ATE129000T1 - Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen. - Google Patents

Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen.

Info

Publication number
ATE129000T1
ATE129000T1 AT89902660T AT89902660T ATE129000T1 AT E129000 T1 ATE129000 T1 AT E129000T1 AT 89902660 T AT89902660 T AT 89902660T AT 89902660 T AT89902660 T AT 89902660T AT E129000 T1 ATE129000 T1 AT E129000T1
Authority
AT
Austria
Prior art keywords
pct
semiconductor devices
epoxy resin
sealing semiconductor
compositions
Prior art date
Application number
AT89902660T
Other languages
English (en)
Inventor
Myung Joong Kim
Ju Ok Song
Jung Ok Park
Original Assignee
Lucky Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucky Ltd filed Critical Lucky Ltd
Application granted granted Critical
Publication of ATE129000T1 publication Critical patent/ATE129000T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT89902660T 1988-02-15 1989-02-15 Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen. ATE129000T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880001572A KR910008560B1 (ko) 1988-02-15 1988-02-15 반도체 봉지용 에폭시 수지 조성물

Publications (1)

Publication Number Publication Date
ATE129000T1 true ATE129000T1 (de) 1995-10-15

Family

ID=19272256

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89902660T ATE129000T1 (de) 1988-02-15 1989-02-15 Epoxy-harzzusammensetzung zum abdichten von halbleiteranordnungen.

Country Status (7)

Country Link
US (1) US5041474A (de)
EP (1) EP0372017B1 (de)
JP (1) JPH066626B2 (de)
KR (1) KR910008560B1 (de)
AT (1) ATE129000T1 (de)
DE (1) DE68924521T2 (de)
WO (1) WO1989007627A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082880A (en) * 1988-09-12 1992-01-21 Mitsui Toatsu Chemicals, Inc. Semiconductor sealing composition containing epoxy resin and polymaleimide
JP2643518B2 (ja) * 1989-02-10 1997-08-20 東レ株式会社 プリプレグ
US5180627A (en) * 1990-11-30 1993-01-19 Ube Industries, Ltd. Heat resistant adhesive composition
KR960010844B1 (ko) * 1991-07-11 1996-08-09 제일모직 주식회사 내열성이 향상된 반도체소자 밀봉용 수지조성물
GB2279958B (en) * 1993-07-13 1997-11-05 Kobe Steel Europ Ltd Siloxane-imide block copolymers for toughening epoxy resins
US5736619A (en) * 1995-04-21 1998-04-07 Ameron International Corporation Phenolic resin compositions with improved impact resistance
US5708056A (en) * 1995-12-04 1998-01-13 Delco Electronics Corporation Hot melt epoxy encapsulation material
US6143423A (en) * 1997-04-07 2000-11-07 Shin-Etsu Chemical Co., Ltd. Flame retardant epoxy resin compositions
JP3723483B2 (ja) * 2001-10-16 2005-12-07 日本電気株式会社 電子部品装置
JP4793565B2 (ja) * 2005-03-24 2011-10-12 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
DE102005046642B4 (de) 2005-09-29 2019-08-22 Tib Chemicals Ag Verfahren zum Schutz der Innenflächen von metallischen Bauteilen gegen Korrosion
DE102005046641B4 (de) 2005-09-29 2019-08-22 Tib Chemicals Ag Verfahren zum Schutz der Aussenflächen von metallischen Werkstoffen gegen Korrosion durch Beschichtung mit härtbaren Mischungen auf der Basis von Glycidylverbindungen und aminischen Härtern
CN102108184B (zh) * 2009-12-24 2015-04-22 汉高股份有限及两合公司 一种环氧树脂组合物及其应用
JP6147561B2 (ja) * 2012-06-26 2017-06-14 株式会社日本触媒 硬化性樹脂組成物及び封止材
DE102017215298A1 (de) * 2017-09-01 2019-03-07 Robert Bosch Gmbh Verbundwerkstoff und Verfahren zu seiner Herstellung
CN110183822A (zh) * 2019-06-25 2019-08-30 苏州宇希新材料科技有限公司 一种高韧性环氧树脂组合物的制备方法
CN110183823A (zh) * 2019-06-25 2019-08-30 苏州宇希新材料科技有限公司 一种高韧性环氧树脂组合物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1528203A (en) * 1974-10-18 1978-10-11 Matsushita Electric Industrial Co Ltd Epoxy composition for encasing semi-conductor devices
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS56160054A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device
USRE32958E (en) * 1983-11-28 1989-06-20 Toray Silicone Co., Ltd. Thermosetting epoxy resin compositions
US4511701A (en) * 1984-02-27 1985-04-16 General Electric Company Heat curable epoxy resin compositions and epoxy resin curing agents
US4654382A (en) * 1984-06-08 1987-03-31 The Yokohama Rubber Co., Ltd. Adhesive compositions
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPS62101054A (ja) * 1985-10-28 1987-05-11 Nitto Electric Ind Co Ltd 半導体装置
JPS62210655A (ja) * 1986-03-11 1987-09-16 Nitto Electric Ind Co Ltd 半導体装置
JPS6337118A (ja) * 1986-07-31 1988-02-17 Sumitomo Chem Co Ltd 半導体封止用エポキシ樹脂組成物
FR2612195B1 (fr) * 1987-03-10 1989-06-16 Rhone Poulenc Chimie Polymeres thermostables a base de maleimides dont eventuellement un bismaleimide siloxane et de diamines siloxanes et leurs procedes de preparation
US4847154A (en) * 1987-05-29 1989-07-11 Basf Corporation Thermosetting resin systems containing secondary amine-terminated siloxane modifiers
US4808686A (en) * 1987-06-18 1989-02-28 General Electric Company Silicone-polyimides, and method for making
JPH01272619A (ja) * 1987-07-22 1989-10-31 Mitsubishi Gas Chem Co Inc エポキシ樹脂組成物
JPH01121319A (ja) * 1987-11-06 1989-05-15 Hitachi Ltd 半導体封止用エポキシ樹脂組成物及び樹脂封止型半導体装置

Also Published As

Publication number Publication date
EP0372017B1 (de) 1995-10-11
WO1989007627A1 (en) 1989-08-24
KR910008560B1 (ko) 1991-10-19
DE68924521T2 (de) 1996-05-30
EP0372017A4 (en) 1991-10-30
US5041474A (en) 1991-08-20
EP0372017A1 (de) 1990-06-13
JPH02500315A (ja) 1990-02-01
KR890013755A (ko) 1989-09-25
DE68924521D1 (de) 1995-11-16
JPH066626B2 (ja) 1994-01-26

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