ATE140103T1 - System und verfahren zur ermittlung des zentrums eines integrierten schaltungsplättchens - Google Patents

System und verfahren zur ermittlung des zentrums eines integrierten schaltungsplättchens

Info

Publication number
ATE140103T1
ATE140103T1 AT88303489T AT88303489T ATE140103T1 AT E140103 T1 ATE140103 T1 AT E140103T1 AT 88303489 T AT88303489 T AT 88303489T AT 88303489 T AT88303489 T AT 88303489T AT E140103 T1 ATE140103 T1 AT E140103T1
Authority
AT
Austria
Prior art keywords
determining
center
circuit board
integrated circuit
wafer
Prior art date
Application number
AT88303489T
Other languages
English (en)
Inventor
David Cheng
Wesley W Zhang
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE140103T1 publication Critical patent/ATE140103T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00Marks applied to devices, e.g. for alignment or identification
    • H10W46/501Marks applied to devices, e.g. for alignment or identification for use before dicing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Control Of Conveyors (AREA)
  • Control Of Position Or Direction (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AT88303489T 1987-04-20 1988-04-18 System und verfahren zur ermittlung des zentrums eines integrierten schaltungsplättchens ATE140103T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/040,974 US4819167A (en) 1987-04-20 1987-04-20 System and method for detecting the center of an integrated circuit wafer

Publications (1)

Publication Number Publication Date
ATE140103T1 true ATE140103T1 (de) 1996-07-15

Family

ID=21914022

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88303489T ATE140103T1 (de) 1987-04-20 1988-04-18 System und verfahren zur ermittlung des zentrums eines integrierten schaltungsplättchens

Country Status (5)

Country Link
US (1) US4819167A (de)
EP (1) EP0288233B1 (de)
JP (1) JPH0727953B2 (de)
AT (1) ATE140103T1 (de)
DE (1) DE3855389T2 (de)

Families Citing this family (187)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2611251B2 (ja) * 1987-08-28 1997-05-21 株式会社ニコン 基板搬送装置
JPH0620097B2 (ja) * 1987-10-20 1994-03-16 富士通株式会社 ウエハ位置決め装置
JP2683933B2 (ja) * 1989-01-20 1997-12-03 信越半導体株式会社 半導体ウエーハの表裏および方位判定検査装置
US5102280A (en) 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
EP0600851B1 (de) * 1989-10-20 1999-02-03 Applied Materials, Inc. Robotereinrichtung
US5227708A (en) * 1989-10-20 1993-07-13 Applied Materials, Inc. Two-axis magnetically coupled robot
US5447409A (en) * 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
JPH04298060A (ja) * 1991-03-26 1992-10-21 Tokyo Electron Ltd ウエハの位置合わせ装置
JP2986121B2 (ja) * 1991-03-26 1999-12-06 東京エレクトロン株式会社 ロードロック装置及び真空処理装置
TW201364B (de) * 1991-04-09 1993-03-01 Ito Co Ltd
US5359542A (en) * 1991-12-20 1994-10-25 The Boeing Company Variable parameter collision avoidance system for aircraft work platforms
EP0597637B1 (de) * 1992-11-12 2000-08-23 Applied Materials, Inc. System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
JP3074313B2 (ja) * 1993-01-26 2000-08-07 株式会社メックス ウエハーの位置決め装置
US5535306A (en) * 1993-01-28 1996-07-09 Applied Materials Inc. Self-calibration system for robot mechanisms
US5376862A (en) * 1993-01-28 1994-12-27 Applied Materials, Inc. Dual coaxial magnetic couplers for vacuum chamber robot assembly
US5452078A (en) * 1993-06-17 1995-09-19 Ann F. Koo Method and apparatus for finding wafer index marks and centers
JP2991593B2 (ja) * 1993-08-19 1999-12-20 株式会社東京精密 ダイシング装置の半導体ウェハ形状認識装置
US6707528B1 (en) 1994-03-02 2004-03-16 Nikon Corporation Exposure apparatus having independent chambers and methods of making the same
JPH07266272A (ja) * 1994-03-29 1995-10-17 Nippon Telegr & Teleph Corp <Ntt> マニピュレータ用追従方法及び装置
US5563798A (en) * 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
US5606251A (en) * 1994-07-15 1997-02-25 Ontrak Systems, Inc. Method and apparatus for detecting a substrate in a substrate processing system
US5546179A (en) * 1994-10-07 1996-08-13 Cheng; David Method and apparatus for mapping the edge and other characteristics of a workpiece
US5742393A (en) * 1995-06-07 1998-04-21 Varian Associates, Inc. Optical position calibration system
JPH09102530A (ja) * 1995-06-07 1997-04-15 Varian Assoc Inc ウェーハの向き検査システム
DE69634104T2 (de) * 1995-06-07 2005-12-29 Varian Semiconductor Equipment Associates Inc., Gloucester Scheibenorientierungsinspektionssystem
JP3973112B2 (ja) * 1995-06-07 2007-09-12 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド ウェーハの向き整合システム
JPH0964148A (ja) * 1995-08-18 1997-03-07 Shinkawa Ltd ウェーハリングの供給・返送装置
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US6152803A (en) 1995-10-20 2000-11-28 Boucher; John N. Substrate dicing method
US5822213A (en) * 1996-03-29 1998-10-13 Lam Research Corporation Method and apparatus for determining the center and orientation of a wafer-like object
US5644400A (en) * 1996-03-29 1997-07-01 Lam Research Corporation Method and apparatus for determining the center and orientation of a wafer-like object
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
US5706201A (en) * 1996-05-07 1998-01-06 Fortrend Engineering Corporation Software to determine the position of the center of a wafer
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
US6024393A (en) 1996-11-04 2000-02-15 Applied Materials, Inc. Robot blade for handling of semiconductor substrate
US6152070A (en) 1996-11-18 2000-11-28 Applied Materials, Inc. Tandem process chamber
US5902088A (en) * 1996-11-18 1999-05-11 Applied Materials, Inc. Single loadlock chamber with wafer cooling function
US5838121A (en) * 1996-11-18 1998-11-17 Applied Materials, Inc. Dual blade robot
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
US5909994A (en) * 1996-11-18 1999-06-08 Applied Materials, Inc. Vertical dual loadlock chamber
US5905302A (en) * 1996-11-18 1999-05-18 Applied Materials, Inc. Loadlock cassette with wafer support rails
US5911834A (en) * 1996-11-18 1999-06-15 Applied Materials, Inc. Gas delivery system
US6224312B1 (en) 1996-11-18 2001-05-01 Applied Materials, Inc. Optimal trajectory robot motion
US6082950A (en) * 1996-11-18 2000-07-04 Applied Materials, Inc. Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding
US6077157A (en) * 1996-11-18 2000-06-20 Applied Materials, Inc. Process chamber exhaust system
US5844195A (en) * 1996-11-18 1998-12-01 Applied Materials, Inc. Remote plasma source
US5961269A (en) 1996-11-18 1999-10-05 Applied Materials, Inc. Three chamber load lock apparatus
DE19725527A1 (de) * 1997-06-17 1998-12-24 Philips Patentverwaltung Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung
JP2001509643A (ja) * 1997-07-11 2001-07-24 ジェンマーク・オートメーション 複数ポイント位置走査システム
US6099596A (en) * 1997-07-23 2000-08-08 Applied Materials, Inc. Wafer out-of-pocket detection tool
US5985680A (en) * 1997-08-08 1999-11-16 Applied Materials, Inc. Method and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate system
US6071055A (en) * 1997-09-30 2000-06-06 Applied Materials, Inc. Front end vacuum processing environment
US6205870B1 (en) 1997-10-10 2001-03-27 Applied Komatsu Technology, Inc. Automated substrate processing systems and methods
US6164894A (en) * 1997-11-04 2000-12-26 Cheng; David Method and apparatus for integrated wafer handling and testing
US6126382A (en) * 1997-11-26 2000-10-03 Novellus Systems, Inc. Apparatus for aligning substrate to chuck in processing chamber
US5948986A (en) * 1997-12-26 1999-09-07 Applied Materials, Inc. Monitoring of wafer presence and position in semiconductor processing operations
US20040112360A1 (en) * 1998-02-12 2004-06-17 Boucher John N. Substrate dicing method
JP3741401B2 (ja) * 1998-02-27 2006-02-01 キヤノン株式会社 基板搬送装置、半導体製造装置および液晶プレート製造装置
US6198976B1 (en) * 1998-03-04 2001-03-06 Applied Materials, Inc. On the fly center-finding during substrate handling in a processing system
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6374149B1 (en) * 1998-05-18 2002-04-16 Texas Instruments Incorporated System and method for determining the center of a wafer on a wafer table
US6267549B1 (en) 1998-06-02 2001-07-31 Applied Materials, Inc. Dual independent robot blades with minimal offset
US6217272B1 (en) 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
US6328858B1 (en) 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
DE19845504A1 (de) * 1998-10-02 2000-04-20 Wacker Siltronic Halbleitermat Hordenaufnahmevorrichtung
US6405101B1 (en) 1998-11-17 2002-06-11 Novellus Systems, Inc. Wafer centering system and method
US6256555B1 (en) * 1998-12-02 2001-07-03 Newport Corporation Robot arm with specimen edge gripping end effector
US6300644B1 (en) 1998-12-21 2001-10-09 Microtool, Inc. Tool for aligning a robot arm to a cassette for holding semiconductor wafers
US6190037B1 (en) 1999-02-19 2001-02-20 Applied Materials, Inc. Non-intrusive, on-the-fly (OTF) temperature measurement and monitoring system
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
US6275742B1 (en) 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
TW469483B (en) 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
GB2349204B (en) * 1999-04-19 2004-03-03 Applied Materials Inc A method of detecting the position of a wafer
US6763281B2 (en) * 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
US6259519B1 (en) 1999-08-31 2001-07-10 Intelligent Machine Concepts, L.L.C. Method of determining the planar inclination of a surface
US6327520B1 (en) 1999-08-31 2001-12-04 Intelligent Machine Concepts, L.L.C. Planar normality sensor
JP4389305B2 (ja) 1999-10-06 2009-12-24 東京エレクトロン株式会社 処理装置
US6629053B1 (en) 1999-11-22 2003-09-30 Lam Research Corporation Method and apparatus for determining substrate offset using optimization techniques
US6502054B1 (en) 1999-11-22 2002-12-31 Lam Research Corporation Method of and apparatus for dynamic alignment of substrates
US6718227B1 (en) * 1999-12-16 2004-04-06 Texas Instruments Incorporated System and method for determining a position error in a wafer handling device
EP1124252A2 (de) * 2000-02-10 2001-08-16 Applied Materials, Inc. Verfahren und Vorrichtung zur Verarbeitung von Substraten
US6660086B1 (en) * 2000-03-06 2003-12-09 Innovative Coatings, Inc. Method and apparatus for extruding a coating upon a substrate surface
NL1015397C2 (nl) 2000-06-07 2001-12-10 Asm Int Inrichting voor het behandelen van een wafer.
US6381021B1 (en) 2000-06-22 2002-04-30 Applied Materials, Inc. Method and apparatus for measuring reflectivity of deposited films
US6553280B2 (en) 2000-07-07 2003-04-22 Applied Materials, Inc. Valve/sensor assemblies
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6327517B1 (en) * 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6530733B2 (en) 2000-07-27 2003-03-11 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6516244B1 (en) 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6430468B1 (en) * 2000-11-17 2002-08-06 Applied Materials, Inc. Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber
US6591161B2 (en) 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
KR100389129B1 (ko) * 2001-03-06 2003-06-25 삼성전자주식회사 멀티 펑션 웨이퍼 얼라이너
JP2002319612A (ja) * 2001-04-20 2002-10-31 Shin Etsu Handotai Co Ltd ウェーハ搬送装置、気相成長装置およびウェーハ搬送方法
US6839362B2 (en) * 2001-05-22 2005-01-04 Saint-Gobain Ceramics & Plastics, Inc. Cobalt-doped saturable absorber Q-switches and laser systems
US7008802B2 (en) * 2001-05-29 2006-03-07 Asm America, Inc. Method and apparatus to correct water drift
US6591850B2 (en) * 2001-06-29 2003-07-15 Applied Materials, Inc. Method and apparatus for fluid flow control
US6556887B2 (en) * 2001-07-12 2003-04-29 Applied Materials, Inc. Method for determining a position of a robot
JP4731755B2 (ja) * 2001-07-26 2011-07-27 東京エレクトロン株式会社 移載装置の制御方法および熱処理方法並びに熱処理装置
US7054713B2 (en) * 2002-01-07 2006-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Calibration cassette pod for robot teaching and method of using
US7008517B2 (en) * 2002-02-20 2006-03-07 Applied Materials, Inc. Shutter disk and blade for physical vapor deposition chamber
US6669829B2 (en) 2002-02-20 2003-12-30 Applied Materials, Inc. Shutter disk and blade alignment sensor
US7085622B2 (en) * 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US7233841B2 (en) * 2002-04-19 2007-06-19 Applied Materials, Inc. Vision system
JP4260423B2 (ja) * 2002-05-30 2009-04-30 ローツェ株式会社 円盤状物の基準位置教示方法、位置決め方法および搬送方法並びに、それらの方法を使用する円盤状物の基準位置教示装置、位置決め装置、搬送装置および半導体製造設備
US6900877B2 (en) * 2002-06-12 2005-05-31 Asm American, Inc. Semiconductor wafer position shift measurement and correction
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US7112961B2 (en) * 2002-12-13 2006-09-26 Applied Materials, Inc. Method and apparatus for dynamically measuring the thickness of an object
US6990430B2 (en) * 2002-12-20 2006-01-24 Brooks Automation, Inc. System and method for on-the-fly eccentricity recognition
US6760976B1 (en) 2003-01-15 2004-07-13 Novellus Systems, Inc. Method for active wafer centering using a single sensor
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US20050086024A1 (en) * 2003-09-19 2005-04-21 Cyberoptics Semiconductor Inc. Semiconductor wafer location sensing via non contact methods
US20050061230A1 (en) * 2003-09-23 2005-03-24 Saint-Gobain Ceramics & Plastics, Inc. Spinel articles and methods for forming same
US7326477B2 (en) * 2003-09-23 2008-02-05 Saint-Gobain Ceramics & Plastics, Inc. Spinel boules, wafers, and methods for fabricating same
US7045223B2 (en) * 2003-09-23 2006-05-16 Saint-Gobain Ceramics & Plastics, Inc. Spinel articles and methods for forming same
US7107125B2 (en) * 2003-10-29 2006-09-12 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US7792350B2 (en) * 2003-11-10 2010-09-07 Brooks Automation, Inc. Wafer center finding
US8634633B2 (en) 2003-11-10 2014-01-21 Brooks Automation, Inc. Wafer center finding with kalman filter
US7433759B2 (en) * 2004-07-22 2008-10-07 Applied Materials, Inc. Apparatus and methods for positioning wafers
US7440091B2 (en) * 2004-10-26 2008-10-21 Applied Materials, Inc. Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate
US7919815B1 (en) 2005-02-24 2011-04-05 Saint-Gobain Ceramics & Plastics, Inc. Spinel wafers and methods of preparation
WO2006098443A1 (ja) * 2005-03-17 2006-09-21 Hamamatsu Photonics K.K. 顕微鏡画像撮像装置
JP2006294987A (ja) * 2005-04-13 2006-10-26 Hitachi High-Technologies Corp 試料処理装置
KR20070004230A (ko) * 2005-07-04 2007-01-09 삼성전자주식회사 반도체 웨이퍼 이송용 로봇
US20070020475A1 (en) * 2005-07-21 2007-01-25 Prince Kendall W Primed substrate and method for making the same
CN100416791C (zh) * 2005-12-09 2008-09-03 北京圆合电子技术有限责任公司 一种将硅片的中心放置在静电卡盘中心的方法
US7933685B1 (en) 2006-01-10 2011-04-26 National Semiconductor Corporation System and method for calibrating a wafer handling robot and a wafer cassette
JP2009524047A (ja) * 2006-01-18 2009-06-25 アプライド マテリアルズ インコーポレイテッド 基板の破損及び移動中の基板のずれを動的に検出するセンサ
WO2007103887A2 (en) * 2006-03-05 2007-09-13 Blueshift Technologies, Inc. Semiconductor manufacturing process modules
DE102006015089A1 (de) * 2006-03-31 2007-10-11 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur Scheibenhandhabung in Halbleiterprozessanlagen
US7880155B2 (en) * 2006-06-15 2011-02-01 Brooks Automation, Inc. Substrate alignment apparatus comprising a controller to measure alignment during transport
JP4961895B2 (ja) * 2006-08-25 2012-06-27 東京エレクトロン株式会社 ウェハ搬送装置、ウェハ搬送方法及び記憶媒体
US8419341B2 (en) * 2006-09-19 2013-04-16 Brooks Automation, Inc. Linear vacuum robot with Z motion and articulated arm
US20080101912A1 (en) * 2006-10-26 2008-05-01 Martin Todd W Deposition analysis for robot motion correction
US20080190364A1 (en) * 2007-02-13 2008-08-14 Applied Materials, Inc. Substrate support assembly
JP5064835B2 (ja) 2007-02-28 2012-10-31 株式会社アルバック 基板搬送装置
CN101622373B (zh) * 2007-03-06 2012-07-18 东京毅力科创株式会社 蒸镀装置的控制装置及蒸镀装置的控制方法
JP4697192B2 (ja) 2007-06-12 2011-06-08 東京エレクトロン株式会社 位置ずれ検出装置及びこれを用いた処理システム
US8337278B2 (en) * 2007-09-24 2012-12-25 Applied Materials, Inc. Wafer edge characterization by successive radius measurements
US8041450B2 (en) * 2007-10-04 2011-10-18 Asm Japan K.K. Position sensor system for substrate transfer robot
KR101489963B1 (ko) * 2007-12-13 2015-02-04 한국에이에스엠지니텍 주식회사 박막 증착 장치 및 이를 이용한 증착 방법
JP5309157B2 (ja) * 2007-12-27 2013-10-09 ラム リサーチ コーポレーション プラズマ処理システムにおいてエンドエフェクタのアラインメントを校正するためのシステムおよび方法
WO2009086164A2 (en) * 2007-12-27 2009-07-09 Lam Research Corporation Systems and methods for calibrating end effector alignment using at least a light source
JP5336513B2 (ja) * 2007-12-27 2013-11-06 ラム リサーチ コーポレーション 動的アラインメント・ビーム校正のためのシステムおよび方法
CN101911277B (zh) * 2007-12-27 2012-04-04 朗姆研究公司 确定位置和偏移的装置和方法
US8273178B2 (en) * 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US7963736B2 (en) 2008-04-03 2011-06-21 Asm Japan K.K. Wafer processing apparatus with wafer alignment device
US9289795B2 (en) 2008-07-01 2016-03-22 Precision Coating Innovations, Llc Pressurization coating systems, methods, and apparatuses
US8276959B2 (en) 2008-08-08 2012-10-02 Applied Materials, Inc. Magnetic pad for end-effectors
WO2010038631A1 (ja) * 2008-09-30 2010-04-08 東京エレクトロン株式会社 蒸着装置、蒸着方法およびプログラムを記憶した記憶媒体
JP4607994B2 (ja) * 2008-11-25 2011-01-05 ローツェ株式会社 円盤状物の位置決め方法並びに、その方法を使用する円盤状物の位置決め装置、搬送装置および半導体製造設備
DE102010017082A1 (de) 2010-05-26 2011-12-01 Aixtron Ag Vorrichtung und Verfahren zum Be- und Entladen, insbesondere einer Beschichtungseinrichtung
JP5605132B2 (ja) * 2010-09-28 2014-10-15 シンフォニアテクノロジー株式会社 搬送ロボット、円盤状搬送対象物アライメント方法
US8958907B2 (en) * 2011-03-31 2015-02-17 Sinfonia Technology Co., Ltd. Robot arm apparatus
US8614797B2 (en) * 2011-06-27 2013-12-24 Infineon Technologies Ag Wafer orientation sensor
JP2013197454A (ja) * 2012-03-22 2013-09-30 Sumitomo Heavy Ind Ltd 搬送制御装置、搬送システム、基準テーブル作成方法、及び把持位置較正方法
US9616457B2 (en) 2012-04-30 2017-04-11 Innovative Coatings, Inc. Pressurization coating systems, methods, and apparatuses
JP6063716B2 (ja) 2012-11-14 2017-01-18 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
US9196518B1 (en) 2013-03-15 2015-11-24 Persimmon Technologies, Corp. Adaptive placement system and method
US9548231B2 (en) 2013-06-05 2017-01-17 Persimmon Technologies, Corp. Robot and adaptive placement system and method
TWI623994B (zh) 2013-07-08 2018-05-11 布魯克斯自動機械公司 具有即時基板定心的處理裝置
JP6187118B2 (ja) * 2013-10-08 2017-08-30 シンフォニアテクノロジー株式会社 搬送装置
DE102013111165A1 (de) 2013-10-09 2015-04-09 Aixtron Se Vorrichtung und Verfahren zur Bestimmung der Drehlage eines Suszeptors in einer Prozesskammer
JP6199199B2 (ja) * 2014-02-20 2017-09-20 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
TWI710440B (zh) 2014-11-10 2020-11-21 美商布魯克斯自動機械公司 工具自動教導方法及設備
WO2016081459A1 (en) 2014-11-18 2016-05-26 Persimmon Technologies, Corp. Robot adaptive placement system with end-effector position estimation
JP6463227B2 (ja) * 2015-07-07 2019-01-30 東京エレクトロン株式会社 基板搬送方法
US10134623B2 (en) 2015-07-13 2018-11-20 Brooks Automation, Inc. On the fly automatic wafer centering method and apparatus
US9966290B2 (en) 2015-07-30 2018-05-08 Lam Research Corporation System and method for wafer alignment and centering with CCD camera and robot
KR102181121B1 (ko) * 2016-09-20 2020-11-20 주식회사 원익아이피에스 기판 이송 장치 및 기판 이송 장치의 제어 방법
CN208795192U (zh) * 2018-08-29 2019-04-26 泰科电子(上海)有限公司 同心度检测系统
US10796940B2 (en) * 2018-11-05 2020-10-06 Lam Research Corporation Enhanced automatic wafer centering system and techniques for same
JP2022520038A (ja) * 2019-02-08 2022-03-28 ラム リサーチ コーポレーション 基板位置の検出および調整
WO2020180470A1 (en) 2019-03-01 2020-09-10 Applied Materials, Inc. Transparent wafer center finder
CN113906546B (zh) 2019-03-29 2025-03-18 朗姆研究公司 转位式多站处理室中的晶片放置修正
CN120663299A (zh) 2019-07-26 2025-09-19 朗姆研究公司 用于自动化晶片搬运机械手教导与健康检查的整合适应性定位系统及例程
KR102582696B1 (ko) * 2020-06-15 2023-09-26 세메스 주식회사 기판 처리 장치, 리프트 핀 높이 편차 측정 방법 및 컴퓨터 판독 가능한 처리 프로그램을 기록한 기록 매체
US11813757B2 (en) 2020-10-13 2023-11-14 Applied Materials, Inc. Centerfinding for a process kit or process kit carrier at a manufacturing system
KR102218367B1 (ko) * 2020-10-14 2021-02-23 (주)포틱스노바테크닉스 검사용 foup
TW202238803A (zh) * 2021-02-26 2022-10-01 日商東京威力科創股份有限公司 搬運系統、搬運裝置及搬運方法
JP7609676B2 (ja) * 2021-03-29 2025-01-07 東京エレクトロン株式会社 基板処理装置及び基板搬送位置調整方法
KR102830095B1 (ko) 2022-07-21 2025-07-03 삼성전자주식회사 웨이퍼형 센서, 웨이퍼형 센서를 이용한 웨이퍼 정렬 방법 및 웨이퍼형 센서의 보정 장치
JP7722310B2 (ja) * 2022-09-27 2025-08-13 株式会社ダイフク 荷卸し装置
US12576475B2 (en) 2023-04-25 2026-03-17 Applied Materials, Inc. Determining the orientation of a substrate in-situ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4647266A (en) * 1979-12-21 1987-03-03 Varian Associates, Inc. Wafer coating system
US4457664A (en) * 1982-03-22 1984-07-03 Ade Corporation Wafer alignment station
US4449885A (en) * 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
US4507078A (en) * 1983-03-28 1985-03-26 Silicon Valley Group, Inc. Wafer handling apparatus and method
JPS59202646A (ja) * 1983-05-04 1984-11-16 Hitachi Ltd ウエハの位置合わせ装置
US4523985A (en) * 1983-12-22 1985-06-18 Sputtered Films, Inc. Wafer processing machine
JPS61133806A (ja) * 1984-12-04 1986-06-21 Tsubakimoto Chain Co 移送物の境界識別方法
JPH0619670B2 (ja) * 1984-12-17 1994-03-16 株式会社デイスコ 自動精密位置合せシステム
US4769523A (en) * 1985-03-08 1988-09-06 Nippon Kogaku K.K. Laser processing apparatus
US4705951A (en) * 1986-04-17 1987-11-10 Varian Associates, Inc. Wafer processing system

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JPH0727953B2 (ja) 1995-03-29
JPS6448443A (en) 1989-02-22
EP0288233A3 (de) 1991-01-23
DE3855389T2 (de) 1997-01-02
DE3855389D1 (de) 1996-08-08
EP0288233A2 (de) 1988-10-26
US4819167A (en) 1989-04-04
EP0288233B1 (de) 1996-07-03

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