ATE13202T1 - Verfahren zur herstellung amorpher siliziumfilme. - Google Patents

Verfahren zur herstellung amorpher siliziumfilme.

Info

Publication number
ATE13202T1
ATE13202T1 AT81305111T AT81305111T ATE13202T1 AT E13202 T1 ATE13202 T1 AT E13202T1 AT 81305111 T AT81305111 T AT 81305111T AT 81305111 T AT81305111 T AT 81305111T AT E13202 T1 ATE13202 T1 AT E13202T1
Authority
AT
Austria
Prior art keywords
amorphous silicon
manufacture
silicon films
glow discharge
silicon compound
Prior art date
Application number
AT81305111T
Other languages
English (en)
Inventor
Yoshihiro Hamakawa
Yoshihisa Tawada
Original Assignee
Kanegafuchi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Ind filed Critical Kanegafuchi Chemical Ind
Application granted granted Critical
Publication of ATE13202T1 publication Critical patent/ATE13202T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Photovoltaic Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Silicon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT81305111T 1980-10-31 1981-10-28 Verfahren zur herstellung amorpher siliziumfilme. ATE13202T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP55154475A JPS5842126B2 (ja) 1980-10-31 1980-10-31 アモルファスシリコンの製造方法
EP81305111A EP0051449B1 (de) 1980-10-31 1981-10-28 Verfahren zur Herstellung amorpher Siliziumfilme

Publications (1)

Publication Number Publication Date
ATE13202T1 true ATE13202T1 (de) 1985-05-15

Family

ID=15585057

Family Applications (1)

Application Number Title Priority Date Filing Date
AT81305111T ATE13202T1 (de) 1980-10-31 1981-10-28 Verfahren zur herstellung amorpher siliziumfilme.

Country Status (5)

Country Link
US (1) US4410559A (de)
EP (1) EP0051449B1 (de)
JP (1) JPS5842126B2 (de)
AT (1) ATE13202T1 (de)
DE (1) DE3170422D1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0137043B1 (de) * 1983-01-11 1992-04-01 MITSUI TOATSU CHEMICALS, Inc. Herstellungsverfahren hydrogenierter amorpher silizium-dünnschicht-sonnenzellen
JPS60119784A (ja) * 1983-12-01 1985-06-27 Kanegafuchi Chem Ind Co Ltd 絶縁金属基板の製法およびそれに用いる装置
DE3429899A1 (de) * 1983-08-16 1985-03-07 Canon K.K., Tokio/Tokyo Verfahren zur bildung eines abscheidungsfilms
US4637938A (en) * 1983-08-19 1987-01-20 Energy Conversion Devices, Inc. Methods of using selective optical excitation in deposition processes and the detection of new compositions
US4544423A (en) * 1984-02-10 1985-10-01 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Amorphous silicon semiconductor and process for same
JPS60200523A (ja) * 1984-03-26 1985-10-11 Agency Of Ind Science & Technol シリコン薄膜の製造法
JPH07111957B2 (ja) * 1984-03-28 1995-11-29 圭弘 浜川 半導体の製法
JPS612420U (ja) * 1984-06-11 1986-01-09 株式会社 エ−スプレミアム ラジオ受信機付サンバイザ−
US4568614A (en) * 1984-06-27 1986-02-04 Energy Conversion Devices, Inc. Steel article having a disordered silicon oxide coating thereon and method of preparing the coating
JPS6116330U (ja) * 1984-06-29 1986-01-30 株式会社 大成マ−ク 帽子
NL8501769A (nl) * 1984-10-02 1986-05-01 Imec Interuniversitair Micro E Bipolaire heterojunctie-transistor en werkwijze voor de vervaardiging daarvan.
US4759947A (en) * 1984-10-08 1988-07-26 Canon Kabushiki Kaisha Method for forming deposition film using Si compound and active species from carbon and halogen compound
US4584427A (en) * 1984-10-22 1986-04-22 Atlantic Richfield Company Thin film solar cell with free tin on tin oxide transparent conductor
US4728528A (en) * 1985-02-18 1988-03-01 Canon Kabushiki Kaisha Process for forming deposited film
US4726963A (en) * 1985-02-19 1988-02-23 Canon Kabushiki Kaisha Process for forming deposited film
US4778692A (en) * 1985-02-20 1988-10-18 Canon Kabushiki Kaisha Process for forming deposited film
US4784874A (en) * 1985-02-20 1988-11-15 Canon Kabushiki Kaisha Process for forming deposited film
US5244698A (en) * 1985-02-21 1993-09-14 Canon Kabushiki Kaisha Process for forming deposited film
US4818563A (en) * 1985-02-21 1989-04-04 Canon Kabushiki Kaisha Process for forming deposited film
US4853251A (en) * 1985-02-22 1989-08-01 Canon Kabushiki Kaisha Process for forming deposited film including carbon as a constituent element
US4801468A (en) * 1985-02-25 1989-01-31 Canon Kabushiki Kaisha Process for forming deposited film
JP2537175B2 (ja) * 1985-03-27 1996-09-25 キヤノン株式会社 機能性堆積膜の製造装置
JPS62134936A (ja) * 1985-12-05 1987-06-18 アニコン・インコ−ポレ−テツド 腐食耐性をもつたウエ−フア−・ボ−ト及びその製造法
JPH0647727B2 (ja) * 1985-12-24 1994-06-22 キヤノン株式会社 堆積膜形成法
JPH084071B2 (ja) * 1985-12-28 1996-01-17 キヤノン株式会社 堆積膜形成法
GB2193976B (en) * 1986-03-19 1990-05-30 Gen Electric Plc Process for depositing a polysilicon film on a substrate
US4845043A (en) * 1987-04-23 1989-07-04 Catalano Anthony W Method for fabricating photovoltaic device having improved short wavelength photoresponse
DE3722198A1 (de) * 1987-07-04 1989-01-12 Semikron Elektronik Gmbh Verfahren zum herstellen von solarzellen
JP2692091B2 (ja) * 1987-10-31 1997-12-17 株式会社日本自動車部品総合研究所 炭化ケイ素半導体膜およびその製造方法
US4790883A (en) * 1987-12-18 1988-12-13 Porponth Sichanugrist Low light level solar cell
GB2267291B (en) * 1992-05-27 1995-02-01 Northern Telecom Ltd Plasma deposition process
GB2306510B (en) * 1995-11-02 1999-06-23 Univ Surrey Modification of metal surfaces
US6784361B2 (en) * 2000-09-20 2004-08-31 Bp Corporation North America Inc. Amorphous silicon photovoltaic devices
US7087536B2 (en) * 2004-09-01 2006-08-08 Applied Materials Silicon oxide gapfill deposition using liquid precursors
US20090208668A1 (en) * 2008-02-19 2009-08-20 Soo Young Choi Formation of clean interfacial thin film solar cells
JP2013503974A (ja) * 2009-09-05 2013-02-04 ジェネラル・プラズマ・インコーポレーテッド プラズマ化学気相成長装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3419761A (en) * 1965-10-11 1968-12-31 Ibm Method for depositing silicon nitride insulating films and electric devices incorporating such films
US3471396A (en) * 1967-04-10 1969-10-07 Ibm R.f. cathodic sputtering apparatus having an electrically conductive housing
DE2253411C3 (de) * 1972-10-31 1978-06-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen von aus Halbleitermaterial bestehenden, direkt beheizbaren Hohlkörpern für Diffusionszwecke
US4132612A (en) * 1974-12-23 1979-01-02 Telic Corporation Glow discharge method and apparatus
US4064521A (en) * 1975-07-28 1977-12-20 Rca Corporation Semiconductor device having a body of amorphous silicon
US4148931A (en) * 1976-03-08 1979-04-10 Siemens Aktiengesellschaft Process for depositing elemental silicon semiconductor material from a gas phase
JPS531483A (en) * 1976-06-28 1978-01-09 Futaba Denshi Kogyo Kk Pn junction solar battery and method of producing same
US4138509A (en) * 1977-12-23 1979-02-06 Motorola, Inc. Silicon purification process
US4218291A (en) * 1978-02-28 1980-08-19 Vlsi Technology Research Association Process for forming metal and metal silicide films

Also Published As

Publication number Publication date
EP0051449A1 (de) 1982-05-12
EP0051449B1 (de) 1985-05-08
JPS5777021A (en) 1982-05-14
DE3170422D1 (en) 1985-06-13
US4410559A (en) 1983-10-18
JPS5842126B2 (ja) 1983-09-17

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee