ATE160180T1 - Ionenplattierung mittels magnetronsputtern - Google Patents

Ionenplattierung mittels magnetronsputtern

Info

Publication number
ATE160180T1
ATE160180T1 AT91906299T AT91906299T ATE160180T1 AT E160180 T1 ATE160180 T1 AT E160180T1 AT 91906299 T AT91906299 T AT 91906299T AT 91906299 T AT91906299 T AT 91906299T AT E160180 T1 ATE160180 T1 AT E160180T1
Authority
AT
Austria
Prior art keywords
magnetrons
ion plating
magnetron sputter
substrates
magnetron
Prior art date
Application number
AT91906299T
Other languages
English (en)
Inventor
Dennis Gerald Teer
Original Assignee
Teer Coatings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10672810&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE160180(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Teer Coatings Ltd filed Critical Teer Coatings Ltd
Application granted granted Critical
Publication of ATE160180T1 publication Critical patent/ATE160180T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Glass Compositions (AREA)
  • Chemically Coating (AREA)
AT91906299T 1990-03-17 1991-03-18 Ionenplattierung mittels magnetronsputtern ATE160180T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB909006073A GB9006073D0 (en) 1990-03-17 1990-03-17 Magnetron sputter ion plating

Publications (1)

Publication Number Publication Date
ATE160180T1 true ATE160180T1 (de) 1997-11-15

Family

ID=10672810

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91906299T ATE160180T1 (de) 1990-03-17 1991-03-18 Ionenplattierung mittels magnetronsputtern

Country Status (9)

Country Link
US (1) US5556519A (de)
EP (1) EP0521045B1 (de)
JP (1) JP3397786B2 (de)
AT (1) ATE160180T1 (de)
AU (1) AU7481091A (de)
DE (1) DE69128195T2 (de)
GB (2) GB9006073D0 (de)
HK (1) HK10395A (de)
WO (1) WO1991014797A1 (de)

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CN105200385B (zh) * 2015-10-27 2019-02-01 中国科学院兰州化学物理研究所 箍缩磁场辅助磁控溅射镀膜装置
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Also Published As

Publication number Publication date
HK10395A (en) 1995-02-03
JP3397786B2 (ja) 2003-04-21
US5556519A (en) 1996-09-17
EP0521045A1 (de) 1993-01-07
AU7481091A (en) 1991-10-21
JPH05505215A (ja) 1993-08-05
EP0521045B1 (de) 1997-11-12
GB9006073D0 (en) 1990-05-16
GB9218562D0 (en) 1992-11-11
GB2258343B (en) 1994-04-06
DE69128195T2 (de) 1998-03-12
DE69128195D1 (de) 1997-12-18
GB2258343A (en) 1993-02-03
WO1991014797A1 (en) 1991-10-03

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