ATE125395T1 - Gitterartige steckerstift-anordnung für einen paketförmigen integrierten schaltkreis. - Google Patents

Gitterartige steckerstift-anordnung für einen paketförmigen integrierten schaltkreis.

Info

Publication number
ATE125395T1
ATE125395T1 AT89309262T AT89309262T ATE125395T1 AT E125395 T1 ATE125395 T1 AT E125395T1 AT 89309262 T AT89309262 T AT 89309262T AT 89309262 T AT89309262 T AT 89309262T AT E125395 T1 ATE125395 T1 AT E125395T1
Authority
AT
Austria
Prior art keywords
layer
pin ends
terminal pin
integrated circuit
substrate
Prior art date
Application number
AT89309262T
Other languages
English (en)
Inventor
Paul J Sokolovsky
John Hunter
James L Hayward
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of ATE125395T1 publication Critical patent/ATE125395T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT89309262T 1988-09-19 1989-09-12 Gitterartige steckerstift-anordnung für einen paketförmigen integrierten schaltkreis. ATE125395T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/245,501 US4916523A (en) 1988-09-19 1988-09-19 Electrical connections via unidirectional conductive elastomer for pin carrier outside lead bond

Publications (1)

Publication Number Publication Date
ATE125395T1 true ATE125395T1 (de) 1995-08-15

Family

ID=22926927

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89309262T ATE125395T1 (de) 1988-09-19 1989-09-12 Gitterartige steckerstift-anordnung für einen paketförmigen integrierten schaltkreis.

Country Status (5)

Country Link
US (1) US4916523A (de)
EP (1) EP0360485B1 (de)
JP (1) JP2711263B2 (de)
AT (1) ATE125395T1 (de)
DE (1) DE68923512T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824654A1 (de) * 1988-07-20 1990-02-01 Ibm Deutschland Elektronische baueinheit
US5338975A (en) * 1990-07-02 1994-08-16 General Electric Company High density interconnect structure including a spacer structure and a gap
US5431328A (en) 1994-05-06 1995-07-11 Industrial Technology Research Institute Composite bump flip chip bonding
US5393697A (en) * 1994-05-06 1995-02-28 Industrial Technology Research Institute Composite bump structure and methods of fabrication
US6365500B1 (en) 1994-05-06 2002-04-02 Industrial Technology Research Institute Composite bump bonding
US5707902A (en) * 1995-02-13 1998-01-13 Industrial Technology Research Institute Composite bump structure and methods of fabrication
TW441227B (en) 1995-05-26 2001-06-16 E Tec Ag Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board
CA2222049A1 (en) * 1995-05-26 1996-11-28 E-Tec Ag Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board
US6007348A (en) 1996-05-07 1999-12-28 Advanced Intercommunications Corporation Solder ball terminal
CH693478A5 (fr) 1996-05-10 2003-08-15 E Tec Ag Socle de connexion de deux composants électriques.
JP3420435B2 (ja) * 1996-07-09 2003-06-23 松下電器産業株式会社 基板の製造方法、半導体装置及び半導体装置の製造方法
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
US6456100B1 (en) 1998-01-20 2002-09-24 Micron Technology, Inc. Apparatus for attaching to a semiconductor
US6703640B1 (en) * 1998-01-20 2004-03-09 Micron Technology, Inc. Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge
US6256199B1 (en) 1999-10-01 2001-07-03 Intel Corporation Integrated circuit cartridge and method of fabricating the same
US6256202B1 (en) 2000-02-18 2001-07-03 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
US6367263B1 (en) 2000-05-31 2002-04-09 Intel Corporation Integrated circuit refrigeration device
US7411337B2 (en) * 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US7939934B2 (en) * 2005-03-16 2011-05-10 Tessera, Inc. Microelectronic packages and methods therefor
DE102006045928A1 (de) 2006-09-28 2008-04-03 Robert Bosch Gmbh Anschlusssystem mit außenliegender Leitungsführung an Wischermotorgehäusen
US8254142B2 (en) 2009-09-22 2012-08-28 Wintec Industries, Inc. Method of using conductive elastomer for electrical contacts in an assembly
US8593825B2 (en) * 2009-10-14 2013-11-26 Wintec Industries, Inc. Apparatus and method for vertically-structured passive components
US10103463B1 (en) 2017-09-28 2018-10-16 ColdQuanta, Inc. In-place clamping of pin-grid array

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE756130A (fr) * 1969-09-15 1971-03-15 Essex International Inc Combinaison interrupteur-coupe-circuit sensible a la pression
JPS5915376B2 (ja) * 1977-10-18 1984-04-09 信越ポリマ−株式会社 電子回路部品
US4616406A (en) * 1984-09-27 1986-10-14 Advanced Micro Devices, Inc. Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein
JPH0773117B2 (ja) * 1986-11-25 1995-08-02 株式会社東芝 半導体パッケ−ジ
JPH114361A (ja) * 1997-06-13 1999-01-06 Hitachi Ltd 画像情報処理方法とそれを利用したディジタル撮像装置

Also Published As

Publication number Publication date
EP0360485A2 (de) 1990-03-28
DE68923512D1 (de) 1995-08-24
EP0360485B1 (de) 1995-07-19
JPH02122557A (ja) 1990-05-10
JP2711263B2 (ja) 1998-02-10
US4916523A (en) 1990-04-10
DE68923512T2 (de) 1996-03-07
EP0360485A3 (de) 1991-07-17

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Legal Events

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