ATE131994T1 - Elektronisches gehäuse zum dichten packen, bestehend aus gestapelten unterbaugruppen - Google Patents

Elektronisches gehäuse zum dichten packen, bestehend aus gestapelten unterbaugruppen

Info

Publication number
ATE131994T1
ATE131994T1 AT88901126T AT88901126T ATE131994T1 AT E131994 T1 ATE131994 T1 AT E131994T1 AT 88901126 T AT88901126 T AT 88901126T AT 88901126 T AT88901126 T AT 88901126T AT E131994 T1 ATE131994 T1 AT E131994T1
Authority
AT
Austria
Prior art keywords
sub
cavity
module
assemblies
electronic enclosure
Prior art date
Application number
AT88901126T
Other languages
English (en)
Inventor
Tiong C Go
Original Assignee
Irvine Sensors Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irvine Sensors Corp filed Critical Irvine Sensors Corp
Application granted granted Critical
Publication of ATE131994T1 publication Critical patent/ATE131994T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Packaging Frangible Articles (AREA)
  • Combinations Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Stackable Containers (AREA)
AT88901126T 1987-01-05 1988-01-04 Elektronisches gehäuse zum dichten packen, bestehend aus gestapelten unterbaugruppen ATE131994T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/000,562 US4764846A (en) 1987-01-05 1987-01-05 High density electronic package comprising stacked sub-modules

Publications (1)

Publication Number Publication Date
ATE131994T1 true ATE131994T1 (de) 1996-01-15

Family

ID=21692048

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88901126T ATE131994T1 (de) 1987-01-05 1988-01-04 Elektronisches gehäuse zum dichten packen, bestehend aus gestapelten unterbaugruppen

Country Status (6)

Country Link
US (1) US4764846A (de)
EP (1) EP0340241B1 (de)
JP (1) JP2664754B2 (de)
AT (1) ATE131994T1 (de)
DE (1) DE3854814T2 (de)
WO (1) WO1988005251A1 (de)

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Also Published As

Publication number Publication date
JP2664754B2 (ja) 1997-10-22
DE3854814D1 (de) 1996-02-01
WO1988005251A1 (en) 1988-07-14
EP0340241A1 (de) 1989-11-08
EP0340241B1 (de) 1995-12-20
JPH02501873A (ja) 1990-06-21
US4764846A (en) 1988-08-16
DE3854814T2 (de) 1996-05-15
EP0340241A4 (de) 1990-06-05

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