ATE152862T1 - Verfahren zum herstellen von engbenachbarten gleichlaufenden nuten auf einer dünnen wand und damit hergestelltes produkt - Google Patents

Verfahren zum herstellen von engbenachbarten gleichlaufenden nuten auf einer dünnen wand und damit hergestelltes produkt

Info

Publication number
ATE152862T1
ATE152862T1 AT93401353T AT93401353T ATE152862T1 AT E152862 T1 ATE152862 T1 AT E152862T1 AT 93401353 T AT93401353 T AT 93401353T AT 93401353 T AT93401353 T AT 93401353T AT E152862 T1 ATE152862 T1 AT E152862T1
Authority
AT
Austria
Prior art keywords
trough
block
rod
thin wall
adjective
Prior art date
Application number
AT93401353T
Other languages
English (en)
Inventor
David A Johnson
Original Assignee
Johnstech Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnstech Int Corp filed Critical Johnstech Int Corp
Application granted granted Critical
Publication of ATE152862T1 publication Critical patent/ATE152862T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical & Material Sciences (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AT93401353T 1992-06-02 1993-05-27 Verfahren zum herstellen von engbenachbarten gleichlaufenden nuten auf einer dünnen wand und damit hergestelltes produkt ATE152862T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/892,233 US5254834A (en) 1992-06-02 1992-06-02 Method of forming closely-spaced, generally parallel slots through a thin wall and product formed thereby

Publications (1)

Publication Number Publication Date
ATE152862T1 true ATE152862T1 (de) 1997-05-15

Family

ID=25399606

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93401353T ATE152862T1 (de) 1992-06-02 1993-05-27 Verfahren zum herstellen von engbenachbarten gleichlaufenden nuten auf einer dünnen wand und damit hergestelltes produkt

Country Status (10)

Country Link
US (1) US5254834A (de)
EP (1) EP0573331B1 (de)
JP (1) JPH07115219B2 (de)
KR (1) KR970005524B1 (de)
AT (1) ATE152862T1 (de)
CA (1) CA2096562C (de)
DE (1) DE69310438T2 (de)
ES (1) ES2102618T3 (de)
MX (1) MX9303276A (de)
TW (1) TW242202B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5645433A (en) * 1994-05-09 1997-07-08 Johnstech International Corporation Contacting system for electrical devices
US5888075A (en) * 1997-02-10 1999-03-30 Kabushiki Kaisha Nihon Micronics Auxiliary apparatus for testing device
US6064218A (en) * 1997-03-11 2000-05-16 Primeyield Systems, Inc. Peripherally leaded package test contactor
SG88739A1 (en) * 1997-05-15 2002-05-21 Nihon Micronics Kk Auxiliary apparatus for testing device
US6666927B2 (en) * 2001-04-30 2003-12-23 Intel Corporation Vacuum debris removal system for an integrated circuit manufacturing device
DE10261666A1 (de) * 2002-12-23 2004-07-01 Maschinenfabrik Spaichingen Gmbh Verfahren und Vorrichtung zum Laserschneiden
JP4795377B2 (ja) * 2008-03-27 2011-10-19 日立ビアメカニクス株式会社 レーザ加工装置
JP5029969B2 (ja) * 2008-11-12 2012-09-19 山一電機株式会社 電気接続装置
US10987759B2 (en) * 2017-05-31 2021-04-27 Zhaoli Hu Advanced back-strike protection process and related devices for water jet guided laser process
KR102376434B1 (ko) * 2018-01-17 2022-03-22 삼성디스플레이 주식회사 레이저 장치
KR102532733B1 (ko) * 2018-02-14 2023-05-16 삼성디스플레이 주식회사 분진 제거 장치 및 이를 포함하는 레이저 커팅 장치
US11478878B2 (en) 2018-09-28 2022-10-25 Synfuel Americas Corporation Laser cutting system for cutting articles and forming filtration tubes
WO2020115797A1 (ja) 2018-12-03 2020-06-11 三菱電機株式会社 レーザ加工方法およびレーザ加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4025143A (en) * 1975-06-10 1977-05-24 Rozmus John J Electrical contacts
US4343358A (en) * 1980-02-07 1982-08-10 Uop Inc. Laser slotted plastic well screen
US4487993A (en) * 1981-04-01 1984-12-11 General Electric Company High density electronic circuits having very narrow conductors
JPH033974Y2 (de) * 1985-06-13 1991-01-31
FI902202A0 (fi) * 1988-09-01 1990-05-02 Inst Fiz An Litssr Foerfarande foer framstaellning av filter medelst laserbehandling och en foer detta avsedd anordning.
JPH0719347B2 (ja) * 1988-09-24 1995-03-06 日本碍子株式会社 固定磁気ディスク装置用コアスライダの製造法

Also Published As

Publication number Publication date
KR970005524B1 (ko) 1997-04-17
CA2096562A1 (en) 1993-12-03
JPH07115219B2 (ja) 1995-12-13
DE69310438T2 (de) 1997-10-23
CA2096562C (en) 2001-07-17
TW242202B (de) 1995-03-01
MX9303276A (es) 1994-07-29
DE69310438D1 (de) 1997-06-12
EP0573331A1 (de) 1993-12-08
JPH0679480A (ja) 1994-03-22
ES2102618T3 (es) 1997-08-01
KR940000238A (ko) 1994-01-03
US5254834A (en) 1993-10-19
EP0573331B1 (de) 1997-05-07

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee