ES2102618T3 - Metodo para la realizacion de ranuras proximas y generalmente paralelas, a traves de una pared delgada, asi como el producto obtenido. - Google Patents
Metodo para la realizacion de ranuras proximas y generalmente paralelas, a traves de una pared delgada, asi como el producto obtenido.Info
- Publication number
- ES2102618T3 ES2102618T3 ES93401353T ES93401353T ES2102618T3 ES 2102618 T3 ES2102618 T3 ES 2102618T3 ES 93401353 T ES93401353 T ES 93401353T ES 93401353 T ES93401353 T ES 93401353T ES 2102618 T3 ES2102618 T3 ES 2102618T3
- Authority
- ES
- Spain
- Prior art keywords
- trough
- block
- rod
- thin wall
- generally parallel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000004952 Polyamide Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229920002647 polyamide Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical & Material Sciences (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
EL METODO DE LA PATENTE ESTA DESTINADO EN PARTICULAR PARA LA FABRICACION DE UN ARMAZON DE CONEXION ELECTRICA QUE INCORPORA UNOS ELEMENTOS CONECTORES ACOPLADOS MEDIANTE LOS CONTACTOS CORRESPONDIENTES DE UN DISPOSITIVO DE CIRCUITO INTEGRADO,INCLUYE LA PROVISION DE UN BLOQUE (14) HECHO DE UN MATERIAL APROPIADO COMO POLIAMIDA QUE POSEE UNA PARED (32) RELATIVAMENTE DELGADA (ALREDEDOR DE 3.8 MM),DEFINIDA POR DOS SUPERFICIES OPUESTAMENTE ENCARADAS (34,34'').SE DEFINE UN DEPOSITO (40) ADECUADO EN FORMA Y TAMAÑO AL DISPOSITIVO DE CONTACTO DEL CIRCUITO INTEGRADO,SITUADO EN AL MENOS UNA DE LAS SUPERFICIES ENCARADAS,Y DESTINADO A ALBERGAR UN SOPORTE DEL ELEMENTO CONECTOR.EN LA FABRICACION DEL ARMAZON,CADA DEPOSITO SE RELLENA CON UNAS VARILLAS (48) QUE PUEDEN SER DEL MISMO MATERIAL QUE EL BLOQUE,GENERALMENTE EN CONFIGURACION DE SECCION TRANSVERSAL RESPECTO AL DEPOSITO.JUNTO A LAS VARILLAS,SE INCLUYEN VARIAS RANURAS NORMALMENTE PARALELAS ACCIONADAS POR LASER Y SITUADAS PARA CRUZAR Y ESTAR LIGERAMENTE SEPARADAS A LO LARGO DE CADA DEPOSITO.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/892,233 US5254834A (en) | 1992-06-02 | 1992-06-02 | Method of forming closely-spaced, generally parallel slots through a thin wall and product formed thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2102618T3 true ES2102618T3 (es) | 1997-08-01 |
Family
ID=25399606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES93401353T Expired - Lifetime ES2102618T3 (es) | 1992-06-02 | 1993-05-27 | Metodo para la realizacion de ranuras proximas y generalmente paralelas, a traves de una pared delgada, asi como el producto obtenido. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US5254834A (es) |
| EP (1) | EP0573331B1 (es) |
| JP (1) | JPH07115219B2 (es) |
| KR (1) | KR970005524B1 (es) |
| AT (1) | ATE152862T1 (es) |
| CA (1) | CA2096562C (es) |
| DE (1) | DE69310438T2 (es) |
| ES (1) | ES2102618T3 (es) |
| MX (1) | MX9303276A (es) |
| TW (1) | TW242202B (es) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5645433A (en) * | 1994-05-09 | 1997-07-08 | Johnstech International Corporation | Contacting system for electrical devices |
| US5888075A (en) * | 1997-02-10 | 1999-03-30 | Kabushiki Kaisha Nihon Micronics | Auxiliary apparatus for testing device |
| US6064218A (en) * | 1997-03-11 | 2000-05-16 | Primeyield Systems, Inc. | Peripherally leaded package test contactor |
| SG88739A1 (en) * | 1997-05-15 | 2002-05-21 | Nihon Micronics Kk | Auxiliary apparatus for testing device |
| US6666927B2 (en) * | 2001-04-30 | 2003-12-23 | Intel Corporation | Vacuum debris removal system for an integrated circuit manufacturing device |
| DE10261666A1 (de) * | 2002-12-23 | 2004-07-01 | Maschinenfabrik Spaichingen Gmbh | Verfahren und Vorrichtung zum Laserschneiden |
| JP4795377B2 (ja) * | 2008-03-27 | 2011-10-19 | 日立ビアメカニクス株式会社 | レーザ加工装置 |
| JP5029969B2 (ja) * | 2008-11-12 | 2012-09-19 | 山一電機株式会社 | 電気接続装置 |
| US10987759B2 (en) * | 2017-05-31 | 2021-04-27 | Zhaoli Hu | Advanced back-strike protection process and related devices for water jet guided laser process |
| KR102376434B1 (ko) * | 2018-01-17 | 2022-03-22 | 삼성디스플레이 주식회사 | 레이저 장치 |
| KR102532733B1 (ko) * | 2018-02-14 | 2023-05-16 | 삼성디스플레이 주식회사 | 분진 제거 장치 및 이를 포함하는 레이저 커팅 장치 |
| CN117066712A (zh) | 2018-09-28 | 2023-11-17 | 合成燃料美国公司 | 用于切割物品并形成过滤管的激光切割系统 |
| DE112018008110T5 (de) | 2018-12-03 | 2021-08-19 | Mitsubishi Electric Corporation | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4025143A (en) * | 1975-06-10 | 1977-05-24 | Rozmus John J | Electrical contacts |
| US4343358A (en) * | 1980-02-07 | 1982-08-10 | Uop Inc. | Laser slotted plastic well screen |
| US4487993A (en) * | 1981-04-01 | 1984-12-11 | General Electric Company | High density electronic circuits having very narrow conductors |
| JPH033974Y2 (es) * | 1985-06-13 | 1991-01-31 | ||
| DE3891388T1 (de) * | 1988-09-01 | 1990-11-22 | Inst Fiz Akademii Nauk Litovsk | Verfahren und einrichtung zur herstellung von filtern durch bearbeitung mittels laser |
| JPH0719347B2 (ja) * | 1988-09-24 | 1995-03-06 | 日本碍子株式会社 | 固定磁気ディスク装置用コアスライダの製造法 |
-
1992
- 1992-06-02 US US07/892,233 patent/US5254834A/en not_active Expired - Lifetime
-
1993
- 1993-05-19 CA CA002096562A patent/CA2096562C/en not_active Expired - Fee Related
- 1993-05-26 KR KR1019930009218A patent/KR970005524B1/ko not_active Expired - Fee Related
- 1993-05-27 AT AT93401353T patent/ATE152862T1/de not_active IP Right Cessation
- 1993-05-27 EP EP93401353A patent/EP0573331B1/en not_active Expired - Lifetime
- 1993-05-27 ES ES93401353T patent/ES2102618T3/es not_active Expired - Lifetime
- 1993-05-27 DE DE69310438T patent/DE69310438T2/de not_active Expired - Fee Related
- 1993-06-01 JP JP5130482A patent/JPH07115219B2/ja not_active Expired - Fee Related
- 1993-06-01 MX MX9303276A patent/MX9303276A/es not_active IP Right Cessation
- 1993-06-09 TW TW082104585A patent/TW242202B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR940000238A (ko) | 1994-01-03 |
| DE69310438D1 (de) | 1997-06-12 |
| JPH0679480A (ja) | 1994-03-22 |
| KR970005524B1 (ko) | 1997-04-17 |
| EP0573331A1 (en) | 1993-12-08 |
| CA2096562C (en) | 2001-07-17 |
| JPH07115219B2 (ja) | 1995-12-13 |
| MX9303276A (es) | 1994-07-29 |
| US5254834A (en) | 1993-10-19 |
| CA2096562A1 (en) | 1993-12-03 |
| EP0573331B1 (en) | 1997-05-07 |
| TW242202B (es) | 1995-03-01 |
| DE69310438T2 (de) | 1997-10-23 |
| ATE152862T1 (de) | 1997-05-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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