ATE174156T1 - Licht emittierende vorrichtung und verfahren zu ihrer herstellung - Google Patents
Licht emittierende vorrichtung und verfahren zu ihrer herstellungInfo
- Publication number
- ATE174156T1 ATE174156T1 AT94104882T AT94104882T ATE174156T1 AT E174156 T1 ATE174156 T1 AT E174156T1 AT 94104882 T AT94104882 T AT 94104882T AT 94104882 T AT94104882 T AT 94104882T AT E174156 T1 ATE174156 T1 AT E174156T1
- Authority
- AT
- Austria
- Prior art keywords
- light emitting
- emitting device
- producing same
- region
- luminous
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000013078 crystal Substances 0.000 abstract 1
- 239000011148 porous material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/826—Materials of the light-emitting regions comprising only Group IV materials
- H10H20/8264—Materials of the light-emitting regions comprising only Group IV materials comprising polycrystalline, amorphous or porous Group IV materials
Landscapes
- Led Devices (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Electroluminescent Light Sources (AREA)
- Element Separation (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6993893 | 1993-03-29 | ||
| JP4902294A JPH06338631A (ja) | 1993-03-29 | 1994-03-18 | 発光素子及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE174156T1 true ATE174156T1 (de) | 1998-12-15 |
Family
ID=26389374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT94104882T ATE174156T1 (de) | 1993-03-29 | 1994-03-28 | Licht emittierende vorrichtung und verfahren zu ihrer herstellung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5726464A (de) |
| EP (1) | EP0618624B1 (de) |
| JP (1) | JPH06338631A (de) |
| AT (1) | ATE174156T1 (de) |
| DE (1) | DE69414898T2 (de) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7148119B1 (en) | 1994-03-10 | 2006-12-12 | Canon Kabushiki Kaisha | Process for production of semiconductor substrate |
| JP3352340B2 (ja) * | 1995-10-06 | 2002-12-03 | キヤノン株式会社 | 半導体基体とその製造方法 |
| GB2299204A (en) * | 1995-03-20 | 1996-09-25 | Secr Defence | Electroluminescent device |
| TW391022B (en) * | 1997-10-29 | 2000-05-21 | Mitsubishi Rayon Co | Field emission electron source, method of producing the same, and use of the same |
| JP3413090B2 (ja) | 1997-12-26 | 2003-06-03 | キヤノン株式会社 | 陽極化成装置及び陽極化成処理方法 |
| WO1999041626A1 (de) * | 1998-02-10 | 1999-08-19 | Infineon Technologies Ag | Optische struktur und verfahren zu deren herstellung |
| US6455344B1 (en) * | 1998-05-19 | 2002-09-24 | National Science Council | Method of fabricating a planar porous silicon metal-semicoductor-metal photodetector |
| KR100338140B1 (ko) * | 1998-09-25 | 2002-05-24 | 이마이 기요스케 | 전계 방사형 전자원 |
| JP2000277478A (ja) | 1999-03-25 | 2000-10-06 | Canon Inc | 陽極化成装置、陽極化成システム、基板の処理装置及び処理方法、並びに基板の製造方法 |
| US6468923B1 (en) | 1999-03-26 | 2002-10-22 | Canon Kabushiki Kaisha | Method of producing semiconductor member |
| US6410436B2 (en) | 1999-03-26 | 2002-06-25 | Canon Kabushiki Kaisha | Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate |
| TWI286486B (en) * | 2002-07-11 | 2007-09-11 | Sumitomo Electric Industries | Porous semiconductor and process for producing the same |
| JP4438049B2 (ja) * | 2003-08-11 | 2010-03-24 | キヤノン株式会社 | 電界効果トランジスタ及びそれを用いたセンサ並びにその製造方法 |
| US7294323B2 (en) * | 2004-02-13 | 2007-11-13 | Battelle Energy Alliance, Llc | Method of producing a chemical hydride |
| US7112455B2 (en) * | 2004-06-10 | 2006-09-26 | Freescale Semiconductor, Inc | Semiconductor optical devices and method for forming |
| US7514859B2 (en) * | 2004-12-20 | 2009-04-07 | Hewlett-Packard Development Company, L.P. | Ultraviolet emitter display apparatus |
| JP5110803B2 (ja) * | 2006-03-17 | 2012-12-26 | キヤノン株式会社 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
| JP5003013B2 (ja) * | 2006-04-25 | 2012-08-15 | 株式会社日立製作所 | シリコン発光ダイオード、シリコン光トランジスタ、シリコンレーザー及びそれらの製造方法。 |
| JP4920343B2 (ja) * | 2006-08-24 | 2012-04-18 | 浜松ホトニクス株式会社 | 半導体素子 |
| JP4920342B2 (ja) * | 2006-08-24 | 2012-04-18 | 浜松ホトニクス株式会社 | シリコン素子の製造方法 |
| US8399995B2 (en) * | 2009-01-16 | 2013-03-19 | Infineon Technologies Ag | Semiconductor device including single circuit element for soldering |
| US8260098B1 (en) * | 2011-02-17 | 2012-09-04 | Nxp B.V. | Optocoupler circuit |
| ITUB20152264A1 (it) * | 2015-07-17 | 2017-01-17 | St Microelectronics Srl | Dispositivo ad emissione di luce in silicio poroso e relativo metodo di fabbricazione |
| FR3118300B1 (fr) * | 2020-12-23 | 2022-12-09 | Univ Aix Marseille | Detecteur de particules comprenant une region poreuse realisee dans un materiau semi-conducteur et procede de fabrication associe |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4126955C2 (de) * | 1991-08-14 | 1994-05-05 | Fraunhofer Ges Forschung | Verfahren zum Herstellen von elektrolumineszenten Siliziumstrukturen |
| US5285078A (en) * | 1992-01-24 | 1994-02-08 | Nippon Steel Corporation | Light emitting element with employment of porous silicon and optical device utilizing light emitting element |
| DE4231310C1 (de) * | 1992-09-18 | 1994-03-24 | Siemens Ag | Verfahren zur Herstellung eines Bauelementes mit porösem Silizium |
| US5298767A (en) * | 1992-10-06 | 1994-03-29 | Kulite Semiconductor Products, Inc. | Porous silicon carbide (SiC) semiconductor device |
| US5324965A (en) * | 1993-03-26 | 1994-06-28 | The United States Of America As Represented By The Secretary Of The Army | Light emitting diode with electro-chemically etched porous silicon |
-
1994
- 1994-03-18 JP JP4902294A patent/JPH06338631A/ja active Pending
- 1994-03-28 DE DE69414898T patent/DE69414898T2/de not_active Expired - Fee Related
- 1994-03-28 EP EP94104882A patent/EP0618624B1/de not_active Expired - Lifetime
- 1994-03-28 AT AT94104882T patent/ATE174156T1/de not_active IP Right Cessation
-
1996
- 1996-06-27 US US08/670,150 patent/US5726464A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69414898D1 (de) | 1999-01-14 |
| JPH06338631A (ja) | 1994-12-06 |
| EP0618624B1 (de) | 1998-12-02 |
| EP0618624A2 (de) | 1994-10-05 |
| EP0618624A3 (de) | 1995-05-31 |
| DE69414898T2 (de) | 1999-06-10 |
| US5726464A (en) | 1998-03-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |