ATE137064T1 - Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels - Google Patents

Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels

Info

Publication number
ATE137064T1
ATE137064T1 AT89301106T AT89301106T ATE137064T1 AT E137064 T1 ATE137064 T1 AT E137064T1 AT 89301106 T AT89301106 T AT 89301106T AT 89301106 T AT89301106 T AT 89301106T AT E137064 T1 ATE137064 T1 AT E137064T1
Authority
AT
Austria
Prior art keywords
uniaxial
making
electrically conductive
uniax
conductive
Prior art date
Application number
AT89301106T
Other languages
English (en)
Inventor
Michael Joseph Ludden
Nicholas J G Smith
Paul James Gibney
Peter Nyholm
Original Assignee
Raychem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB888802567A external-priority patent/GB8802567D0/en
Priority claimed from GB888802565A external-priority patent/GB8802565D0/en
Priority claimed from GB888815447A external-priority patent/GB8815447D0/en
Priority claimed from GB888823053A external-priority patent/GB8823053D0/en
Priority claimed from GB888828245A external-priority patent/GB8828245D0/en
Application filed by Raychem Ltd filed Critical Raychem Ltd
Application granted granted Critical
Publication of ATE137064T1 publication Critical patent/ATE137064T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Insulated Conductors (AREA)
AT89301106T 1988-02-05 1989-02-03 Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels ATE137064T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB888802567A GB8802567D0 (en) 1988-02-05 1988-02-05 Uniaxially electrically conductive article
GB888802565A GB8802565D0 (en) 1988-02-05 1988-02-05 Uses of uniaxially electrically conductive articles
GB888815447A GB8815447D0 (en) 1988-06-29 1988-06-29 Anisotropically electrically conductive article
GB888823053A GB8823053D0 (en) 1988-09-30 1988-09-30 Uses of uniaxially electrically conductive articles
GB888828245A GB8828245D0 (en) 1988-12-02 1988-12-02 Anisotropically electrically conductive articles

Publications (1)

Publication Number Publication Date
ATE137064T1 true ATE137064T1 (de) 1996-05-15

Family

ID=27516790

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89301106T ATE137064T1 (de) 1988-02-05 1989-02-03 Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels

Country Status (6)

Country Link
EP (2) EP0391979A1 (de)
JP (1) JP2664090B2 (de)
KR (1) KR900701043A (de)
AT (1) ATE137064T1 (de)
DE (1) DE68926258T2 (de)
WO (1) WO1989007338A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2017743C (en) * 1989-06-30 1996-02-06 William C. Hu Ultra-tall indium or alloy bump array for ir detector hybrids and micro-electronics
US5140405A (en) * 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
EP0805493B1 (de) * 1991-02-22 2007-02-28 Canon Kabushiki Kaisha Elektrischer Verbindungskörper und Herstellungsverfahren dafür
EP0501361B1 (de) * 1991-02-25 2002-05-15 Canon Kabushiki Kaisha Elektrischer Verbindungskörper und Herstellungsverfahren dafür
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
FR2726397B1 (fr) * 1994-10-28 1996-11-22 Commissariat Energie Atomique Film conducteur anisotrope pour la microconnectique
US5665989A (en) * 1995-01-03 1997-09-09 Lsi Logic Programmable microsystems in silicon
US6384344B1 (en) 1995-06-19 2002-05-07 Ibiden Co., Ltd Circuit board for mounting electronic parts
EP1814153A3 (de) * 1996-09-12 2008-09-24 Ibiden Co., Ltd. Leiterplatte zum Montieren von Elektronikteilen
KR100327887B1 (ko) 1996-09-12 2002-10-19 이비덴 가부시키가이샤 전자회로부품탑재용기판
JP3063839B2 (ja) * 1997-11-18 2000-07-12 日本電気株式会社 実装部品の実装構造および実装方法
US6469394B1 (en) 2000-01-31 2002-10-22 Fujitsu Limited Conductive interconnect structures and methods for forming conductive interconnect structures
DE10356981B3 (de) * 2003-12-05 2005-09-01 Seoul National University Industry Foundation Verfahren zur Montage eines Halbleiterchips auf ein Substrat, insbesondere auf eine Leiterplatte
US7291380B2 (en) 2004-07-09 2007-11-06 Hewlett-Packard Development Company, L.P. Laser enhanced plating for forming wiring patterns

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598839A (en) * 1979-01-23 1980-07-28 Nec Corp Semiconductor device
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
CA1238959A (en) * 1984-08-09 1988-07-05 Robert R. Rohloff Area-bonding tape
DE3440109A1 (de) * 1984-11-02 1986-05-07 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Verfahren zur herstellung verformbarer vielfach-verbindungen fuer den elektrischen anschluss mikroelektronischer bauelemente und nach diesem verfahren hergestellte vielfachverbindungen
EP0183598A3 (de) * 1984-11-13 1987-01-28 Augat Inc. Packung mit Schirm für integrierte Schaltung
JPS61194745A (ja) * 1985-02-25 1986-08-29 Hitachi Ltd レ−ザ処理装置
JPS61265827A (ja) * 1985-05-20 1986-11-25 Katsusato Fujiyoshi 半導体回路
CA1284523C (en) * 1985-08-05 1991-05-28 Leo G. Svendsen Uniaxially electrically conductive articles with porous insulating substrate
US4700473A (en) * 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
AU598253B2 (en) * 1986-05-07 1990-06-21 Digital Equipment Corporation System for detachably mounting semi-conductors on conductor substrates
EP0260490A1 (de) * 1986-08-27 1988-03-23 Kabushiki Kaisha Toshiba Verbindungsschicht für ein elektronisches Bauelement und Verfahren zum Verbinden eines elektronischen Bauelementes mit einer solchen Schicht

Also Published As

Publication number Publication date
WO1989007338A1 (en) 1989-08-10
DE68926258T2 (de) 1996-10-02
JPH03502388A (ja) 1991-05-30
EP0391979A1 (de) 1990-10-17
EP0327399B1 (de) 1996-04-17
KR900701043A (ko) 1990-08-17
DE68926258D1 (de) 1996-05-23
EP0327399A1 (de) 1989-08-09
JP2664090B2 (ja) 1997-10-15

Similar Documents

Publication Publication Date Title
ATE137064T1 (de) Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels
DK0504196T3 (da) Forbedringer ved og i forbindelse med mikroelektroder og amperometriske prøvninger
DE59002985D1 (de) Verfahren und Vorrichtung zum Herstellen von Hohlräumen in Werkstücken mittels Laserstrahls.
EP0326020A3 (de) Verfahren und Vorrichtung zu Laserbonden
EP0452506A4 (en) Flexible circuit board for mounting ic and method of producing the same
DE3853740D1 (de) Bifunktionelle Antikörperkonstruktionen und Verfahren zur selektiven Tötung von Zellbeständen.
DE3888895D1 (de) Verfahren zum elektrischen Verbinden von integrierten Schaltungschips, eine Harzzusammensetzung für Podeste, und gemäss diesem Verfahren hergestellte Flüssigkristallanzeigevorrichtung.
DE3668821D1 (de) Verfahren und vorrichtung zum laserstrahl-schneiden von verbundwerkstoffen.
DE68914239D1 (de) Verfahren zum Lesen von lichtempfindlichen Zellen mit zwei in Reihe angeordneten Dioden und mit entgegenwirkenden Durchlassrichtungen.
DE3782014D1 (de) Geraet zum pruefen von leiterplatten.
ATE189575T1 (de) Verfahren zum durchkontaktieren von bohrungen in mehrlagigen leiterplatten
ATE149742T1 (de) Verfahren zum herstellen eines substrates für integrierte mikrowellen-schaltungen
DE68908341D1 (de) Verfahren zum montieren eines elektronischen bausteins und diesen verwendende speicherkarte.
ATE64516T1 (de) Verfahren zur herstellung von miteinander verbundenen gedruckten schaltungen.
DE3781596D1 (de) Verfahren zum montieren veredelter kontaktflaechen auf einem substrat sowie mit diesen kontaktflaechen versehenes substrat.
DE68902126D1 (de) Verfahren und vorrichtung zum verbinden von werkstuecken mittels hart- oder weichloeten.
ATE213681T1 (de) Verfahren und vorrichtung zur kennzeichnung von erzeugnissen aus transparenten (festen) werkstoffen mittels laser
DE3860168D1 (de) Verfahren zum thermischen bearbeiten von bauteilen in festem zustand mit einem laserstrahl.
IT7949988A0 (it) Apparecchio e procedimento di saldatura a laser in particolare per componenti di chip elettronici
ATE115335T1 (de) Verbindungsartikel für hybrid-mikrochip.
ATE248436T1 (de) Multi-chip-modul und verfahren zum herstellen eines multi-chip-moduls
JPS6423543A (en) Soldering by use of laser
ATE31845T1 (de) Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer halbleiterchip.
DE68928308D1 (de) Verfahren zum Herstellen von integrierten Halbleiterschaltungen in der Universalschaltkreistechnik
DE59913354D1 (de) Verfahren zum Verbinden von zwei aus härtemässig zueinander unterschiedlichen Metallen bestehenden Teilen mittels Laserlicht

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee