 1995-04-25 | 2003-07-02 | VON ARDENNE ANLAGENTECHNIK GmbH | Sputtersystem mit zylindrisch rotierender mit wechselstrom gespeister magnetron |
| DE19615242A1 (de) * | 1996-04-18 | 1997-10-23 | Daimler Benz Ag | Verfahren zur Herstellung von Schichtsystemen auf Kunststoffoberflächen |
| TW347369B (en) * | 1996-12-17 | 1998-12-11 | Asahi Glass Co Ltd | Organic substrate provided with a light absorptive antireflection film and process for production |
| PL181650B1 (pl) | 1996-12-30 | 2001-08-31 | Jan Kuklinski | Uklad optyczny, przeksztalcajacy promieniowanie ultrafioletowe PL PL |
| US6753584B1 (en) * | 1997-08-21 | 2004-06-22 | Micron Technology, Inc. | Antireflective coating layer |
| US6074730A (en) * | 1997-12-31 | 2000-06-13 | The Boc Group, Inc. | Broad-band antireflection coating having four sputtered layers |
| US6391400B1 (en) | 1998-04-08 | 2002-05-21 | Thomas A. Russell | Thermal control films suitable for use in glazing |
| US6375814B1 (en) * | 1998-04-16 | 2002-04-23 | Sinvaco N.V. | Magnetron with parallel race track and modified end portions thereof |
| US6660365B1 (en) | 1998-12-21 | 2003-12-09 | Cardinal Cg Company | Soil-resistant coating for glass surfaces |
| US6974629B1 (en) * | 1999-08-06 | 2005-12-13 | Cardinal Cg Company | Low-emissivity, soil-resistant coating for glass surfaces |
| US6964731B1 (en) * | 1998-12-21 | 2005-11-15 | Cardinal Cg Company | Soil-resistant coating for glass surfaces |
| JP2000239827A (ja) * | 1998-12-22 | 2000-09-05 | Bridgestone Corp | 積層構造体及びその製造方法 |
| US6352626B1 (en) | 1999-04-19 | 2002-03-05 | Von Zweck Heimart | Sputter ion source for boron and other targets |
| MXPA01011771A (es) | 1999-05-18 | 2002-11-04 | Cardinal Cg Co | Recubrimientos duros, resistentes a rayaduras para sustratos. |
| ATE383456T1 (de) | 1999-10-13 | 2008-01-15 | Agc Ceramics Co Ltd | Sputtertarget, vorbereitungsverfahren dafür und filmherstellendes verfahren |
| US6413645B1 (en) | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
| US20100330748A1 (en) | 1999-10-25 | 2010-12-30 | Xi Chu | Method of encapsulating an environmentally sensitive device |
| US6866901B2 (en) | 1999-10-25 | 2005-03-15 | Vitex Systems, Inc. | Method for edge sealing barrier films |
| US7198832B2 (en) | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
| US6623861B2 (en) | 2001-04-16 | 2003-09-23 | Battelle Memorial Institute | Multilayer plastic substrates |
| US6749813B1 (en) | 2000-03-05 | 2004-06-15 | 3M Innovative Properties Company | Fluid handling devices with diamond-like films |
| US6436252B1 (en) | 2000-04-07 | 2002-08-20 | Surface Engineered Products Corp. | Method and apparatus for magnetron sputtering |
| US6497803B2 (en) * | 2000-05-31 | 2002-12-24 | Isoflux, Inc. | Unbalanced plasma generating apparatus having cylindrical symmetry |
| WO2002038826A1 (en) * | 2000-11-09 | 2002-05-16 | Viratec Thin Films, Inc. | Alternating current rotatable sputter cathode |
| US7399385B2 (en) * | 2001-06-14 | 2008-07-15 | Tru Vue, Inc. | Alternating current rotatable sputter cathode |
| US6589657B2 (en) | 2001-08-31 | 2003-07-08 | Von Ardenne Anlagentechnik Gmbh | Anti-reflection coatings and associated methods |
| US7106939B2 (en) * | 2001-09-19 | 2006-09-12 | 3M Innovative Properties Company | Optical and optoelectronic articles |
| US6736948B2 (en) * | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
| TWI259525B (en) * | 2002-03-29 | 2006-08-01 | Ritek Corp | Method of fabricating multi-layer mirror |
| US8808457B2 (en) | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
| US8900366B2 (en) | 2002-04-15 | 2014-12-02 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
| AU2003304125A1 (en) * | 2002-12-18 | 2004-12-03 | Cardinal Cg Company | Plasma-enhanced film deposition |
| US20040200418A1 (en) * | 2003-01-03 | 2004-10-14 | Klaus Hartig | Plasma spray systems and methods of uniformly coating rotary cylindrical targets |
| US20040129561A1 (en) * | 2003-01-07 | 2004-07-08 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron magnetic array mid span support |
| US20050051422A1 (en) * | 2003-02-21 | 2005-03-10 | Rietzel James G. | Cylindrical magnetron with self cleaning target |
| US7014741B2 (en) * | 2003-02-21 | 2006-03-21 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron with self cleaning target |
| US7510913B2 (en) | 2003-04-11 | 2009-03-31 | Vitex Systems, Inc. | Method of making an encapsulated plasma sensitive device |
| US7648925B2 (en) | 2003-04-11 | 2010-01-19 | Vitex Systems, Inc. | Multilayer barrier stacks and methods of making multilayer barrier stacks |
| WO2005063646A1 (en) | 2003-12-22 | 2005-07-14 | Cardinal Cg Company | Graded photocatalytic coatings |
| US7695590B2 (en) | 2004-03-26 | 2010-04-13 | Applied Materials, Inc. | Chemical vapor deposition plasma reactor having plural ion shower grids |
| US20050224343A1 (en) * | 2004-04-08 | 2005-10-13 | Richard Newcomb | Power coupling for high-power sputtering |
| EP1765740B1 (de) | 2004-07-12 | 2007-11-07 | Cardinal CG Company | Wartungsarme beschichtungen |
| US7767561B2 (en) | 2004-07-20 | 2010-08-03 | Applied Materials, Inc. | Plasma immersion ion implantation reactor having an ion shower grid |
| US8058156B2 (en) | 2004-07-20 | 2011-11-15 | Applied Materials, Inc. | Plasma immersion ion implantation reactor having multiple ion shower grids |
| US20060049043A1 (en) * | 2004-08-17 | 2006-03-09 | Matuska Neal W | Magnetron assembly |
| US20060065524A1 (en) * | 2004-09-30 | 2006-03-30 | Richard Newcomb | Non-bonded rotatable targets for sputtering |
| US20060096855A1 (en) * | 2004-11-05 | 2006-05-11 | Richard Newcomb | Cathode arrangement for atomizing a rotatable target pipe |
| US8092660B2 (en) | 2004-12-03 | 2012-01-10 | Cardinal Cg Company | Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films |
| US7923114B2 (en) | 2004-12-03 | 2011-04-12 | Cardinal Cg Company | Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films |
| US20060278519A1 (en) * | 2005-06-10 | 2006-12-14 | Leszek Malaszewski | Adaptable fixation for cylindrical magnetrons |
| US20060278521A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for controlling ion density and energy using modulated power signals |
| US20060278524A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for modulating power signals to control sputtering |
| US7767498B2 (en) | 2005-08-25 | 2010-08-03 | Vitex Systems, Inc. | Encapsulated devices and method of making |
| US7842355B2 (en) * | 2005-11-01 | 2010-11-30 | Applied Materials, Inc. | System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties |
| US20070095281A1 (en) * | 2005-11-01 | 2007-05-03 | Stowell Michael W | System and method for power function ramping of microwave liner discharge sources |
| US8936702B2 (en) * | 2006-03-07 | 2015-01-20 | Micron Technology, Inc. | System and method for sputtering a tensile silicon nitride film |
| WO2007121211A2 (en) | 2006-04-11 | 2007-10-25 | Cardinal Cg Company | Photocatalytic coatings having improved low-maintenance properties |
| US7989094B2 (en) * | 2006-04-19 | 2011-08-02 | Cardinal Cg Company | Opposed functional coatings having comparable single surface reflectances |
| US20080011599A1 (en) | 2006-07-12 | 2008-01-17 | Brabender Dennis M | Sputtering apparatus including novel target mounting and/or control |
| EP1933391A1 (de) * | 2006-12-11 | 2008-06-18 | Applied Materials, Inc. | Verfahren zur Herstellung einer SiN:H-Schicht auf einem Substrat |
| KR20090009612A (ko) * | 2007-07-20 | 2009-01-23 | 엘지디스플레이 주식회사 | 스퍼터링을 통한 무기절연막 형성방법 |
| GB0715879D0 (en) * | 2007-08-15 | 2007-09-26 | Gencoa Ltd | Low impedance plasma |
| CA2664368A1 (en) | 2007-09-14 | 2009-03-19 | Cardinal Cg Company | Low-maintenance coating technology |
| US8652310B2 (en) * | 2008-07-24 | 2014-02-18 | Seagate Technology Llc | Trim magnets to adjust erosion rate of cylindrical sputter targets |
| US9184410B2 (en) | 2008-12-22 | 2015-11-10 | Samsung Display Co., Ltd. | Encapsulated white OLEDs having enhanced optical output |
| US9337446B2 (en) | 2008-12-22 | 2016-05-10 | Samsung Display Co., Ltd. | Encapsulated RGB OLEDs having enhanced optical output |
| US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
| TW201110831A (en) * | 2009-09-03 | 2011-03-16 | Chunghwa Picture Tubes Ltd | Plasma apparatus and method of fabricating nano-crystalline silicon thin film |
| JP5270505B2 (ja) * | 2009-10-05 | 2013-08-21 | 株式会社神戸製鋼所 | プラズマcvd装置 |
| WO2011056581A2 (en) | 2009-10-26 | 2011-05-12 | General Plasma, Inc. | Rotary magnetron magnet bar and apparatus containing the same for high target utilization |
| US8590338B2 (en) | 2009-12-31 | 2013-11-26 | Samsung Mobile Display Co., Ltd. | Evaporator with internal restriction |
| WO2011119922A1 (en) * | 2010-03-26 | 2011-09-29 | Waters Technologies Corporation | Chromatography apparatus having diffusion-bonded and surface-modified components |
| PL2661514T3 (pl) * | 2011-01-06 | 2020-11-16 | Bühler AG | Zespół magnetronowy i system rozpylania zawierający zespół magnetronowy |
| TWI598454B (zh) | 2012-09-04 | 2017-09-11 | 濺鍍零件公司 | 濺鍍設備 |
| US9312108B2 (en) | 2013-03-01 | 2016-04-12 | Sputtering Components, Inc. | Sputtering apparatus |
| US9418823B2 (en) | 2013-03-01 | 2016-08-16 | Sputtering Components, Inc. | Sputtering apparatus |
| WO2018093985A1 (en) | 2016-11-17 | 2018-05-24 | Cardinal Cg Company | Static-dissipative coating technology |
| WO2022008048A1 (en) | 2020-07-08 | 2022-01-13 | Toyota Motor Europe | Contaminated hydrogen gas composition and its use as a reference for hydrogen fuels |
| CN116802336B (zh) * | 2021-12-09 | 2025-11-21 | 株式会社爱发科 | 氮化硅膜的成膜方法、成膜装置及氮化硅膜 |
| JPWO2023132130A1 (de) * | 2022-01-07 | 2023-07-13 |
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-
1989
- 1989-11-08 US US07/433,690 patent/US5047131A/en not_active Expired - Lifetime
-
1990
- 1990-11-07 DE DE69018479T patent/DE69018479T2/de not_active Expired - Fee Related
- 1990-11-07 KR KR1019920701089A patent/KR100199663B1/ko not_active Expired - Fee Related
- 1990-11-07 AU AU68730/91A patent/AU631710B2/en not_active Ceased
- 1990-11-07 WO PCT/US1990/006459 patent/WO1991007519A1/en not_active Ceased
- 1990-11-07 CA CA002069329A patent/CA2069329C/en not_active Expired - Fee Related
- 1990-11-07 AT AT90917735T patent/ATE120806T1/de not_active IP Right Cessation
- 1990-11-07 EP EP90917735A patent/EP0502068B1/de not_active Expired - Lifetime
- 1990-11-07 DK DK90917735.4T patent/DK0502068T3/da active
- 1990-11-07 JP JP50051491A patent/JP3164364B2/ja not_active Expired - Fee Related
- 1990-11-07 ES ES90917735T patent/ES2070343T3/es not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| AU6873091A (en) | 1991-06-13 |
| CA2069329A1 (en) | 1991-05-09 |
| DE69018479T2 (de) | 1995-12-14 |
| JPH05501587A (ja) | 1993-03-25 |
| US5047131A (en) | 1991-09-10 |
| DE69018479D1 (de) | 1995-05-11 |
| CA2069329C (en) | 2001-01-09 |
| EP0502068B1 (de) | 1995-04-05 |
| DK0502068T3 (da) | 1995-06-19 |
| EP0502068A4 (en) | 1993-04-28 |
| KR100199663B1 (ko) | 1999-06-15 |
| ES2070343T3 (es) | 1995-06-01 |
| JP3164364B2 (ja) | 2001-05-08 |
| WO1991007519A1 (en) | 1991-05-30 |
| EP0502068A1 (de) | 1992-09-09 |
| AU631710B2 (en) | 1992-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification | ||
| REN | Ceased due to non-payment of the annual fee |