ATE139407T1 - Werkzeugauswechselsystem für hybrid-chipverbinder - Google Patents

Werkzeugauswechselsystem für hybrid-chipverbinder

Info

Publication number
ATE139407T1
ATE139407T1 AT91301769T AT91301769T ATE139407T1 AT E139407 T1 ATE139407 T1 AT E139407T1 AT 91301769 T AT91301769 T AT 91301769T AT 91301769 T AT91301769 T AT 91301769T AT E139407 T1 ATE139407 T1 AT E139407T1
Authority
AT
Austria
Prior art keywords
tool
head
tool change
change system
bank
Prior art date
Application number
AT91301769T
Other languages
English (en)
Inventor
Karl Schweitzer
Gerhard Zeindl
Original Assignee
F&K Delvotec Bondtechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F&K Delvotec Bondtechnik Gmbh filed Critical F&K Delvotec Bondtechnik Gmbh
Application granted granted Critical
Publication of ATE139407T1 publication Critical patent/ATE139407T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S33/00—Geometrical instruments
    • Y10S33/01—Magnetic

Landscapes

  • Die Bonding (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
AT91301769T 1990-03-16 1991-03-04 Werkzeugauswechselsystem für hybrid-chipverbinder ATE139407T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB909006037A GB9006037D0 (en) 1990-03-16 1990-03-16 Tool exchange system for hybrid die bonder

Publications (1)

Publication Number Publication Date
ATE139407T1 true ATE139407T1 (de) 1996-06-15

Family

ID=10672785

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91301769T ATE139407T1 (de) 1990-03-16 1991-03-04 Werkzeugauswechselsystem für hybrid-chipverbinder

Country Status (6)

Country Link
US (1) US5150530A (de)
EP (1) EP0447087B1 (de)
JP (1) JPH0774190A (de)
AT (1) ATE139407T1 (de)
DE (1) DE69120111T2 (de)
GB (1) GB9006037D0 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH709629B1 (de) * 2000-10-06 2015-11-30 Chemspeed Technologies Ag Vorrichtung mit einem Werkzeughalter, einem Werkzeug und einer Waage.
EP1310986A1 (de) 2001-11-08 2003-05-14 F & K Delvotec Bondtechnik GmbH Chipträgerplatten-Wechselmechanismus
CN101903132B (zh) * 2007-12-19 2012-01-11 Nxp股份有限公司 拾取和放置工具研磨

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2976613A (en) * 1958-01-13 1961-03-28 Voss Engineering Company Releasable stylus holder for duplicator or tracer mechanism
FR2469982A1 (fr) * 1979-11-26 1981-05-29 Mecalix Dispositif de positionnement relatif de deux pieces
US4390172A (en) * 1980-11-28 1983-06-28 Presco, Inc. Precise quick-release positioning mechanism
JPS59161040A (ja) * 1983-03-03 1984-09-11 Shinkawa Ltd インナ−リ−ドボンダ−
US4795518A (en) * 1984-02-17 1989-01-03 Burr-Brown Corporation Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus
GB8406129D0 (en) * 1984-03-08 1984-04-11 Dyna Pert Precima Ltd Orienting electrical components
JPS61201431A (ja) * 1985-03-04 1986-09-06 Tokyo Sokuhan Kk 自動ダイボンダ−
JPH01227442A (ja) * 1988-03-08 1989-09-11 Matsushita Electron Corp 半導体ダイボンディング方法

Also Published As

Publication number Publication date
GB9006037D0 (en) 1990-05-09
JPH0774190A (ja) 1995-03-17
EP0447087A1 (de) 1991-09-18
US5150530A (en) 1992-09-29
DE69120111D1 (de) 1996-07-18
EP0447087B1 (de) 1996-06-12
DE69120111T2 (de) 1997-02-06

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties