ATE148390T1 - Leiterplatte für spritzgiesssystem - Google Patents

Leiterplatte für spritzgiesssystem

Info

Publication number
ATE148390T1
ATE148390T1 AT93810821T AT93810821T ATE148390T1 AT E148390 T1 ATE148390 T1 AT E148390T1 AT 93810821 T AT93810821 T AT 93810821T AT 93810821 T AT93810821 T AT 93810821T AT E148390 T1 ATE148390 T1 AT E148390T1
Authority
AT
Austria
Prior art keywords
circuit board
injection molding
printed circuit
tracks
power source
Prior art date
Application number
AT93810821T
Other languages
English (en)
Inventor
Harald Schmidt
Original Assignee
Husky Injection Molding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Husky Injection Molding filed Critical Husky Injection Molding
Application granted granted Critical
Publication of ATE148390T1 publication Critical patent/ATE148390T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/0083Electrical or fluid connection systems therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/27Sprue channels ; Runner channels or runner nozzles
    • B29C45/2737Heating or cooling means therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C2045/1784Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for
    • B29C2045/1786Electric wire or cable guides, e.g. for manifolds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/27Sprue channels ; Runner channels or runner nozzles
    • B29C45/2737Heating or cooling means therefor
    • B29C2045/2751Electrical power supply connections
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/27Sprue channels ; Runner channels or runner nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/27Sprue channels ; Runner channels or runner nozzles
    • B29C45/2737Heating or cooling means therefor
    • B29C45/2738Heating or cooling means therefor specially adapted for manifolds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/78Measuring, controlling or regulating of temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Preparation Of Compounds By Using Micro-Organisms (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
AT93810821T 1992-12-10 1993-11-25 Leiterplatte für spritzgiesssystem ATE148390T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/988,863 US5320513A (en) 1992-12-10 1992-12-10 Printed circuit board for an injection molding apparatus

Publications (1)

Publication Number Publication Date
ATE148390T1 true ATE148390T1 (de) 1997-02-15

Family

ID=25534554

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93810821T ATE148390T1 (de) 1992-12-10 1993-11-25 Leiterplatte für spritzgiesssystem

Country Status (12)

Country Link
US (1) US5320513A (de)
EP (1) EP0606043B1 (de)
JP (1) JPH0773868B2 (de)
KR (1) KR970006229B1 (de)
AT (1) ATE148390T1 (de)
AU (1) AU657065B2 (de)
BR (1) BR9304574A (de)
CA (1) CA2109555C (de)
DE (1) DE69307862T2 (de)
DK (1) DK0606043T3 (de)
ES (1) ES2098713T3 (de)
MX (1) MX9307647A (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5591366A (en) * 1994-06-23 1997-01-07 Husky Injection Molding Systems Ltd. Injection molding heater including circuit breaking means
US5772933A (en) * 1994-10-12 1998-06-30 Kotzab; Werner Method for tempering an injection mold having at least one heated nozzle or hot runner
US20020011285A1 (en) * 1997-09-22 2002-01-31 Nobuyuki Fujitsuna Ferritic heat-resistant steel and method for producing it
US6305923B1 (en) 1998-06-12 2001-10-23 Husky Injection Molding Systems Ltd. Molding system using film heaters and/or sensors
US7241131B1 (en) 2000-06-19 2007-07-10 Husky Injection Molding Systems Ltd. Thick film heater apparatus
AU2002235156A1 (en) * 2000-11-06 2002-05-15 Frederick J. Buja Method and apparatus for controlling a mold melt-flow process using temperature sensors
US6913453B2 (en) * 2003-04-24 2005-07-05 Fast Heat Inc. Apparatus for protecting thermocouple circuits in thermoplastic injection moulding equipment
CA2471439A1 (en) * 2003-06-20 2004-12-20 Mold-Masters Limited Mold and hot runner controller located on the machine platen
US7160100B2 (en) 2004-01-06 2007-01-09 Mold-Masters Limited Injection molding apparatus having an elongated nozzle incorporating multiple nozzle bodies in tandem
JP2005297566A (ja) * 2004-04-07 2005-10-27 Mold Masters Ltd 加熱されるノズル本体セグメント及び加熱されないノズル本体セグメントを有するノズル本体を備えたノズル
CA2482254A1 (en) * 2004-04-07 2005-10-07 Mold-Masters Limited Modular injection nozzle having a thermal barrier
US7585166B2 (en) * 2005-05-02 2009-09-08 Buja Frederick J System for monitoring temperature and pressure during a molding process
US20070082029A1 (en) * 2005-10-07 2007-04-12 Aimutis William R Fiber satiety compositions
US7320588B2 (en) 2005-10-12 2008-01-22 Mold-Masters (2007) Limited Distribution assembly for an injection molding apparatus
US8790256B2 (en) 2006-08-14 2014-07-29 Frederick J. Buja System and method employing a thermocouple junction for monitoring of physiological parameters
DE602007005081D1 (de) * 2006-12-22 2010-04-15 Mold Masters 2007 Ltd Spritzgießsystem mit einem Bus
WO2009046752A1 (de) * 2007-10-02 2009-04-16 Osram Gesellschaft mit beschränkter Haftung Steckmittel, steckverbinder und verfahren zur herstellung des steckmittels
US8986205B2 (en) 2010-05-14 2015-03-24 Frederick J. Buja Sensor for measurement of temperature and pressure for a cyclic process
US9573435B2 (en) 2013-09-29 2017-02-21 Elka Suspension Inc. Dual inline hydraulic device
CN104568198B (zh) * 2014-12-31 2017-11-14 广东工业大学 一种多层pcb微孔钻削温度测量装置及方法
KR101690764B1 (ko) * 2015-04-21 2016-12-28 김창겸 핫런너장치의 매니폴드 어셈블리
CN108943597B (zh) * 2018-06-27 2020-05-01 昆山市金联科技有限公司 一种塑料制品加工系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4150281A (en) * 1978-03-13 1979-04-17 Tempco Electric Heater Corporation Electric heater construction
US4533787A (en) * 1981-11-26 1985-08-06 Autophon Ag. Printed circuit assembly
JPS61115108A (ja) * 1984-11-09 1986-06-02 Purasutoron Kk ホツトランナ多点ゲ−トの温度制御方法
JPS61134218A (ja) * 1984-12-05 1986-06-21 Shigeru Tsutsumi 熱可塑性合成樹脂射出成形システムにおけるホツトランナ−の温度制御表示装置
JPH035112A (ja) * 1989-06-01 1991-01-10 Sanri Kk ランナーレス射出成形機における間欠加熱方法およびその装置
CA2022122C (en) * 1990-07-27 1998-02-03 Jobst Ulrich Gellert Pre-wired injection molding assembly
US5030084A (en) * 1990-09-04 1991-07-09 Mold-Masters Limited Pre-wired injection molding assembly

Also Published As

Publication number Publication date
JPH0773868B2 (ja) 1995-08-09
DE69307862D1 (de) 1997-03-13
DK0606043T3 (da) 1997-08-11
ES2098713T3 (es) 1997-05-01
KR940017972A (ko) 1994-07-27
AU5074593A (en) 1994-06-23
EP0606043A1 (de) 1994-07-13
AU657065B2 (en) 1995-02-23
EP0606043B1 (de) 1997-01-29
MX9307647A (es) 1994-06-30
DE69307862T2 (de) 1997-07-24
US5320513A (en) 1994-06-14
JPH06210689A (ja) 1994-08-02
BR9304574A (pt) 1994-06-14
CA2109555C (en) 1997-04-08
CA2109555A1 (en) 1994-06-11
KR970006229B1 (ko) 1997-04-24

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