ATE155287T1 - Herstellungsverfahren für elektronische packungen - Google Patents

Herstellungsverfahren für elektronische packungen

Info

Publication number
ATE155287T1
ATE155287T1 AT91907909T AT91907909T ATE155287T1 AT E155287 T1 ATE155287 T1 AT E155287T1 AT 91907909 T AT91907909 T AT 91907909T AT 91907909 T AT91907909 T AT 91907909T AT E155287 T1 ATE155287 T1 AT E155287T1
Authority
AT
Austria
Prior art keywords
preform
filler material
infiltration
spontaneously
metal
Prior art date
Application number
AT91907909T
Other languages
English (en)
Inventor
Steven David Keck
Michael Angelo Rocazella
Peter Michael Engelgau
Gregory Eugene Hannon
Danny Ray White
Alan Scott Nagelberg
Original Assignee
Lanxide Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27048059&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE155287(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lanxide Technology Co Ltd filed Critical Lanxide Technology Co Ltd
Application granted granted Critical
Publication of ATE155287T1 publication Critical patent/ATE155287T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C04B35/65—Reaction sintering of free metal- or free silicon-containing compositions
    • C04B35/652—Directional oxidation or solidification, e.g. Lanxide process
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1005—Pretreatment of the non-metallic additives
    • C22C1/1015—Pretreatment of the non-metallic additives by preparing or treating a non-metallic additive preform
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C22C1/1057—Reactive infiltration
    • C22C1/1063—Gas reaction, e.g. lanxide
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/02—Pretreatment of the fibres or filaments
    • C22C47/06—Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Liquid Crystal Substances (AREA)
  • Glass Compositions (AREA)
  • Formation Of Insulating Films (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Packages (AREA)
AT91907909T 1990-02-23 1991-02-25 Herstellungsverfahren für elektronische packungen ATE155287T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48457590A 1990-02-23 1990-02-23
US07/520,936 US5163499A (en) 1988-11-10 1990-05-09 Method of forming electronic packages

Publications (1)

Publication Number Publication Date
ATE155287T1 true ATE155287T1 (de) 1997-07-15

Family

ID=27048059

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91907909T ATE155287T1 (de) 1990-02-23 1991-02-25 Herstellungsverfahren für elektronische packungen

Country Status (8)

Country Link
US (1) US5163499A (de)
EP (1) EP0516765B1 (de)
JP (1) JPH05504659A (de)
AT (1) ATE155287T1 (de)
AU (1) AU651822B2 (de)
BR (1) BR9106055A (de)
CA (1) CA2076637A1 (de)
DE (1) DE69126773D1 (de)

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US6338906B1 (en) 1992-09-17 2002-01-15 Coorstek, Inc. Metal-infiltrated ceramic seal
US6143421A (en) * 1992-09-17 2000-11-07 Coorstek, Inc. Electronic components incorporating ceramic-metal composites
US5614043A (en) 1992-09-17 1997-03-25 Coors Ceramics Company Method for fabricating electronic components incorporating ceramic-metal composites
JPH06236819A (ja) * 1993-01-11 1994-08-23 Boam R & D Co Ltd フェライト磁性体チップビード構造及びその製造方法
US5650592A (en) * 1993-04-05 1997-07-22 Olin Corporation Graphite composites for electronic packaging
US5657811A (en) * 1993-06-04 1997-08-19 Pcc Composites, Inc. Cast-in hermetic electrical feed-throughs
US5465481A (en) * 1993-10-04 1995-11-14 Motorola, Inc. Method for fabricating a semiconductor package
US5455118A (en) * 1994-02-01 1995-10-03 Pcc Composites, Inc. Plating for metal matrix composites
US5480727A (en) * 1994-02-03 1996-01-02 Motorola, Inc. Electronic device assembly and method for making
AT404083B (de) * 1995-04-18 1998-08-25 Electrovac Verfahren zum herstellen von gehäusen
AT405039B (de) * 1996-02-08 1999-04-26 Electrovac Verbundbauteil
JP3314141B2 (ja) * 1996-03-26 2002-08-12 マツダ株式会社 複合化用予備成形体並びにこれが複合化された複合アルミニウム系金属部品及びこれらの製造方法
US6018188A (en) * 1997-03-28 2000-01-25 Nec Corporation Semiconductor device
US6261872B1 (en) 1997-09-18 2001-07-17 Trw Inc. Method of producing an advanced RF electronic package
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DE102005030862B4 (de) * 2005-07-01 2009-12-24 Sintec Keramik Gmbh Erstbenetzungshilfsmaterial für einen Verdampferkörper, seine Verwendung zum Herrichten der Verdampferfläche eines Verdampferkörpers und ein elektrisch beheizbarer keramischer Verdampferkörper
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JP5518208B2 (ja) * 2010-12-07 2014-06-11 シーメンス エナジー インコーポレイテッド 柔軟なワックスパターンツールを利用するインベストメント鋳造
US10100402B2 (en) * 2011-10-07 2018-10-16 International Business Machines Corporation Substrate holder for graphene film synthesis
KR101472416B1 (ko) * 2013-10-17 2014-12-12 고려대학교 산학협력단 3차원 스트레쳐블 전자소자 및 이의 제조 방법
US10821505B2 (en) * 2015-11-10 2020-11-03 Ecole Polytechnique Federale De Lausanne (Epfl) Small-scale metal castings, small-scale metal/transparent composite structures, and process to produce the same
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US11284510B2 (en) 2018-04-17 2022-03-22 Board Of Trustees Of Michigan State University Controlled wetting and spreading of metals on substrates using porous interlayers and related articles
US20210332709A1 (en) * 2020-04-27 2021-10-28 Raytheon Technologies Corporation Environmental barrier coating and method of applying an environmental barrier coating
US11464135B2 (en) * 2020-12-04 2022-10-04 Schneider Electric It Corporation Liquid cooling enclosure for circuit components
CN114171479B (zh) * 2022-02-14 2022-05-24 潮州三环（集团）股份有限公司 一种陶瓷封装基座及其制备方法和应用

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Also Published As

Publication number Publication date
EP0516765A1 (de) 1992-12-09
AU651822B2 (en) 1994-08-04
WO1991013462A2 (en) 1991-09-05
WO1991013462A3 (en) 1991-10-17
BR9106055A (pt) 1993-06-15
US5163499A (en) 1992-11-17
JPH05504659A (ja) 1993-07-15
AU7685191A (en) 1991-09-18
EP0516765B1 (de) 1997-07-09
CA2076637A1 (en) 1991-08-24
DE69126773D1 (de) 1997-08-14

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