ATE127313T1 - Verfahren und vorrichtung zur herstellung von gedruckten leiterplatten. - Google Patents

Verfahren und vorrichtung zur herstellung von gedruckten leiterplatten.

Info

Publication number
ATE127313T1
ATE127313T1 AT87907893T AT87907893T ATE127313T1 AT E127313 T1 ATE127313 T1 AT E127313T1 AT 87907893 T AT87907893 T AT 87907893T AT 87907893 T AT87907893 T AT 87907893T AT E127313 T1 ATE127313 T1 AT E127313T1
Authority
AT
Austria
Prior art keywords
printed circuit
circuit boards
plates
release
producing printed
Prior art date
Application number
AT87907893T
Other languages
English (en)
Inventor
James A Johnston
Original Assignee
James A Johnston
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by James A Johnston filed Critical James A Johnston
Application granted granted Critical
Publication of ATE127313T1 publication Critical patent/ATE127313T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Networks Using Active Elements (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Drilling And Boring (AREA)
AT87907893T 1986-11-13 1987-11-10 Verfahren und vorrichtung zur herstellung von gedruckten leiterplatten. ATE127313T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92975386A 1986-11-13 1986-11-13

Publications (1)

Publication Number Publication Date
ATE127313T1 true ATE127313T1 (de) 1995-09-15

Family

ID=25458395

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87907893T ATE127313T1 (de) 1986-11-13 1987-11-10 Verfahren und vorrichtung zur herstellung von gedruckten leiterplatten.

Country Status (6)

Country Link
EP (1) EP0333744B1 (de)
JP (1) JPH0821765B2 (de)
AT (1) ATE127313T1 (de)
CA (1) CA1277430C (de)
DE (1) DE3751496T2 (de)
WO (1) WO1988003743A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3029487B2 (ja) * 1991-05-13 2000-04-04 住友ベークライト株式会社 銅張積層板の製造方法
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
DE19910805C2 (de) * 1999-03-11 2002-06-20 Lauffer Maschf Verfahren und Vorrichtung zum Stapeln eines Preßpaketes aus Trennlagen und zu laminierenden Folienpaketen
JP4761762B2 (ja) * 2004-12-03 2011-08-31 ソニーケミカル＆インフォメーションデバイス株式会社 多層配線基板の製造方法
CN102119074B (zh) * 2008-06-10 2015-07-15 三菱瓦斯化学株式会社 钻孔用盖板
JP4798308B2 (ja) * 2009-06-01 2011-10-19 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシート
US8784605B2 (en) 2010-06-02 2014-07-22 International Composites Technologies, Inc. Process for making lightweight laminated panel material for construction of cargo containers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1047020A (en) * 1963-06-28 1966-11-02 Formica Int Separation of laminated products
DE2034320A1 (en) * 1970-07-10 1972-01-13 Licentia Gmbh Coated aluminium release foil - for high pressure epoxide resin laminates
JPS5076565A (de) * 1973-11-12 1975-06-23
JPS5144263A (ja) * 1974-10-15 1976-04-15 Matsushita Electric Works Ltd Tasopurintohaisenbanyokinzokuhakuharisekisobanno seizoho
JPS5678199A (en) * 1979-11-30 1981-06-26 Fujitsu Ltd Method of laminating multilayer printed board
DE3032931C2 (de) * 1980-09-02 1982-07-29 Robert Bürkle GmbH & Co, 7290 Freudenstadt Verfahren und Anordnung zur Herstellung von Mehrschicht-Leiterplatten
FR2527956A1 (fr) * 1982-06-08 1983-12-09 Limours Const Meca Elect Elect Contreplaque de percage stratifiee et procede de fabrication et d'utilisation de celle-ci
JPS5998186A (ja) * 1982-11-29 1984-06-06 Oji Paper Co Ltd 剥離シ−ト
JPS60245683A (ja) * 1984-05-21 1985-12-05 Oji Paper Co Ltd 剥離シ−ト

Also Published As

Publication number Publication date
JPH02501871A (ja) 1990-06-21
WO1988003743A1 (en) 1988-05-19
DE3751496D1 (de) 1995-10-05
CA1277430C (en) 1990-12-04
EP0333744B1 (de) 1995-08-30
EP0333744A1 (de) 1989-09-27
DE3751496T2 (de) 1996-05-02
JPH0821765B2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EEIH Change in the person of patent owner
EEIH Change in the person of patent owner
EELA Cancelled due to lapse of time