ATE126114T1 - Mit parylen beschichtetes weichlötpulver. - Google Patents

Mit parylen beschichtetes weichlötpulver.

Info

Publication number
ATE126114T1
ATE126114T1 AT93102754T AT93102754T ATE126114T1 AT E126114 T1 ATE126114 T1 AT E126114T1 AT 93102754 T AT93102754 T AT 93102754T AT 93102754 T AT93102754 T AT 93102754T AT E126114 T1 ATE126114 T1 AT E126114T1
Authority
AT
Austria
Prior art keywords
parylene
solder
solder powder
powder coated
soft solder
Prior art date
Application number
AT93102754T
Other languages
English (en)
Inventor
Richard Day Jenkinson
Michael William Sowa
Original Assignee
London Chemical Company Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by London Chemical Company Inc filed Critical London Chemical Company Inc
Application granted granted Critical
Publication of ATE126114T1 publication Critical patent/ATE126114T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Dental Preparations (AREA)
  • Powder Metallurgy (AREA)
  • Nonmetallic Welding Materials (AREA)
AT93102754T 1992-02-21 1993-02-22 Mit parylen beschichtetes weichlötpulver. ATE126114T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/839,581 US5272007A (en) 1992-02-21 1992-02-21 Solder powder coated with parylene

Publications (1)

Publication Number Publication Date
ATE126114T1 true ATE126114T1 (de) 1995-08-15

Family

ID=25280134

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93102754T ATE126114T1 (de) 1992-02-21 1993-02-22 Mit parylen beschichtetes weichlötpulver.

Country Status (13)

Country Link
US (2) US5272007A (de)
EP (1) EP0556864B1 (de)
JP (1) JP3110582B2 (de)
KR (1) KR930017663A (de)
CN (1) CN1035363C (de)
AT (1) ATE126114T1 (de)
CA (1) CA2090072A1 (de)
DE (1) DE69300337T2 (de)
DK (1) DK0556864T3 (de)
ES (1) ES2075729T3 (de)
GR (1) GR3017675T3 (de)
MX (1) MX9300914A (de)
TW (1) TW279844B (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9312328D0 (en) * 1993-06-15 1993-07-28 Lexor Technology Limited A method of brazing
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung
US5674326A (en) * 1994-09-21 1997-10-07 Motorola, Inc. Solder paste
US5593504A (en) * 1995-04-26 1997-01-14 Church & Dwight Co., Inc. Method of cleaning solder pastes from a substrate with an aqueous cleaner
US5789068A (en) * 1995-06-29 1998-08-04 Fry's Metals, Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors
WO1997012718A1 (en) 1995-10-06 1997-04-10 Brown University Research Foundation Soldering methods and compositions
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US5778638A (en) * 1996-03-06 1998-07-14 Mitsubishi Gas Chemical Company, Inc. Process for preserving solder paste
JP3493101B2 (ja) * 1996-08-15 2004-02-03 三井金属鉱業株式会社 半田粉及びその製造方法、及びその半田粉を用いた半田ペースト
DE19731151C1 (de) 1997-07-21 1999-01-21 Degussa Lotpaste zum Hartlöten und Beschichten von Aluminium und Aluminiumlegierungen
DE19826756C2 (de) * 1998-06-15 2002-04-18 Juergen Schulze Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
JP4138965B2 (ja) * 1998-10-01 2008-08-27 三井金属鉱業株式会社 無鉛ハンダ粉及びその製造方法
US6054761A (en) * 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6326555B1 (en) 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6506448B1 (en) * 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
EP1232524A1 (de) * 1999-06-01 2002-08-21 Alpha Metals, Inc. Schutzbeschichtungsmethode von bga-legierungslot-bällen
US6488992B1 (en) 1999-08-18 2002-12-03 University Of Cincinnati Product having a thin film polymer coating and method of making
JP3910878B2 (ja) * 2002-05-13 2007-04-25 新光電気工業株式会社 導電性粉末付着装置及び導電性粉末付着方法
US8002905B2 (en) 2003-06-25 2011-08-23 Behr Gmbh & Co. Kg Fluxing agent for soldering metal components
TWI329534B (en) * 2003-07-09 2010-09-01 Fry Metals Inc Coating metal particles
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
DE10343655B4 (de) * 2003-09-20 2005-09-29 Elringklinger Ag Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit
DE10343652B4 (de) * 2003-09-20 2005-09-29 Elringklinger Ag Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit
US7163586B2 (en) * 2003-11-12 2007-01-16 Specialty Coating Systems, Inc. Vapor deposition apparatus
US20050239947A1 (en) * 2004-02-27 2005-10-27 Greenhill David A Polymeric silver layer
DE102004034815A1 (de) * 2004-07-19 2006-03-16 Behr Gmbh & Co. Kg Verfahren zur Herstellung von gefügten Werkstücken
JPWO2006030665A1 (ja) * 2004-09-13 2008-05-15 松下電器産業株式会社 半田ペーストおよびそれを用いた電子機器
US7455106B2 (en) * 2005-09-07 2008-11-25 Schlumberger Technology Corporation Polymer protective coated polymeric components for oilfield applications
US8388724B2 (en) * 2006-04-26 2013-03-05 Senju Metal Industry Co., Ltd. Solder paste
PL2370219T3 (pl) * 2008-11-21 2015-03-31 Henkel US IP LLC Powlekane ulegającym rozkładowi termicznemu polimerem proszki metali
US9682447B2 (en) * 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
EP2753442B1 (de) 2011-09-06 2019-10-30 Henkel IP & Holding GmbH Mit di- oder poly-funktionalen olefinen mit elektronenmangel überzogenes metallpulver für lötpasten
US8816371B2 (en) 2011-11-30 2014-08-26 Micron Technology, Inc. Coated color-converting particles and associated devices, systems, and methods
EP2886244A1 (de) * 2013-12-17 2015-06-24 Heraeus Deutschland GmbH & Co. KG Verfahren zur Befestigung eines Bauteils auf einem Substrat
WO2015146999A1 (ja) 2014-03-25 2015-10-01 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
JP5790862B1 (ja) * 2014-12-25 2015-10-07 千住金属工業株式会社 やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ
US10730150B2 (en) * 2017-08-07 2020-08-04 Honeywell International Inc. Flowable brazing compositions and methods of brazing metal articles together using the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE449016C (de) * 1927-09-03 Duplex Printing Press Company Maschine zum Giessen von Stereotypplatten
DE448016C (de) * 1925-02-05 1927-08-02 Pathe Cinema Anciens Etablisse Aufwickelvorrichtung fuer Kinematographenfilme
US3300332A (en) * 1966-02-07 1967-01-24 Union Carbide Corp Coated particulate material and method for producing same
US4225647B1 (en) * 1977-12-02 1995-05-09 Richard A Parent Articles having thin, continuous, impervious coatings
US4298407A (en) * 1980-08-04 1981-11-03 E. I. Du Pont De Nemours And Company Flux treated solder powder composition
US4419279A (en) * 1980-09-15 1983-12-06 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4818614A (en) * 1985-07-29 1989-04-04 Shiseido Company Ltd. Modified powder
US4758288A (en) * 1987-06-08 1988-07-19 Ronald T. Dodge Co. Encapsulated lithium granules and method of manufacture
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US5069972A (en) * 1988-09-12 1991-12-03 Versic Ronald J Moldable microcapsule that contains a high percentage of solid core material, and method of manufacture thereof
JPH04224683A (ja) * 1990-03-19 1992-08-13 Union Carbide Chem & Plast Co Inc 被覆基体の防食性を最適化する方法

Also Published As

Publication number Publication date
ES2075729T3 (es) 1995-10-01
TW279844B (de) 1996-07-01
DE69300337D1 (de) 1995-09-14
CN1035363C (zh) 1997-07-09
CA2090072A1 (en) 1993-08-22
JP3110582B2 (ja) 2000-11-20
GR3017675T3 (en) 1996-01-31
DK0556864T3 (da) 1995-09-25
US5328522A (en) 1994-07-12
DE69300337T2 (de) 1996-02-01
EP0556864B1 (de) 1995-08-09
KR930017663A (ko) 1993-09-20
US5272007A (en) 1993-12-21
MX9300914A (es) 1993-09-01
JPH067993A (ja) 1994-01-18
EP0556864A1 (de) 1993-08-25
CN1079929A (zh) 1993-12-29

Similar Documents

Publication Publication Date Title
DE69300337D1 (de) Mit Parylen beschichtetes Weichlötpulver.
IE811760L (en) Solder powder composition
GB2131831B (en) Copper alloy having high resistance to oxidation for use in leads of semiconductor devices and clad material containing said alloy
GB2243623B (en) Low-residue soldering flux containing rosin
DE69425224D1 (de) Zinn-wismuth-lötpaste und deren verwendung
IL79681A (en) Transition metal complexes of growth hormones and their prolonged release compositions
DE69405796D1 (de) Kinetische Zusammensetzung von Weichlotpaste
DE69212583D1 (de) Thermostabile, wasserlösliche Weichlötflussmittel und Paste
AU7793781A (en) Resistance welding circuit
GB2015037B (en) Low-hydrogen coated welding electrode
DE3469553D1 (en) Electrically conductive powder for mixing with cyanoacrylates and electrically conductive curable composition containing the same
PT76135A (en) Dental bonding agent composed of aluminum powder plus inert liquid organic carrier
AU578202B2 (en) Printed circuit boards having improved adhesion between solder mask and metal
DE3569217D1 (en) Soldering compositions, fluxes and methods of use
AU564117B2 (en) Internal oxidation of ag alloys
JPS5365219A (en) Silver solder alloy
JPS52134811A (en) Golden copper alloy for dental use
JPS52141489A (en) Elctrode coating composition* manufacture and electrode thereof
JPS5471749A (en) Soldering of easily evaporative element containing aluminium alloy without using flux
JPS54128459A (en) Phosphorrcontaining solder alloy and additive alloy therefor
PL250600A1 (en) Soft solder in the form of paste for soldering and tinning
JPS5314640A (en) Ultrasonic soldering solder
JPS5433848A (en) Solder flux for bonding nickellchromium alloy wire rod or foil
JPS54109048A (en) Solder flux for fe*ni*cr and alloy thereof
DK551485D0 (da) Metaloxidovertrukket kobberpulver

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee