ATE171307T1 - Leiterstruktur für eine integrierte schaltung - Google Patents

Leiterstruktur für eine integrierte schaltung

Info

Publication number
ATE171307T1
ATE171307T1 AT90304415T AT90304415T ATE171307T1 AT E171307 T1 ATE171307 T1 AT E171307T1 AT 90304415 T AT90304415 T AT 90304415T AT 90304415 T AT90304415 T AT 90304415T AT E171307 T1 ATE171307 T1 AT E171307T1
Authority
AT
Austria
Prior art keywords
leads
lead pattern
lead
bonding pads
integrated circuit
Prior art date
Application number
AT90304415T
Other languages
English (en)
Inventor
Mu Albert Tsung-Chen
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of ATE171307T1 publication Critical patent/ATE171307T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AT90304415T 1989-05-22 1990-04-25 Leiterstruktur für eine integrierte schaltung ATE171307T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35464789A 1989-05-22 1989-05-22

Publications (1)

Publication Number Publication Date
ATE171307T1 true ATE171307T1 (de) 1998-10-15

Family

ID=23394320

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90304415T ATE171307T1 (de) 1989-05-22 1990-04-25 Leiterstruktur für eine integrierte schaltung

Country Status (4)

Country Link
EP (1) EP0399661B1 (de)
JP (1) JP2889954B2 (de)
AT (1) ATE171307T1 (de)
DE (1) DE69032654T2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3784244B2 (ja) * 2000-06-30 2006-06-07 京セラ株式会社 多層配線基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2940593A1 (de) * 1979-10-06 1981-04-16 Ibm Deutschland Gmbh, 7000 Stuttgart Mehrlagen-modul mit konstantem wellenwiderstand
US4535388A (en) * 1984-06-29 1985-08-13 International Business Machines Corporation High density wired module
CA1246755A (en) * 1985-03-30 1988-12-13 Akira Miyauchi Semiconductor device
CA1305255C (en) * 1986-08-25 1992-07-14 Joseph Lebowitz Marching interconnecting lines in semiconductor integrated circuits
JPS6386554A (ja) * 1986-09-30 1988-04-16 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション 電子的パッケ−ジ
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
JPS6442158A (en) * 1987-08-10 1989-02-14 Nec Corp Hybrid integrated circuit device

Also Published As

Publication number Publication date
JP2889954B2 (ja) 1999-05-10
EP0399661A2 (de) 1990-11-28
JPH0327564A (ja) 1991-02-05
EP0399661A3 (de) 1992-01-08
DE69032654T2 (de) 1999-04-15
DE69032654D1 (de) 1998-10-22
EP0399661B1 (de) 1998-09-16

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Legal Events

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