ATE183851T1 - Kubikpackung mit polyimidisolierung von gestapelten halbleiterchips - Google Patents

Kubikpackung mit polyimidisolierung von gestapelten halbleiterchips

Info

Publication number
ATE183851T1
ATE183851T1 AT94108520T AT94108520T ATE183851T1 AT E183851 T1 ATE183851 T1 AT E183851T1 AT 94108520 T AT94108520 T AT 94108520T AT 94108520 T AT94108520 T AT 94108520T AT E183851 T1 ATE183851 T1 AT E183851T1
Authority
AT
Austria
Prior art keywords
chip
cube
semiconductor chips
chips
stacked
Prior art date
Application number
AT94108520T
Other languages
English (en)
Inventor
Claude Louis Bertin
Sr Paul Alden Farrar
Wayne John Howell
Christopher Paul Miller
David Jacob Perlman
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE183851T1 publication Critical patent/ATE183851T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/834—Interconnections on sidewalls of chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Wire Bonding (AREA)
AT94108520T 1993-06-21 1994-06-03 Kubikpackung mit polyimidisolierung von gestapelten halbleiterchips ATE183851T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8045393A 1993-06-21 1993-06-21

Publications (1)

Publication Number Publication Date
ATE183851T1 true ATE183851T1 (de) 1999-09-15

Family

ID=22157489

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94108520T ATE183851T1 (de) 1993-06-21 1994-06-03 Kubikpackung mit polyimidisolierung von gestapelten halbleiterchips

Country Status (9)

Country Link
US (1) US5478781A (de)
EP (1) EP0631310B1 (de)
JP (1) JP2786597B2 (de)
KR (1) KR0145033B1 (de)
AT (1) ATE183851T1 (de)
CA (1) CA2118994A1 (de)
DE (1) DE69420201T2 (de)
ES (1) ES2135507T3 (de)
TW (1) TW234778B (de)

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Also Published As

Publication number Publication date
DE69420201T2 (de) 2000-03-23
KR0145033B1 (ko) 1998-07-01
TW234778B (en) 1994-11-21
DE69420201D1 (de) 1999-09-30
JP2786597B2 (ja) 1998-08-13
US5478781A (en) 1995-12-26
ES2135507T3 (es) 1999-11-01
CA2118994A1 (en) 1994-12-22
EP0631310A1 (de) 1994-12-28
JPH0883881A (ja) 1996-03-26
EP0631310B1 (de) 1999-08-25
KR950001997A (ko) 1995-01-04

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Legal Events

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UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee