ATE162306T1 - Verfahren und gerät zur inspektion - Google Patents

Verfahren und gerät zur inspektion

Info

Publication number
ATE162306T1
ATE162306T1 AT92305510T AT92305510T ATE162306T1 AT E162306 T1 ATE162306 T1 AT E162306T1 AT 92305510 T AT92305510 T AT 92305510T AT 92305510 T AT92305510 T AT 92305510T AT E162306 T1 ATE162306 T1 AT E162306T1
Authority
AT
Austria
Prior art keywords
fault
particle
laser beam
resulting
light
Prior art date
Application number
AT92305510T
Other languages
English (en)
Inventor
Toshihiko Tsuji
Noriyuki Nose
Minoru Yoshii
Kyoichi Miyazaki
Seiji Takeuchi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE162306T1 publication Critical patent/ATE162306T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J9/00—Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength
    • G01J9/02—Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength by interferometric methods
    • G01J2009/0261—Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength by interferometric methods polarised
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J9/00—Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength
    • G01J9/04—Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength by beating two waves of a same source but of different frequency and measuring the phase shift of the lower frequency obtained
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Epidemiology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Atmospheric Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
AT92305510T 1992-04-27 1992-06-16 Verfahren und gerät zur inspektion ATE162306T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10767892 1992-04-27
JP13698292 1992-05-28

Publications (1)

Publication Number Publication Date
ATE162306T1 true ATE162306T1 (de) 1998-01-15

Family

ID=26447703

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92305510T ATE162306T1 (de) 1992-04-27 1992-06-16 Verfahren und gerät zur inspektion

Country Status (3)

Country Link
EP (1) EP0567701B1 (de)
AT (1) ATE162306T1 (de)
DE (1) DE69224060T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486919A (en) * 1992-04-27 1996-01-23 Canon Kabushiki Kaisha Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern
EP0598582B1 (de) * 1992-11-16 2002-01-30 Canon Kabushiki Kaisha Inspektionsverfahren und -vorrichtung
DE4343058A1 (de) * 1993-12-19 1995-06-22 Robert Prof Dr Ing Massen Multisensorielle Kamera für die Qualitätssicherung
JPH07209202A (ja) * 1994-01-21 1995-08-11 Canon Inc 表面状態検査装置、該表面状態検査装置を備える露光装置及び該露光装置を用いてデバイスを製造する方法
EP0772038B1 (de) * 1995-10-31 2004-09-08 Kyoto Daiichi Kagaku Co., Ltd. Verfahren und Vorrichtung zur optischen Messung durch Polarisationsanalyse
US6381356B1 (en) 1996-10-23 2002-04-30 Nec Corporation Method and apparatus for inspecting high-precision patterns
US7078712B2 (en) * 2004-03-18 2006-07-18 Axcelis Technologies, Inc. In-situ monitoring on an ion implanter
DE102006042412B4 (de) * 2006-09-06 2009-01-02 Yara International Asa Verfahren zum berührungslosen Bestimmen biophysikalischer Parameter von mit Tau benetzten Pflanzenbeständen
CN109343068A (zh) * 2018-12-13 2019-02-15 中国电子科技集团公司第三十四研究所 一种空间长度的测量装置及测量方法
CN114088734B (zh) * 2021-11-18 2022-06-24 广东电网有限责任公司 一种复合绝缘子内部缺陷检测系统及方法
CN114509921B (zh) * 2022-01-13 2023-06-16 华中科技大学 一种光刻缺陷衍射光强差分检测方法
CN115184413A (zh) * 2022-06-22 2022-10-14 安徽巨一科技股份有限公司 点焊质量在线检测方法
CN114858755B (zh) * 2022-07-05 2022-10-21 中国航发四川燃气涡轮研究院 一种航空发动机涂层变频原位激光检测系统
CN118068390B (zh) * 2023-06-15 2024-10-15 凯瑟斯技术(杭州)有限公司 探测原子束流的装置和方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353650A (en) * 1980-06-16 1982-10-12 The United States Of America As Represented By The United States Department Of Energy Laser heterodyne surface profiler
CH678108A5 (de) * 1987-04-28 1991-07-31 Wild Leitz Ag
JPH0820371B2 (ja) * 1988-01-21 1996-03-04 株式会社ニコン 欠陥検査装置及び欠陥検査方法

Also Published As

Publication number Publication date
EP0567701A1 (de) 1993-11-03
DE69224060T2 (de) 1998-05-07
EP0567701B1 (de) 1998-01-14
DE69224060D1 (de) 1998-02-19

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Legal Events

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