ATE135110T1 - Substrat-prüfungsvorrichtung - Google Patents

Substrat-prüfungsvorrichtung

Info

Publication number
ATE135110T1
ATE135110T1 AT89905170T AT89905170T ATE135110T1 AT E135110 T1 ATE135110 T1 AT E135110T1 AT 89905170 T AT89905170 T AT 89905170T AT 89905170 T AT89905170 T AT 89905170T AT E135110 T1 ATE135110 T1 AT E135110T1
Authority
AT
Austria
Prior art keywords
light
inspection
circuit board
printed circuit
emitting elements
Prior art date
Application number
AT89905170T
Other languages
English (en)
Inventor
Shigeki Omron Instit Kobayashi
Ltd Nakagomon-Cho Co
Yasuaki Omron Institu Tanimura
Teruhisa Omron Institu Yotsuya
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63112054A external-priority patent/JPH061173B2/ja
Priority claimed from JP63226768A external-priority patent/JP2629881B2/ja
Priority claimed from JP63226767A external-priority patent/JP2629880B2/ja
Priority claimed from JP63227964A external-priority patent/JP2748977B2/ja
Priority claimed from JP63227963A external-priority patent/JP2629882B2/ja
Priority claimed from JP63230738A external-priority patent/JPH07107514B2/ja
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Application granted granted Critical
Publication of ATE135110T1 publication Critical patent/ATE135110T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Toxicology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Led Device Packages (AREA)
  • Pressure Sensors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
AT89905170T 1988-05-09 1989-05-02 Substrat-prüfungsvorrichtung ATE135110T1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP63112054A JPH061173B2 (ja) 1988-05-09 1988-05-09 曲面性状検査装置
JP63226768A JP2629881B2 (ja) 1988-09-09 1988-09-09 基板検査のための検査領域設定方法およびその方法を用いた検査領域設定装置
JP63226767A JP2629880B2 (ja) 1988-09-09 1988-09-09 基板検査装置における教示方法
JP63227964A JP2748977B2 (ja) 1988-09-12 1988-09-12 基板検査結果表示装置
JP63227963A JP2629882B2 (ja) 1988-09-12 1988-09-12 基板検査のための教示方法及びその方法を用いた基板基査教示装置
JP63230738A JPH07107514B2 (ja) 1988-09-14 1988-09-14 基板検査装置における表示方法および表示装置

Publications (1)

Publication Number Publication Date
ATE135110T1 true ATE135110T1 (de) 1996-03-15

Family

ID=27552364

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89905170T ATE135110T1 (de) 1988-05-09 1989-05-02 Substrat-prüfungsvorrichtung

Country Status (8)

Country Link
US (1) US5245671A (de)
EP (3) EP0413817B1 (de)
KR (1) KR920006031B1 (de)
AT (1) ATE135110T1 (de)
AU (1) AU3543689A (de)
DE (3) DE68925901T2 (de)
SG (1) SG66545A1 (de)
WO (1) WO1989011093A1 (de)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
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EP0370527B1 (de) * 1988-11-24 1994-02-02 Omron Tateisi Electronics Co. Verfahren und Gerät zur Inspektion von Schichten
JPH02231510A (ja) * 1989-03-02 1990-09-13 Omron Tateisi Electron Co 基板検査装置
US5060065A (en) * 1990-02-23 1991-10-22 Cimflex Teknowledge Corporation Apparatus and method for illuminating a printed circuit board for inspection
JP3072998B2 (ja) * 1990-04-18 2000-08-07 株式会社日立製作所 はんだ付け状態検査方法及びその装置
US5598345A (en) * 1990-11-29 1997-01-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for inspecting solder portions
SG45181A1 (en) * 1991-07-22 1998-01-16 Omron Tateisi Electronics Co Teaching method and system for mounted component inspection
CN1050423C (zh) * 1993-04-21 2000-03-15 欧姆龙株式会社 目视检查辅助装置及基板检查装置
JP3205432B2 (ja) * 1993-06-10 2001-09-04 松下電器産業株式会社 装着部品検査装置と装着部品検査方法
SG80529A1 (en) * 1993-06-14 2001-05-22 Omron Tateisi Electronics Co Visual inspection supporting apparatus and printed circuit board inspecting apparatus, and methods of soldering inspection and correction using the apparatus
US5500886A (en) * 1994-04-06 1996-03-19 Thermospectra X-ray position measuring and calibration device
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EP0718623B1 (de) * 1994-12-19 2004-04-07 Omron Corporation Verfahren und Vorrichtung zum Feststellen von Betrachtungszonen und deren Anwendung zur Inspektion von Produkten
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JP3802957B2 (ja) * 1996-12-19 2006-08-02 富士機械製造株式会社 光沢を有する球冠状突起の撮像，位置特定方法およびシステム
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US6118524A (en) * 1997-02-26 2000-09-12 Acuity Imaging, Llc Arc illumination apparatus and method
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US6236747B1 (en) 1997-02-26 2001-05-22 Acuity Imaging, Llc System and method for image subtraction for ball and bumped grid array inspection
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US5774212A (en) * 1997-03-19 1998-06-30 General Electric Co. Method and apparatus for detecting and analyzing directionally reflective surface flaws
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JP4299049B2 (ja) * 2003-04-24 2009-07-22 株式会社 日立ディスプレイズ 表示デバイス用制御信号の検査方法及び検査装置並びにこの検査機能を備えた表示装置
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JP5948797B2 (ja) * 2011-11-07 2016-07-06 オムロン株式会社 検査結果の目視確認作業の支援用のシステムおよび装置ならびに方法
US8947590B2 (en) 2011-11-22 2015-02-03 Cognex Corporation Vision system camera with mount for multiple lens types
US10498933B2 (en) 2011-11-22 2019-12-03 Cognex Corporation Camera system with exchangeable illumination assembly
US11366284B2 (en) 2011-11-22 2022-06-21 Cognex Corporation Vision system camera with mount for multiple lens types and lens module for the same
KR101816616B1 (ko) * 2014-01-08 2018-01-09 야마하하쓰도키 가부시키가이샤 외관 검사 장치 및 외관 검사 방법
JP6470506B2 (ja) * 2014-06-09 2019-02-13 株式会社キーエンス 検査装置
KR101610148B1 (ko) * 2014-11-17 2016-04-08 현대자동차 주식회사 차체 검사 시스템 및 방법
KR101622628B1 (ko) 2014-12-16 2016-05-20 주식회사 고영테크놀러지 부품이 실장된 기판 검사방법 및 검사장치
CN104568964B (zh) * 2014-12-24 2018-05-01 昆山元茂电子科技有限公司 一种印刷电路板外观检测装置及其检测方法
KR101750521B1 (ko) * 2015-07-27 2017-07-03 주식회사 고영테크놀러지 기판 검사 장치 및 방법
KR101739696B1 (ko) * 2016-07-13 2017-05-25 서장일 재질인식 조명 시스템 및 이를 이용한 재질인식 방법
CN106645161B (zh) * 2016-09-27 2020-02-04 凌云光技术集团有限责任公司 一种表面缺陷检测系统及方法
JP6815169B2 (ja) * 2016-11-07 2021-01-20 Juki株式会社 極性判別装置、実装装置、極性判別方法
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JP7580263B2 (ja) * 2020-12-18 2024-11-11 東京エレクトロン株式会社 表示装置、表示方法、及び記憶媒体
CN121639686B (zh) * 2026-02-04 2026-04-24 攀枝花攀科电子科技有限公司 一种pcb电路板的智能化生产控制方法

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Also Published As

Publication number Publication date
DE68929062T2 (de) 2000-03-16
EP0413817A4 (en) 1991-10-23
DE68925901D1 (de) 1996-04-11
EP0685732B1 (de) 1999-08-25
EP0685732A1 (de) 1995-12-06
KR900702353A (ko) 1990-12-06
US5245671A (en) 1993-09-14
SG66545A1 (en) 1999-07-20
WO1989011093A1 (fr) 1989-11-16
DE68929481D1 (de) 2003-09-18
DE68929481T2 (de) 2004-06-09
DE68925901T2 (de) 1996-11-14
KR920006031B1 (ko) 1992-07-27
EP0413817B1 (de) 1996-03-06
EP0687901A1 (de) 1995-12-20
AU3543689A (en) 1989-11-29
DE68929062D1 (de) 1999-09-30
EP0413817A1 (de) 1991-02-27
EP0687901B1 (de) 2003-08-13

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