ATE130703T1 - Verfahren zum ätzen von mindestens einer vertiefung in einem substrat und dadurch erhaltenes substrat. - Google Patents

Verfahren zum ätzen von mindestens einer vertiefung in einem substrat und dadurch erhaltenes substrat.

Info

Publication number
ATE130703T1
ATE130703T1 AT91906200T AT91906200T ATE130703T1 AT E130703 T1 ATE130703 T1 AT E130703T1 AT 91906200 T AT91906200 T AT 91906200T AT 91906200 T AT91906200 T AT 91906200T AT E130703 T1 ATE130703 T1 AT E130703T1
Authority
AT
Austria
Prior art keywords
etching
substrate
pct
cavities
bands
Prior art date
Application number
AT91906200T
Other languages
English (en)
Inventor
Lintel Harald T G Van
Original Assignee
Westonbridge Int Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westonbridge Int Ltd filed Critical Westonbridge Int Ltd
Application granted granted Critical
Publication of ATE130703T1 publication Critical patent/ATE130703T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/693—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H10P50/644—Anisotropic liquid etching

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Weting (AREA)
  • Micromachines (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Magnetic Heads (AREA)
AT91906200T 1990-03-16 1991-03-07 Verfahren zum ätzen von mindestens einer vertiefung in einem substrat und dadurch erhaltenes substrat. ATE130703T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH872/90A CH682528A5 (fr) 1990-03-16 1990-03-16 Procédé de réalisation par attaque chimique d'au moins une cavité dans un substrat et substrat obtenu par ce procédé.

Publications (1)

Publication Number Publication Date
ATE130703T1 true ATE130703T1 (de) 1995-12-15

Family

ID=4197137

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91906200T ATE130703T1 (de) 1990-03-16 1991-03-07 Verfahren zum ätzen von mindestens einer vertiefung in einem substrat und dadurch erhaltenes substrat.

Country Status (10)

Country Link
US (1) US5316618A (de)
EP (1) EP0472702B1 (de)
JP (1) JPH04506727A (de)
AT (1) ATE130703T1 (de)
AU (1) AU7475491A (de)
CA (1) CA2053859A1 (de)
CH (1) CH682528A5 (de)
DE (1) DE69114786T2 (de)
ES (1) ES2080304T3 (de)
WO (1) WO1991014281A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03292744A (ja) * 1990-01-24 1991-12-24 Toshiba Corp 化合物半導体装置およびその製造方法
DE4340590A1 (de) * 1992-12-03 1994-06-09 Hewlett Packard Co Grabenisolation unter Verwendung dotierter Seitenwände
JP3205103B2 (ja) * 1993-01-07 2001-09-04 松下電器産業株式会社 半導体装置の製造方法
US5436201A (en) * 1993-05-28 1995-07-25 Hughes Aircraft Company Dual etchant process, particularly for gate recess fabrication in GaAs MMIC chips
US5632908A (en) * 1995-02-01 1997-05-27 Lucent Technologies Inc. Method for making aligned features
US5632854A (en) * 1995-08-21 1997-05-27 Motorola, Inc. Pressure sensor method of fabrication
JP3734586B2 (ja) * 1997-03-05 2006-01-11 富士通株式会社 半導体装置及びその製造方法
DE19719862A1 (de) * 1997-05-12 1998-11-19 Fraunhofer Ges Forschung Mikromembranpumpe
US6479395B1 (en) * 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6623579B1 (en) * 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
TW480621B (en) * 2001-03-02 2002-03-21 Acer Comm & Multimedia Inc Method for producing high density chip
US20040073175A1 (en) * 2002-01-07 2004-04-15 Jacobson James D. Infusion system
WO2005074358A2 (en) * 2004-02-06 2005-08-18 KARMIC, Sàrl Microreplication of transitory-image relief pattern based optically variable devices
EP1756866A1 (de) * 2004-06-04 2007-02-28 Koninklijke Philips Electronics N.V. Verbessertes ätzverfahren
US7452748B1 (en) 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
FR2901635A1 (fr) * 2006-06-09 2007-11-30 Commissariat Energie Atomique Dispositif de connexion tridimensionnel dans un substrat
US8132775B2 (en) * 2008-04-29 2012-03-13 International Business Machines Corporation Solder mold plates used in packaging process and method of manufacturing solder mold plates
FR2985602B1 (fr) * 2012-01-05 2014-03-07 Commissariat Energie Atomique Procede de gravure d'un motif complexe
US9005463B2 (en) * 2013-05-29 2015-04-14 Micron Technology, Inc. Methods of forming a substrate opening
DE102019208023B4 (de) * 2019-05-31 2024-01-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum herstellen einer mikromechanischen vorrichtung, mikromechanisches ventil und mikropumpe

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844858A (en) * 1968-12-31 1974-10-29 Texas Instruments Inc Process for controlling the thickness of a thin layer of semiconductor material and semiconductor substrate
JPS5898927A (ja) * 1981-12-09 1983-06-13 Hitachi Ltd シリコン基板のエツチング方法
DE3225206C1 (de) * 1982-07-06 1983-10-27 Dr. Johannes Heidenhain Gmbh, 8225 Traunreut Verfahren zum einseitigen Ätzen von Platten
US4761210A (en) * 1985-09-30 1988-08-02 Siemens Aktiengesellschaft Method for generating structures in micro-mechanics
JP2514210B2 (ja) * 1987-07-23 1996-07-10 日産自動車株式会社 半導体基板のエッチング方法
US5024953A (en) * 1988-03-22 1991-06-18 Hitachi, Ltd. Method for producing opto-electric transducing element
US4899178A (en) * 1989-02-02 1990-02-06 Xerox Corporation Thermal ink jet printhead with internally fed ink reservoir
US4957592A (en) * 1989-12-27 1990-09-18 Xerox Corporation Method of using erodable masks to produce partially etched structures in ODE wafer structures

Also Published As

Publication number Publication date
ES2080304T3 (es) 1996-02-01
US5316618A (en) 1994-05-31
JPH04506727A (ja) 1992-11-19
EP0472702A1 (de) 1992-03-04
AU7475491A (en) 1991-10-10
WO1991014281A1 (en) 1991-09-19
CA2053859A1 (en) 1991-09-17
DE69114786D1 (de) 1996-01-04
DE69114786T2 (de) 1996-05-23
CH682528A5 (fr) 1993-09-30
EP0472702B1 (de) 1995-11-22

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Legal Events

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