ATE180712T1 - Kathode für plasma-sputtering - Google Patents
Kathode für plasma-sputteringInfo
- Publication number
- ATE180712T1 ATE180712T1 AT94926067T AT94926067T ATE180712T1 AT E180712 T1 ATE180712 T1 AT E180712T1 AT 94926067 T AT94926067 T AT 94926067T AT 94926067 T AT94926067 T AT 94926067T AT E180712 T1 ATE180712 T1 AT E180712T1
- Authority
- AT
- Austria
- Prior art keywords
- pct
- date mar
- cathode
- sec
- plasma sputtering
- Prior art date
Links
- 238000002294 plasma sputter deposition Methods 0.000 title abstract 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000001513 hot isostatic pressing Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000004663 powder metallurgy Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/1209—Plural particulate metal components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12104—Particles discontinuous
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12104—Particles discontinuous
- Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/1216—Continuous interengaged phases of plural metals, or oriented fiber containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12181—Composite powder [e.g., coated, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
- Y10T428/12924—Fe-base has 0.01-1.7% carbon [i.e., steel]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
- Y10T428/1393—Multilayer [continuous layer]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Composite Materials (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE9300999A BE1007535A3 (nl) | 1993-09-24 | 1993-09-24 | Gelaagde metaalstructuur. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE180712T1 true ATE180712T1 (de) | 1999-06-15 |
Family
ID=3887360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT94926067T ATE180712T1 (de) | 1993-09-24 | 1994-09-23 | Kathode für plasma-sputtering |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5904966A (de) |
| EP (1) | EP0720530B1 (de) |
| JP (1) | JPH09503025A (de) |
| KR (1) | KR100331494B1 (de) |
| AT (1) | ATE180712T1 (de) |
| BE (1) | BE1007535A3 (de) |
| CA (1) | CA2171539C (de) |
| DE (1) | DE69418886T2 (de) |
| WO (1) | WO1995008438A1 (de) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6071389A (en) * | 1998-08-21 | 2000-06-06 | Tosoh Smd, Inc. | Diffusion bonded sputter target assembly and method of making |
| EP1135233A4 (de) * | 1998-12-03 | 2004-11-03 | Tosoh Smd Inc | Treffplatte und verfahren zu seiner herstellung |
| EP1147241B1 (de) * | 1998-12-29 | 2009-01-07 | Tosoh Smd, Inc. | Diffusionsgebundene sputtertargetanordnung und verfahren zu deren herstellung |
| US6521108B1 (en) | 1998-12-29 | 2003-02-18 | Tosoh Smd, Inc. | Diffusion bonded sputter target assembly and method of making same |
| US6277253B1 (en) * | 1999-10-06 | 2001-08-21 | Applied Materials, Inc. | External coating of tungsten or tantalum or other refractory metal on IMP coils |
| US6619537B1 (en) | 2000-06-12 | 2003-09-16 | Tosoh Smd, Inc. | Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers |
| DE10043748B4 (de) * | 2000-09-05 | 2004-01-15 | W. C. Heraeus Gmbh & Co. Kg | Zylinderförmiges Sputtertarget, Verfahren zu seiner Herstellung und Verwendung |
| US6524421B1 (en) * | 2000-09-22 | 2003-02-25 | Praxair Technology, Inc. | Cold isopressing method |
| US6708870B2 (en) | 2002-05-24 | 2004-03-23 | Praxair S.T. Technology, Inc. | Method for forming sputter target assemblies |
| FI20031249L (fi) * | 2003-09-03 | 2005-03-04 | Metso Powdermet Oy | Menetelmä valssimaisten tuotteiden valmistukseen |
| US8123107B2 (en) | 2004-05-25 | 2012-02-28 | Praxair S.T. Technology, Inc. | Method for forming sputter target assemblies |
| JP4466925B2 (ja) * | 2004-08-10 | 2010-05-26 | 日鉱金属株式会社 | フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット |
| DE102005017190A1 (de) * | 2005-04-13 | 2006-10-19 | W.C. Heraeus Gmbh | Verfahren zum Herstellen von rohrförmigen Sputtertargets, danach hergestellte Sputtertargets und deren Verwendung |
| TWI457133B (zh) | 2005-12-13 | 2014-10-21 | Glaxosmithkline Biolog Sa | 新穎組合物 |
| US20100178525A1 (en) * | 2009-01-12 | 2010-07-15 | Scott Campbell | Method for making composite sputtering targets and the tartets made in accordance with the method |
| US8115095B2 (en) * | 2009-02-20 | 2012-02-14 | Miasole | Protective layer for large-scale production of thin-film solar cells |
| US8110738B2 (en) * | 2009-02-20 | 2012-02-07 | Miasole | Protective layer for large-scale production of thin-film solar cells |
| US7785921B1 (en) * | 2009-04-13 | 2010-08-31 | Miasole | Barrier for doped molybdenum targets |
| US8134069B2 (en) | 2009-04-13 | 2012-03-13 | Miasole | Method and apparatus for controllable sodium delivery for thin film photovoltaic materials |
| US7897020B2 (en) * | 2009-04-13 | 2011-03-01 | Miasole | Method for alkali doping of thin film photovoltaic materials |
| US9284639B2 (en) * | 2009-07-30 | 2016-03-15 | Apollo Precision Kunming Yuanhong Limited | Method for alkali doping of thin film photovoltaic materials |
| US20110067998A1 (en) * | 2009-09-20 | 2011-03-24 | Miasole | Method of making an electrically conductive cadmium sulfide sputtering target for photovoltaic manufacturing |
| US8709335B1 (en) | 2009-10-20 | 2014-04-29 | Hanergy Holding Group Ltd. | Method of making a CIG target by cold spraying |
| US8709548B1 (en) | 2009-10-20 | 2014-04-29 | Hanergy Holding Group Ltd. | Method of making a CIG target by spray forming |
| US20110162696A1 (en) * | 2010-01-05 | 2011-07-07 | Miasole | Photovoltaic materials with controllable zinc and sodium content and method of making thereof |
| US9169548B1 (en) | 2010-10-19 | 2015-10-27 | Apollo Precision Fujian Limited | Photovoltaic cell with copper poor CIGS absorber layer and method of making thereof |
| US8048707B1 (en) | 2010-10-19 | 2011-11-01 | Miasole | Sulfur salt containing CIG targets, methods of making and methods of use thereof |
| US7935558B1 (en) | 2010-10-19 | 2011-05-03 | Miasole | Sodium salt containing CIG targets, methods of making and methods of use thereof |
| US10043921B1 (en) | 2011-12-21 | 2018-08-07 | Beijing Apollo Ding Rong Solar Technology Co., Ltd. | Photovoltaic cell with high efficiency cigs absorber layer with low minority carrier lifetime and method of making thereof |
| CN104364417A (zh) * | 2012-05-31 | 2015-02-18 | 东京毅力科创株式会社 | 磁控溅射装置 |
| US9255323B2 (en) | 2012-06-18 | 2016-02-09 | Apollo Precision Fujian Limited | Sputtering target including a feature to reduce chalcogen build up and arcing on a backing tube |
| EP3017890B1 (de) * | 2014-11-06 | 2021-06-09 | TI Automotive (Heidelberg) GmbH | Verfahren zur Herstellung eines mehrwandigen Rohres |
| AT14911U1 (de) * | 2015-05-06 | 2016-08-15 | Plansee Se | Rohrtarget |
| EP3406374B1 (de) * | 2017-05-24 | 2020-08-12 | MTC Powder Solutions AB | Verfahren zur herstellung einer komponente mit einem körper eines zementierten carbids und einem körper aus einer metalllegierung oder einem metallmatrixverbundstoff |
| WO2025138182A1 (zh) * | 2023-12-29 | 2025-07-03 | 瑞声声学科技(深圳)有限公司 | 机壳及电子设备 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3755887A (en) * | 1971-11-12 | 1973-09-04 | Continental Can Co | Method of making cobalt alloy steel composite article |
| GB1397258A (en) * | 1972-11-03 | 1975-06-11 | British Steel Corp | Method of providing an aluminium coating on a steel substrate |
| US3982314A (en) * | 1972-11-14 | 1976-09-28 | Kozo Yoshizaki | Method of producing tin coated steel sheet used for seamless steel container |
| US4065302A (en) * | 1975-12-29 | 1977-12-27 | The International Nickel Company, Inc. | Powdered metal consolidation method |
| US4135286A (en) * | 1977-12-22 | 1979-01-23 | United Technologies Corporation | Sputtering target fabrication method |
| US4495252A (en) * | 1980-01-16 | 1985-01-22 | Imperial Clevite Inc. | Wear-resistant metallic article |
| US4514470A (en) * | 1982-11-22 | 1985-04-30 | Avco Corporation | Diffusion bonding between titanium base alloys and steels |
| US4526839A (en) * | 1984-03-01 | 1985-07-02 | Surface Science Corp. | Process for thermally spraying porous metal coatings on substrates |
| US4578320A (en) * | 1984-03-09 | 1986-03-25 | Olin Corporation | Copper-nickel alloys for brazed articles |
| JPS60224704A (ja) * | 1984-04-20 | 1985-11-09 | Mazda Motor Corp | 低温焼結性粉末シ−ト |
| US4605599A (en) * | 1985-12-06 | 1986-08-12 | Teledyne Industries, Incorporated | High density tungsten alloy sheet |
| JPS62222060A (ja) * | 1986-03-20 | 1987-09-30 | Hitachi Metals Ltd | スパツタリング用タ−ゲツト |
| US4735868A (en) * | 1986-05-27 | 1988-04-05 | Olin Corporation | Composites having improved resistance to stress relaxation |
| JPS6361421A (ja) * | 1986-09-01 | 1988-03-17 | Nippon Telegr & Teleph Corp <Ntt> | Co−Cr薄膜の作製方法 |
| US4941920A (en) * | 1987-11-25 | 1990-07-17 | Hitachi Metals, Ltd. | Sintered target member and method of producing same |
| US5032469A (en) * | 1988-09-06 | 1991-07-16 | Battelle Memorial Institute | Metal alloy coatings and methods for applying |
| JPH0350808A (ja) * | 1989-07-19 | 1991-03-05 | Matsushita Electric Ind Co Ltd | 超構造窒化合金膜の作製方法 |
| JPH03240940A (ja) * | 1990-02-19 | 1991-10-28 | Sumitomo Heavy Ind Ltd | プラスチック成形機用スクリューおよびその製造方法 |
| US5283116A (en) * | 1990-04-17 | 1994-02-01 | Canon Kabushiki Kaisha | Sheet feeding member having a film containing inorganic powder |
| JPH0794707B2 (ja) * | 1990-06-25 | 1995-10-11 | 東洋鋼鈑株式会社 | 耐摩耗性、耐食性に優れたコーティング薄膜の製造方法 |
| JPH0539566A (ja) * | 1991-02-19 | 1993-02-19 | Mitsubishi Materials Corp | スパツタリング用ターゲツト及びその製造方法 |
| WO1992017622A1 (en) * | 1991-04-08 | 1992-10-15 | Tosoh Smd, Inc. | Thermally compatible sputter target and backing plate assembly |
| JPH04350161A (ja) * | 1991-05-27 | 1992-12-04 | Murata Mfg Co Ltd | スパッタ用ターゲット |
| JPH0586465A (ja) * | 1991-06-28 | 1993-04-06 | Mitsubishi Materials Corp | スパツタリング用ターゲツト及びその製造方法 |
| US5213904A (en) * | 1991-11-05 | 1993-05-25 | Explosive Fabricators, Inc. | Aluminum/steel transition joint |
| US5190831A (en) * | 1991-11-05 | 1993-03-02 | Explosive Fabricators, Inc. | Bonded titanium/steel components |
| JPH05214518A (ja) * | 1992-02-04 | 1993-08-24 | Hitachi Metals Ltd | スパッタリングターゲットとバッキングプレートの接合体の矯正方法およびスパッタリングターゲット材 |
| EP0574290B1 (de) * | 1992-06-05 | 1996-04-17 | Gec Alsthom Electromecanique Sa | Verfahren zum Anbringen von Schutzüberzügen bildenden Einsätzen auf Gegenständen aus martensitischens Stahl oder aus Titanlegierungen |
-
1993
- 1993-09-24 BE BE9300999A patent/BE1007535A3/nl not_active IP Right Cessation
-
1994
- 1994-09-23 US US08/617,864 patent/US5904966A/en not_active Expired - Fee Related
- 1994-09-23 DE DE69418886T patent/DE69418886T2/de not_active Expired - Fee Related
- 1994-09-23 JP JP7509447A patent/JPH09503025A/ja active Pending
- 1994-09-23 CA CA002171539A patent/CA2171539C/en not_active Expired - Fee Related
- 1994-09-23 AT AT94926067T patent/ATE180712T1/de not_active IP Right Cessation
- 1994-09-23 EP EP94926067A patent/EP0720530B1/de not_active Expired - Lifetime
- 1994-09-23 KR KR1019960701401A patent/KR100331494B1/ko not_active Expired - Fee Related
- 1994-09-23 WO PCT/BE1994/000059 patent/WO1995008438A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP0720530B1 (de) | 1999-06-02 |
| WO1995008438A1 (en) | 1995-03-30 |
| KR100331494B1 (ko) | 2002-11-20 |
| DE69418886T2 (de) | 1999-11-11 |
| JPH09503025A (ja) | 1997-03-25 |
| BE1007535A3 (nl) | 1995-07-25 |
| DE69418886D1 (de) | 1999-07-08 |
| CA2171539A1 (en) | 1995-03-30 |
| US5904966A (en) | 1999-05-18 |
| CA2171539C (en) | 2004-11-23 |
| KR960704702A (ko) | 1996-10-09 |
| EP0720530A1 (de) | 1996-07-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |