ATE187377T1 - Schleifwerkzeug-bestandteil - Google Patents

Schleifwerkzeug-bestandteil

Info

Publication number
ATE187377T1
ATE187377T1 AT94915222T AT94915222T ATE187377T1 AT E187377 T1 ATE187377 T1 AT E187377T1 AT 94915222 T AT94915222 T AT 94915222T AT 94915222 T AT94915222 T AT 94915222T AT E187377 T1 ATE187377 T1 AT E187377T1
Authority
AT
Austria
Prior art keywords
pct
elements
working
tool component
sec
Prior art date
Application number
AT94915222T
Other languages
English (en)
Inventor
Stuart Martin Wilson
John Stirling Sexton
Derek Norman Wright
Original Assignee
De Beers Ind Diamond
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De Beers Ind Diamond filed Critical De Beers Ind Diamond
Application granted granted Critical
Publication of ATE187377T1 publication Critical patent/ATE187377T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00—Subject matter not provided for in other groups of this subclass
    • B24D99/005—Segments of abrasive wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/066—Grinding blocks; their mountings or supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Gripping On Spindles (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Processing Of Terminals (AREA)
AT94915222T 1993-05-14 1994-05-13 Schleifwerkzeug-bestandteil ATE187377T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB939309972A GB9309972D0 (en) 1993-05-14 1993-05-14 Tool insert

Publications (1)

Publication Number Publication Date
ATE187377T1 true ATE187377T1 (de) 1999-12-15

Family

ID=10735491

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94915222T ATE187377T1 (de) 1993-05-14 1994-05-13 Schleifwerkzeug-bestandteil

Country Status (12)

Country Link
US (1) US5607346A (de)
EP (1) EP0655024B1 (de)
JP (1) JPH08502930A (de)
AT (1) ATE187377T1 (de)
AU (1) AU682184B2 (de)
CA (1) CA2136014A1 (de)
DE (1) DE69422004T2 (de)
ES (1) ES2139075T3 (de)
GB (1) GB9309972D0 (de)
IL (1) IL109638A (de)
WO (1) WO1994026470A1 (de)
ZA (1) ZA943301B (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1269964B (it) * 1994-06-29 1997-04-16 S E A Utensili Diamantati S P Utensile porta-inserti diamantati per macchine automatiche e manuali tipo calibratrici, levigatrici e lucidatrici per l'industria lapidea, ceramica e piastrelle
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US6194317B1 (en) 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US8092707B2 (en) 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
IT246526Y1 (it) * 1999-02-16 2002-04-09 Master Service S R L Spazzola per il trattamento superficiale di materiali
JP2002050016A (ja) * 2000-07-28 2002-02-15 Fujitsu Ltd 磁気ヘッドスライダの製造方法及び装置
JP3789744B2 (ja) 2000-10-27 2006-06-28 富士通株式会社 ラッピング装置及びラッピング方法
SG90192A1 (en) * 2000-11-06 2002-07-23 Kinik Co A diamond grid cmp pad dresser
USD501857S1 (en) * 2003-04-24 2005-02-15 3M Innovative Properties Company Abrasive member
USD498654S1 (en) 2003-10-20 2004-11-23 Smith Abrasives, Inc. Diamond bench stone
KR101165114B1 (ko) * 2004-10-06 2012-07-12 라지브 바자즈 향상된 화학 기계적 평탄화 작업용 장치 및 방법
CN100513082C (zh) * 2004-10-06 2009-07-15 拉杰夫·巴贾 用于改善的化学机械抛光的方法和设备
US20070224925A1 (en) * 2006-03-21 2007-09-27 Rajeev Bajaj Chemical Mechanical Polishing Pad
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US8075745B2 (en) * 2004-11-29 2011-12-13 Semiquest Inc. Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
WO2006057720A1 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7815778B2 (en) * 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
US8398463B2 (en) 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
US7762871B2 (en) * 2005-03-07 2010-07-27 Rajeev Bajaj Pad conditioner design and method of use
USD576185S1 (en) * 2006-11-23 2008-09-02 Rin-Soon Park Abrasive segment
USD566141S1 (en) * 2007-02-23 2008-04-08 Rin-Soon Park Abrasive agent
US20090011679A1 (en) * 2007-04-06 2009-01-08 Rajeev Bajaj Method of removal profile modulation in cmp pads
US8894731B2 (en) * 2007-10-01 2014-11-25 Saint-Gobain Abrasives, Inc. Abrasive processing of hard and /or brittle materials
CA126366S (en) * 2007-12-07 2009-04-08 Rin Soon Park Grinding tip for grinder
US20090266002A1 (en) * 2008-04-29 2009-10-29 Rajeev Bajaj Polishing pad and method of use
CN102083586B (zh) * 2008-04-29 2015-08-12 塞米奎斯特股份有限公司 抛光垫片组合物与制造和使用方法
US20090313905A1 (en) * 2008-06-18 2009-12-24 Stephen Fisher Method and apparatus for assembly of cmp polishing pads
CN102076462B (zh) * 2008-07-02 2013-01-16 圣戈班磨料磨具有限公司 用于电子工业中的磨料切片工具
US8292692B2 (en) * 2008-11-26 2012-10-23 Semiquest, Inc. Polishing pad with endpoint window and systems and method using the same
CH701596B1 (de) * 2009-08-11 2013-08-15 Meister Abrasives Ag Abrichtwerkzeug.
ES1071330Y (es) * 2009-09-30 2010-05-12 Matilla Botella Raquel Pieza multicapa para el pulido de piedra
US10226853B2 (en) 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
JP2024535447A (ja) * 2021-09-29 2024-09-30 インテグリス・インコーポレーテッド 両面パッドコンディショナー

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1290990A (en) * 1916-05-09 1919-01-14 Francis Bancroft Abrading-disk.
US1953983A (en) * 1928-02-07 1934-04-10 Carborundum Co Manufacture of rubber bonded abrasive articles
US2000772A (en) * 1934-09-24 1935-05-07 William H Mcgill Grindstone
US2145888A (en) * 1936-06-06 1939-02-07 American Optical Corp Abrading tool
US2225193A (en) * 1937-09-15 1940-12-17 Carborundum Co Abrasive wheel
FR894614A (fr) * 1943-02-05 1944-12-29 Fromholt Et Janssens Ets Perfectionnements apportés aux meules abrasives
US3343308A (en) * 1965-12-30 1967-09-26 Fessel Paul Cutting and grinding devices
FR1533693A (fr) * 1967-08-04 1968-07-19 Tyrolit Schleifmittel Werke Sw Meule flexible
DE2238387A1 (de) * 1972-08-04 1974-03-28 Winter & Sohn Ernst Mehrschneidiges zerspanwerkzeug
DE2601788A1 (de) * 1976-01-20 1977-07-21 Effgen Fa Guenter Schleifscheibe o.dgl.
ZA781154B (en) * 1978-02-28 1979-09-26 De Beers Ind Diamond Abrasive bodies
FR2532875A1 (fr) * 1982-09-14 1984-03-16 Sti Applic Indles Diamant Meule a patins abrasifs multiples
JPS59156669A (ja) * 1983-02-21 1984-09-05 Sumitomo Electric Ind Ltd ソ−ブレ−ド用セグメント
DE8706303U1 (de) * 1987-05-02 1987-06-19 FAG Kugelfischer Georg Schäfer KGaA, 8720 Schweinfurt Schleifkörper
GB8720498D0 (en) * 1987-08-29 1987-10-07 Saville P A Tool/tools

Also Published As

Publication number Publication date
WO1994026470A1 (en) 1994-11-24
CA2136014A1 (en) 1994-11-24
ZA943301B (en) 1995-01-16
IL109638A0 (en) 1994-08-26
JPH08502930A (ja) 1996-04-02
EP0655024A1 (de) 1995-05-31
AU6655194A (en) 1994-12-12
US5607346A (en) 1997-03-04
EP0655024B1 (de) 1999-12-08
AU682184B2 (en) 1997-09-25
ES2139075T3 (es) 2000-02-01
GB9309972D0 (en) 1993-06-30
DE69422004D1 (de) 2000-01-13
DE69422004T2 (de) 2000-06-29
IL109638A (en) 1998-09-24

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