ATE140716T1 - Flammhemmende epoxydharzformmasse, und verfahren zur herstellung einer eingekapselten vorrichtung - Google Patents

Flammhemmende epoxydharzformmasse, und verfahren zur herstellung einer eingekapselten vorrichtung

Info

Publication number
ATE140716T1
ATE140716T1 AT91919492T AT91919492T ATE140716T1 AT E140716 T1 ATE140716 T1 AT E140716T1 AT 91919492 T AT91919492 T AT 91919492T AT 91919492 T AT91919492 T AT 91919492T AT E140716 T1 ATE140716 T1 AT E140716T1
Authority
AT
Austria
Prior art keywords
weight
flame retardant
molding compound
retardant epoxy
epoxy
Prior art date
Application number
AT91919492T
Other languages
English (en)
Inventor
Anthony A Gallo
Original Assignee
Dexter Electronic Materials Di
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexter Electronic Materials Di filed Critical Dexter Electronic Materials Di
Application granted granted Critical
Publication of ATE140716T1 publication Critical patent/ATE140716T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
AT91919492T 1990-09-28 1991-09-27 Flammhemmende epoxydharzformmasse, und verfahren zur herstellung einer eingekapselten vorrichtung ATE140716T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/590,247 US5104604A (en) 1989-10-05 1990-09-28 Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound

Publications (1)

Publication Number Publication Date
ATE140716T1 true ATE140716T1 (de) 1996-08-15

Family

ID=24361469

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91919492T ATE140716T1 (de) 1990-09-28 1991-09-27 Flammhemmende epoxydharzformmasse, und verfahren zur herstellung einer eingekapselten vorrichtung

Country Status (8)

Country Link
US (2) US5104604A (de)
EP (1) EP0552278B1 (de)
JP (1) JP3286976B2 (de)
AT (1) ATE140716T1 (de)
DE (2) DE69121107T2 (de)
ES (1) ES2059284T1 (de)
GR (1) GR930300122T1 (de)
WO (1) WO1992006138A1 (de)

Families Citing this family (10)

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US5476716A (en) * 1988-10-17 1995-12-19 The Dexter Corporation Flame retardant epoxy molding compound, method and encapsulated device
ES2219640T3 (es) * 1992-09-24 2004-12-01 Novartis Ag Anticuerpos monoclonales reformados contra un isotopo de inmunoglobulina.
GB9224854D0 (en) * 1992-11-27 1993-01-13 Ciba Geigy Ag Moulding process
EP0703613A3 (de) * 1994-09-26 1996-06-05 Motorola Inc Schutz elektronischer Bauelemente in saurer und basischer Umgebung
JPH08302161A (ja) * 1995-05-10 1996-11-19 Hitachi Chem Co Ltd 樹脂組成物及びその樹脂組成物をケミカルエッチングする方法
TW533224B (en) * 2000-05-25 2003-05-21 Ind Tech Res Inst Epoxy resin composition with non-halogen, non-phosphorus flame retardant
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
RU2414492C2 (ru) * 2008-10-07 2011-03-20 Федеральное Государственное Унитарное Предприятие "Центральный Научно-Исследовательский Институт Конструкционных Материалов "Прометей" (Фгуп "Цнии Км "Прометей") Полимерный нанокомпозит и способ его получения
CA2924977C (en) * 2013-09-27 2021-11-09 Stora Enso Oyj A composition comprising lignin and epoxy compound for coating and method for the manufacturing thereof and use thereof
MY181374A (en) 2014-12-04 2020-12-21 Mitsubishi Chem Corp Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material

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US4024318A (en) * 1966-02-17 1977-05-17 Exxon Research And Engineering Company Metal-filled plastic material
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BE792125A (fr) * 1971-12-27 1973-03-16 Petrow Henry G Sol colloidal d'oxyde d'antimoine, son procede de preparation et son utilisation
USRE31214E (en) * 1971-12-27 1983-04-19 Colloidal sol antimony pentaoxide flameproofing compositions
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US3928277A (en) * 1972-06-06 1975-12-23 George L Wicker Moulding compositions
US3912792A (en) * 1972-08-04 1975-10-14 M & T Chemicals Inc Flame retardant compositions
US3950456A (en) * 1972-08-18 1976-04-13 Cities Service Company Flame-retardant composition
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US5041254A (en) * 1988-10-17 1991-08-20 Dexter Corporation Method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
US5154976A (en) * 1988-10-17 1992-10-13 Dexter Corporation Flame retardant epoxy molding compound, method and encapsulated device

Also Published As

Publication number Publication date
EP0552278A1 (de) 1993-07-28
ES2059284T1 (es) 1994-11-16
DE552278T1 (de) 1994-02-03
DE69121107T2 (de) 1997-02-06
WO1992006138A1 (en) 1992-04-16
JP3286976B2 (ja) 2002-05-27
US5104604A (en) 1992-04-14
EP0552278B1 (de) 1996-07-24
EP0552278A4 (de) 1993-05-19
DE69121107D1 (de) 1996-08-29
GR930300122T1 (en) 1993-12-30
JPH06508857A (ja) 1994-10-06
US5420178A (en) 1995-05-30

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Legal Events

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