ATE137065T1 - Kühlungsanordnung für einen transistor - Google Patents

Kühlungsanordnung für einen transistor

Info

Publication number
ATE137065T1
ATE137065T1 AT90102984T AT90102984T ATE137065T1 AT E137065 T1 ATE137065 T1 AT E137065T1 AT 90102984 T AT90102984 T AT 90102984T AT 90102984 T AT90102984 T AT 90102984T AT E137065 T1 ATE137065 T1 AT E137065T1
Authority
AT
Austria
Prior art keywords
transistor
collector conductor
metal piece
cooling arrangement
piece
Prior art date
Application number
AT90102984T
Other languages
English (en)
Inventor
Timo Saarnimo
Original Assignee
Nokia Mobile Phones Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Mobile Phones Ltd filed Critical Nokia Mobile Phones Ltd
Application granted granted Critical
Publication of ATE137065T1 publication Critical patent/ATE137065T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Bipolar Transistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Amplifiers (AREA)
AT90102984T 1989-02-17 1990-02-15 Kühlungsanordnung für einen transistor ATE137065T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI890791A FI85783C (fi) 1989-02-17 1989-02-17 Kylningskonstruktion foer transistor.

Publications (1)

Publication Number Publication Date
ATE137065T1 true ATE137065T1 (de) 1996-05-15

Family

ID=8527924

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90102984T ATE137065T1 (de) 1989-02-17 1990-02-15 Kühlungsanordnung für einen transistor

Country Status (5)

Country Link
US (1) US5214309A (de)
EP (1) EP0384301B1 (de)
AT (1) ATE137065T1 (de)
DE (1) DE69026523T2 (de)
FI (1) FI85783C (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI88452C (fi) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Konstruktion foer att foerbaettra avkylning av en effekttransistor
GB2297436B (en) * 1995-01-28 1999-06-09 Nokia Mobile Phones Ltd Mobile telephone apparatus
FI107850B (fi) * 1995-06-30 2001-10-15 Nokia Mobile Phones Ltd Kantoväline matkaviestimen kiinnityslaitetta varten
FI107849B (fi) * 1995-06-30 2001-10-15 Nokia Mobile Phones Ltd Soviteosa matkaviestimessä sen kiinnityslaitetta varten
FI953249A7 (fi) 1995-06-30 1996-12-31 Nokia Corp Puhelin ja sen teline
US6798882B2 (en) 1995-09-28 2004-09-28 Nokia Mobile Phones Limited Mobile station
DE19620834C1 (de) * 1996-05-23 1997-06-19 Nokia Mobile Phones Ltd Einrichtung für Schnurlostelefone
GB2317300B (en) 1996-09-12 2000-08-16 Nokia Mobile Phones Ltd A handset
ES2123435B1 (es) * 1996-10-29 1999-09-16 Mecanismos Aux Ind Sistema de disipacion termica en circuito impreso de 800 micras.
FI104927B (fi) 1997-10-02 2000-04-28 Nokia Mobile Phones Ltd Matkaviestin
GB2331866B (en) 1997-11-28 2001-08-29 Nokia Mobile Phones Ltd Radiotelephone
FI980303L (fi) * 1998-02-10 1999-08-11 Nokia Mobile Phones Ltd Pakkaus
GB9811382D0 (en) 1998-05-27 1998-07-22 Nokia Mobile Phones Ltd A transmitter
GB9811381D0 (en) 1998-05-27 1998-07-22 Nokia Mobile Phones Ltd Predistortion control for power reduction
GB2339113B (en) 1998-06-30 2003-05-21 Nokia Mobile Phones Ltd Data transmission in tdma system
EP2276329A1 (de) 2009-07-16 2011-01-19 ABB Research Ltd. Elektronische Platine mit Wärmekondensator
US8383946B2 (en) * 2010-05-18 2013-02-26 Joinset, Co., Ltd. Heat sink
WO2014000800A1 (en) * 2012-06-28 2014-01-03 Aktiebolaget Electrolux Printed circuit board and electric filter
DE102018109920A1 (de) 2018-04-25 2019-10-31 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlung von leistungselektronischen Schaltungen
IT202100003965A1 (it) 2021-02-22 2022-08-22 Riccardo Carotenuto “circuito per ridurre il riscaldamento e aumentare l’efficienza di rettificatori a semiconduttore”

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3192307A (en) * 1964-05-29 1965-06-29 Burndy Corp Connector for component and printed circuit board
US3479570A (en) * 1966-06-14 1969-11-18 Rca Corp Encapsulation and connection structure for high power and high frequency semiconductor devices
US3517272A (en) * 1968-12-24 1970-06-23 Rca Corp Microwave circuit with coaxial package semiconductor device
US3962719A (en) * 1974-12-05 1976-06-08 Plastronics, Inc. Mounting pad and semiconductor encapsulation device combination
US3982271A (en) * 1975-02-07 1976-09-21 Rca Corporation Heat spreader and low parasitic transistor mounting
US4030001A (en) * 1975-11-19 1977-06-14 E-Systems, Inc. Co-planar lead connections to microstrip switching devices
DE2801875A1 (de) * 1978-01-17 1979-07-19 Siemens Ag Kuehlkoerper fuer hochfrequenz-bauelemente
JPS56105668A (en) * 1980-01-28 1981-08-22 Hitachi Ltd Thick film hybrid ic
JPH0135482Y2 (de) * 1985-03-26 1989-10-30
FR2584533A1 (fr) * 1985-07-05 1987-01-09 Acrian Inc Boitier de transistor a haute frequence
JPS63104360A (ja) * 1986-10-20 1988-05-09 Mitsubishi Electric Corp 半導体装置
US5012322A (en) * 1987-05-18 1991-04-30 Allegro Microsystems, Inc. Semiconductor die and mounting assembly
JPH0750753B2 (ja) * 1987-08-21 1995-05-31 株式会社東芝 トランジスタ装置

Also Published As

Publication number Publication date
EP0384301A3 (de) 1993-01-07
FI85783C (fi) 1992-05-25
FI85783B (fi) 1992-02-14
DE69026523D1 (de) 1996-05-23
US5214309A (en) 1993-05-25
FI890791L (fi) 1990-08-18
DE69026523T2 (de) 1996-09-12
EP0384301A2 (de) 1990-08-29
FI890791A0 (fi) 1989-02-17
EP0384301B1 (de) 1996-04-17

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties