ATE127269T1 - Dichtstoff für elektronische bauelemente und elektronische bauelemente. - Google Patents

Dichtstoff für elektronische bauelemente und elektronische bauelemente.

Info

Publication number
ATE127269T1
ATE127269T1 AT89307552T AT89307552T ATE127269T1 AT E127269 T1 ATE127269 T1 AT E127269T1 AT 89307552 T AT89307552 T AT 89307552T AT 89307552 T AT89307552 T AT 89307552T AT E127269 T1 ATE127269 T1 AT E127269T1
Authority
AT
Austria
Prior art keywords
electronic components
weight
sealant
composition
mercapto
Prior art date
Application number
AT89307552T
Other languages
English (en)
Inventor
Masato Togami
Toshio Kanoe
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Application granted granted Critical
Publication of ATE127269T1 publication Critical patent/ATE127269T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Details Of Resistors (AREA)
AT89307552T 1988-08-04 1989-07-25 Dichtstoff für elektronische bauelemente und elektronische bauelemente. ATE127269T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19474688 1988-08-04

Publications (1)

Publication Number Publication Date
ATE127269T1 true ATE127269T1 (de) 1995-09-15

Family

ID=16329541

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89307552T ATE127269T1 (de) 1988-08-04 1989-07-25 Dichtstoff für elektronische bauelemente und elektronische bauelemente.

Country Status (6)

Country Link
US (1) US5110861A (de)
EP (1) EP0353933B1 (de)
KR (1) KR900003290A (de)
AT (1) ATE127269T1 (de)
DE (1) DE68924019T2 (de)
HK (1) HK179195A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0704490B1 (de) * 1994-03-17 2002-11-20 Idemitsu Petrochemical Co., Ltd. Polyarylensulfidharzzusammensetzung
JPH09194614A (ja) * 1996-01-25 1997-07-29 Matsushita Electric Ind Co Ltd プラスチック成形体、およびプラスチック成形体の処理方法
US6042910A (en) * 1998-01-29 2000-03-28 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin composition
AU4857499A (en) * 1998-07-10 2000-02-01 Cookson Semiconductor Packaging Materials Liquid crystal polymer encapsulant
DE19833063A1 (de) * 1998-07-22 2000-02-03 Reinz Dichtungs Gmbh Lösemittelfreier applizierbarer wärmehärtender Beschichtungsstoff
US6162849A (en) * 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
KR100547123B1 (ko) 2003-06-19 2006-01-26 삼성전자주식회사 박형 트랜스
US8383716B2 (en) 2010-07-30 2013-02-26 E I Du Pont De Nemours And Company Polyester nanocomposites
JP2012092214A (ja) * 2010-10-27 2012-05-17 Sumitomo Chemical Co Ltd 液晶ポリエステル液状組成物
US20140080951A1 (en) 2012-09-19 2014-03-20 Chandrashekar Raman Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179537A (en) * 1978-01-04 1979-12-18 Rykowski John J Silane coupling agents
US4719250A (en) * 1984-06-18 1988-01-12 Hoechst Celanese Corporation Encapsulation of electronic components
EP0172624B1 (de) * 1984-06-27 1988-10-26 Nitto Electric Industrial Co., Ltd. Pulverüberzugsmischung auf Basis eines Epoxyharzes und eines Füllstoffs
JPS6169866A (ja) * 1984-09-12 1986-04-10 Polyplastics Co 複合材料組成物
JPH0717748B2 (ja) * 1986-12-19 1995-03-01 川崎製鉄株式会社 芳香族ポリエステルアミド
JPH0725996B2 (ja) * 1986-12-26 1995-03-22 ポリプラスチックス株式会社 ポリエステル樹脂組成物

Also Published As

Publication number Publication date
EP0353933A2 (de) 1990-02-07
HK179195A (en) 1995-12-01
EP0353933A3 (de) 1991-10-09
DE68924019D1 (de) 1995-10-05
EP0353933B1 (de) 1995-08-30
DE68924019T2 (de) 1996-04-18
US5110861A (en) 1992-05-05
KR900003290A (ko) 1990-03-26

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties