ATE128318T1 - Chipausstosssystem für chipverbinder. - Google Patents

Chipausstosssystem für chipverbinder.

Info

Publication number
ATE128318T1
ATE128318T1 AT91301753T AT91301753T ATE128318T1 AT E128318 T1 ATE128318 T1 AT E128318T1 AT 91301753 T AT91301753 T AT 91301753T AT 91301753 T AT91301753 T AT 91301753T AT E128318 T1 ATE128318 T1 AT E128318T1
Authority
AT
Austria
Prior art keywords
die
chip
eject
head
connectors
Prior art date
Application number
AT91301753T
Other languages
English (en)
Inventor
Karl Schweitzer
Gerhard Zeindl
Original Assignee
F&K Delvotec Bondtechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F&K Delvotec Bondtechnik Gmbh filed Critical F&K Delvotec Bondtechnik Gmbh
Application granted granted Critical
Publication of ATE128318T1 publication Critical patent/ATE128318T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
AT91301753T 1990-03-16 1991-03-04 Chipausstosssystem für chipverbinder. ATE128318T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB909006035A GB9006035D0 (en) 1990-03-16 1990-03-16 Die eject system for die bonder

Publications (1)

Publication Number Publication Date
ATE128318T1 true ATE128318T1 (de) 1995-10-15

Family

ID=10672783

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91301753T ATE128318T1 (de) 1990-03-16 1991-03-04 Chipausstosssystem für chipverbinder.

Country Status (6)

Country Link
US (1) US5165521A (de)
EP (1) EP0447083B1 (de)
JP (1) JPH0774188A (de)
AT (1) ATE128318T1 (de)
DE (1) DE69113086T2 (de)
GB (1) GB9006035D0 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980063858A (ko) * 1996-12-06 1998-10-07 윌리엄비.켐플러 높은 종횡비를 갖는 집적 회로 칩 및 그 제조 방법
US6068104A (en) * 1997-11-26 2000-05-30 Jenoptik Aktiengesellschaft Device for securing a moving object at a destination
EP1310986A1 (de) 2001-11-08 2003-05-14 F & K Delvotec Bondtechnik GmbH Chipträgerplatten-Wechselmechanismus
US6926132B1 (en) * 2002-11-01 2005-08-09 Reagent Chemical & Research, Inc. Hold down assembly, with tubular container transport apparatus and methodology incorporating the same
DE10394243B4 (de) * 2003-06-02 2015-10-29 Amicra Microtechnologies Gmbh Bondvorrichtung und Bondverfahren
US7207430B2 (en) * 2004-10-25 2007-04-24 Ui Holding Company Vacuum gripper for handling small components
JP4210280B2 (ja) * 2005-09-01 2009-01-14 本田技研工業株式会社 ワークのクランプ装置
JP5941701B2 (ja) * 2012-02-23 2016-06-29 ファスフォードテクノロジ株式会社 ダイボンダ
JP6000322B2 (ja) * 2014-12-02 2016-09-28 富士機械製造株式会社 ダイ供給装置
US10281371B2 (en) 2016-06-10 2019-05-07 Met One Instruments, Inc. Sequential air sampler with filter cassette magazine
CN113571429B (zh) * 2021-09-28 2021-12-31 深圳市卓兴半导体科技有限公司 一种固晶方法及固晶机

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1344653A (en) * 1919-12-05 1920-06-29 Rosengren Anders Andersson Device for the feeding of bottles or other vessels to machines intended for treating them
DE1126703B (de) * 1957-09-14 1962-03-29 Gauthier Gmbh A Werkzeugmaschine mit um eine volle Umdrehung schaltbarem Werkstuecktraeger
US2956664A (en) * 1958-09-26 1960-10-18 Western Electric Co Ejector mechanisms
US3037269A (en) * 1959-04-22 1962-06-05 Western Electric Co Assembly apparatus
US3308921A (en) * 1965-02-15 1967-03-14 Leach Corp Carriage
US3378129A (en) * 1966-11-30 1968-04-16 Internat Machinery Corp Container handling system
GB1591158A (en) * 1976-11-09 1981-06-17 Cleamax Ltd High speed can handling mechanism
US4358920A (en) * 1980-06-04 1982-11-16 Lotte Co., Ltd. Apparatus for wrapping a sheet article
JPS59161040A (ja) * 1983-03-03 1984-09-11 Shinkawa Ltd インナ−リ−ドボンダ−
US4795518A (en) * 1984-02-17 1989-01-03 Burr-Brown Corporation Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus

Also Published As

Publication number Publication date
GB9006035D0 (en) 1990-05-09
DE69113086T2 (de) 1996-05-09
DE69113086D1 (de) 1995-10-26
JPH0774188A (ja) 1995-03-17
US5165521A (en) 1992-11-24
EP0447083B1 (de) 1995-09-20
EP0447083A1 (de) 1991-09-18

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee