ES2075729T3 - Polvo de aleacion de soldar revestido con parileno. - Google Patents

Polvo de aleacion de soldar revestido con parileno.

Info

Publication number
ES2075729T3
ES2075729T3 ES93102754T ES93102754T ES2075729T3 ES 2075729 T3 ES2075729 T3 ES 2075729T3 ES 93102754 T ES93102754 T ES 93102754T ES 93102754 T ES93102754 T ES 93102754T ES 2075729 T3 ES2075729 T3 ES 2075729T3
Authority
ES
Spain
Prior art keywords
parylene
solder
alloy powder
powder coated
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93102754T
Other languages
English (en)
Inventor
Richard Day Jenkinson
Michael William Sowa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LONDON CHEMICAL Co Inc
Original Assignee
LONDON CHEMICAL Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LONDON CHEMICAL Co Inc filed Critical LONDON CHEMICAL Co Inc
Application granted granted Critical
Publication of ES2075729T3 publication Critical patent/ES2075729T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Dental Preparations (AREA)
  • Powder Metallurgy (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

SE PRESENTAN POLVOS PARA SOLDADURA RECUBIERTOS CON UNA FINA CAPA DE PARILENO Y PASTAS DE SOLDADURA QUE CONTIENEN LOS POLVOS DE SOLDADURA RECUBIERTOS. LOS POLVOS DE SOLDADURA RECUBIERTOS PUEDEN EXHIBIR UN ALTO GRADO DE RESISTENCIA A LA OXIDACION Y A LAS REACCIONES CON EL FLUJO CONTENIDO EN LA PASTA DE SOLDADURA SIN INTERFERIR SUBSTANCIALMENTE CON LAS CARACTERISTICAS DE REFLUJO DE LA SOLDADURA.
ES93102754T 1992-02-21 1993-02-22 Polvo de aleacion de soldar revestido con parileno. Expired - Lifetime ES2075729T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/839,581 US5272007A (en) 1992-02-21 1992-02-21 Solder powder coated with parylene

Publications (1)

Publication Number Publication Date
ES2075729T3 true ES2075729T3 (es) 1995-10-01

Family

ID=25280134

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93102754T Expired - Lifetime ES2075729T3 (es) 1992-02-21 1993-02-22 Polvo de aleacion de soldar revestido con parileno.

Country Status (13)

Country Link
US (2) US5272007A (es)
EP (1) EP0556864B1 (es)
JP (1) JP3110582B2 (es)
KR (1) KR930017663A (es)
CN (1) CN1035363C (es)
AT (1) ATE126114T1 (es)
CA (1) CA2090072A1 (es)
DE (1) DE69300337T2 (es)
DK (1) DK0556864T3 (es)
ES (1) ES2075729T3 (es)
GR (1) GR3017675T3 (es)
MX (1) MX9300914A (es)
TW (1) TW279844B (es)

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GB9312328D0 (en) * 1993-06-15 1993-07-28 Lexor Technology Limited A method of brazing
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung
US5674326A (en) * 1994-09-21 1997-10-07 Motorola, Inc. Solder paste
US5593504A (en) * 1995-04-26 1997-01-14 Church & Dwight Co., Inc. Method of cleaning solder pastes from a substrate with an aqueous cleaner
US5789068A (en) * 1995-06-29 1998-08-04 Fry's Metals, Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors
EP0854768A1 (en) 1995-10-06 1998-07-29 Brown University Research Foundation Soldering methods and compositions
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US5778638A (en) * 1996-03-06 1998-07-14 Mitsubishi Gas Chemical Company, Inc. Process for preserving solder paste
JP3493101B2 (ja) * 1996-08-15 2004-02-03 三井金属鉱業株式会社 半田粉及びその製造方法、及びその半田粉を用いた半田ペースト
DE19731151C1 (de) 1997-07-21 1999-01-21 Degussa Lotpaste zum Hartlöten und Beschichten von Aluminium und Aluminiumlegierungen
DE19826756C2 (de) * 1998-06-15 2002-04-18 Juergen Schulze Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
JP4138965B2 (ja) * 1998-10-01 2008-08-27 三井金属鉱業株式会社 無鉛ハンダ粉及びその製造方法
US6054761A (en) 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6326555B1 (en) 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6506448B1 (en) * 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
JP2004500700A (ja) * 1999-06-01 2004-01-08 アルファ・メタルズ・インコーポレーテッド Ｂｇａハンダ合金球を保護コーティングするための方法
US6488992B1 (en) 1999-08-18 2002-12-03 University Of Cincinnati Product having a thin film polymer coating and method of making
JP3910878B2 (ja) * 2002-05-13 2007-04-25 新光電気工業株式会社 導電性粉末付着装置及び導電性粉末付着方法
CN100457374C (zh) 2003-06-25 2009-02-04 贝洱两合公司 用于金属部件钎焊的钎剂及其制造方法
TWI329534B (en) * 2003-07-09 2010-09-01 Fry Metals Inc Coating metal particles
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
DE10343655B4 (de) * 2003-09-20 2005-09-29 Elringklinger Ag Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit
DE10343652B4 (de) * 2003-09-20 2005-09-29 Elringklinger Ag Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit
US7163586B2 (en) * 2003-11-12 2007-01-16 Specialty Coating Systems, Inc. Vapor deposition apparatus
US20050239947A1 (en) * 2004-02-27 2005-10-27 Greenhill David A Polymeric silver layer
DE102004034815A1 (de) * 2004-07-19 2006-03-16 Behr Gmbh & Co. Kg Verfahren zur Herstellung von gefügten Werkstücken
US20070277909A1 (en) * 2004-09-13 2007-12-06 Norihito Tsukahara Solder Paste and Electronic Device Using Same
US7455106B2 (en) * 2005-09-07 2008-11-25 Schlumberger Technology Corporation Polymer protective coated polymeric components for oilfield applications
US8388724B2 (en) * 2006-04-26 2013-03-05 Senju Metal Industry Co., Ltd. Solder paste
JP5546551B2 (ja) * 2008-11-21 2014-07-09 ヘンケル コーポレイション 熱分解性ポリマー被覆金属粉末
US9682447B2 (en) 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
WO2013036347A1 (en) 2011-09-06 2013-03-14 Henkel Corporation Di-or poly-functional electron deficient olefins coated metal powders for solder pastes
US8816371B2 (en) 2011-11-30 2014-08-26 Micron Technology, Inc. Coated color-converting particles and associated devices, systems, and methods
EP2886244A1 (de) * 2013-12-17 2015-06-24 Heraeus Deutschland GmbH & Co. KG Verfahren zur Befestigung eines Bauteils auf einem Substrat
WO2015146999A1 (ja) 2014-03-25 2015-10-01 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
JP5790862B1 (ja) * 2014-12-25 2015-10-07 千住金属工業株式会社 やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ
US10730150B2 (en) * 2017-08-07 2020-08-04 Honeywell International Inc. Flowable brazing compositions and methods of brazing metal articles together using the same

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DE449016C (de) * 1927-09-03 Duplex Printing Press Company Maschine zum Giessen von Stereotypplatten
DE448016C (de) * 1925-02-05 1927-08-02 Pathe Cinema Anciens Etablisse Aufwickelvorrichtung fuer Kinematographenfilme
US3300332A (en) * 1966-02-07 1967-01-24 Union Carbide Corp Coated particulate material and method for producing same
US4225647B1 (en) * 1977-12-02 1995-05-09 Richard A Parent Articles having thin, continuous, impervious coatings
US4298407A (en) * 1980-08-04 1981-11-03 E. I. Du Pont De Nemours And Company Flux treated solder powder composition
US4419279A (en) * 1980-09-15 1983-12-06 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4818614A (en) * 1985-07-29 1989-04-04 Shiseido Company Ltd. Modified powder
US4758288A (en) * 1987-06-08 1988-07-19 Ronald T. Dodge Co. Encapsulated lithium granules and method of manufacture
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US5069972A (en) * 1988-09-12 1991-12-03 Versic Ronald J Moldable microcapsule that contains a high percentage of solid core material, and method of manufacture thereof
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Also Published As

Publication number Publication date
MX9300914A (es) 1993-09-01
JP3110582B2 (ja) 2000-11-20
JPH067993A (ja) 1994-01-18
CN1079929A (zh) 1993-12-29
KR930017663A (ko) 1993-09-20
EP0556864A1 (en) 1993-08-25
CA2090072A1 (en) 1993-08-22
EP0556864B1 (en) 1995-08-09
DE69300337D1 (de) 1995-09-14
TW279844B (es) 1996-07-01
US5328522A (en) 1994-07-12
DE69300337T2 (de) 1996-02-01
US5272007A (en) 1993-12-21
ATE126114T1 (de) 1995-08-15
GR3017675T3 (en) 1996-01-31
CN1035363C (zh) 1997-07-09
DK0556864T3 (da) 1995-09-25

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