ATE191584T1 - Verfahren und vorrichtung zum strukturieren einer metallschicht in einem rf-plasma mit modulierung der substratsspannungsamplitude - Google Patents

Verfahren und vorrichtung zum strukturieren einer metallschicht in einem rf-plasma mit modulierung der substratsspannungsamplitude

Info

Publication number
ATE191584T1
ATE191584T1 AT96300487T AT96300487T ATE191584T1 AT E191584 T1 ATE191584 T1 AT E191584T1 AT 96300487 T AT96300487 T AT 96300487T AT 96300487 T AT96300487 T AT 96300487T AT E191584 T1 ATE191584 T1 AT E191584T1
Authority
AT
Austria
Prior art keywords
metal layer
etch
metal
substrate
power
Prior art date
Application number
AT96300487T
Other languages
English (en)
Inventor
Hiroji Hanawa
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE191584T1 publication Critical patent/ATE191584T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32697—Electrostatic control
    • H01J37/32706—Polarising the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/71—Etching of wafers, substrates or parts of devices using masks for conductive or resistive materials

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AT96300487T 1995-03-23 1996-01-24 Verfahren und vorrichtung zum strukturieren einer metallschicht in einem rf-plasma mit modulierung der substratsspannungsamplitude ATE191584T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/409,388 US5614060A (en) 1995-03-23 1995-03-23 Process and apparatus for etching metal in integrated circuit structure with high selectivity to photoresist and good metal etch residue removal

Publications (1)

Publication Number Publication Date
ATE191584T1 true ATE191584T1 (de) 2000-04-15

Family

ID=23620272

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96300487T ATE191584T1 (de) 1995-03-23 1996-01-24 Verfahren und vorrichtung zum strukturieren einer metallschicht in einem rf-plasma mit modulierung der substratsspannungsamplitude

Country Status (6)

Country Link
US (1) US5614060A (de)
EP (1) EP0734046B1 (de)
JP (1) JPH08339989A (de)
KR (1) KR100403115B1 (de)
AT (1) ATE191584T1 (de)
DE (1) DE69607509T2 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6902683B1 (en) * 1996-03-01 2005-06-07 Hitachi, Ltd. Plasma processing apparatus and plasma processing method
JP3220394B2 (ja) * 1996-09-27 2001-10-22 東京エレクトロン株式会社 プラズマ処理装置
US6214162B1 (en) 1996-09-27 2001-04-10 Tokyo Electron Limited Plasma processing apparatus
US5779807A (en) 1996-10-29 1998-07-14 Applied Materials, Inc. Method and apparatus for removing particulates from semiconductor substrates in plasma processing chambers
TWI231293B (en) 1997-11-12 2005-04-21 Jsr Corp Transfer film
US6379576B2 (en) 1997-11-17 2002-04-30 Mattson Technology, Inc. Systems and methods for variable mode plasma enhanced processing of semiconductor wafers
US6093332A (en) * 1998-02-04 2000-07-25 Lam Research Corporation Methods for reducing mask erosion during plasma etching
KR100521120B1 (ko) 1998-02-13 2005-10-12 가부시끼가이샤 히다치 세이사꾸쇼 반도체소자의 표면처리방법 및 장치
KR100528685B1 (ko) 1998-03-12 2005-11-15 가부시끼가이샤 히다치 세이사꾸쇼 시료의 표면 가공방법
US6218196B1 (en) 1998-05-06 2001-04-17 Mitsubishi Denki Kabushiki Kaisha Etching apparatus, etching method, manufacturing method of a semiconductor device, and semiconductor device
US6492277B1 (en) * 1999-09-10 2002-12-10 Hitachi, Ltd. Specimen surface processing method and apparatus
US6017826A (en) * 1998-10-05 2000-01-25 Chartered Semiconductor Manufacturing, Ltd. Chlorine containing plasma etch method with enhanced sidewall passivation and attenuated microloading effect
JP4351755B2 (ja) * 1999-03-12 2009-10-28 キヤノンアネルバ株式会社 薄膜作成方法および薄膜作成装置
JP3533105B2 (ja) * 1999-04-07 2004-05-31 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法と製造装置
KR100327346B1 (ko) 1999-07-20 2002-03-06 윤종용 선택적 폴리머 증착을 이용한 플라즈마 식각방법 및 이를이용한 콘택홀 형성방법
US6566272B2 (en) 1999-07-23 2003-05-20 Applied Materials Inc. Method for providing pulsed plasma during a portion of a semiconductor wafer process
JP2001168086A (ja) 1999-12-09 2001-06-22 Kawasaki Steel Corp 半導体装置の製造方法および製造装置
FR2811316B1 (fr) * 2000-07-06 2003-01-10 Saint Gobain Substrat texture transparent et procedes pour l'obtenir
US6544895B1 (en) * 2000-08-17 2003-04-08 Micron Technology, Inc. Methods for use of pulsed voltage in a plasma reactor
US6485572B1 (en) * 2000-08-28 2002-11-26 Micron Technology, Inc. Use of pulsed grounding source in a plasma reactor
US7349090B2 (en) * 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US6633831B2 (en) 2000-09-20 2003-10-14 Kla Tencor Technologies Methods and systems for determining a critical dimension and a thin film characteristic of a specimen
US6782337B2 (en) * 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US20040253823A1 (en) * 2001-09-17 2004-12-16 Taiwan Semiconductor Manufacturing Co. Dielectric plasma etch with deep uv resist and power modulation
US20030077910A1 (en) * 2001-10-22 2003-04-24 Russell Westerman Etching of thin damage sensitive layers using high frequency pulsed plasma
US20030153195A1 (en) * 2002-02-13 2003-08-14 Applied Materials, Inc. Method and apparatus for providing modulated bias power to a plasma etch reactor
US6700090B2 (en) 2002-04-26 2004-03-02 Hitachi High-Technologies Corporation Plasma processing method and plasma processing apparatus
US6759339B1 (en) 2002-12-13 2004-07-06 Silicon Magnetic Systems Method for plasma etching a microelectronic topography using a pulse bias power
US6942813B2 (en) * 2003-03-05 2005-09-13 Applied Materials, Inc. Method of etching magnetic and ferroelectric materials using a pulsed bias source
US7976673B2 (en) * 2003-05-06 2011-07-12 Lam Research Corporation RF pulsing of a narrow gap capacitively coupled reactor
US7521000B2 (en) * 2003-08-28 2009-04-21 Applied Materials, Inc. Process for etching photomasks
JP4931799B2 (ja) * 2004-03-22 2012-05-16 ケーエルエー−テンカー コーポレイション 基板の特徴を測定する、または分析のために基板を準備する方法およびシステム
US7879510B2 (en) * 2005-01-08 2011-02-01 Applied Materials, Inc. Method for quartz photomask plasma etching
US7790334B2 (en) * 2005-01-27 2010-09-07 Applied Materials, Inc. Method for photomask plasma etching using a protected mask
US7829243B2 (en) * 2005-01-27 2010-11-09 Applied Materials, Inc. Method for plasma etching a chromium layer suitable for photomask fabrication
US8293430B2 (en) * 2005-01-27 2012-10-23 Applied Materials, Inc. Method for etching a molybdenum layer suitable for photomask fabrication
US7148073B1 (en) 2005-03-15 2006-12-12 Kla-Tencor Technologies Corp. Methods and systems for preparing a copper containing substrate for analysis
US7394067B1 (en) 2005-07-20 2008-07-01 Kla-Tencor Technologies Corp. Systems and methods for reducing alteration of a specimen during analysis for charged particle based and other measurement systems
KR101170597B1 (ko) * 2006-05-10 2012-08-02 주성엔지니어링(주) 진폭변조 알에프 전력을 이용한 갭필 방법 및 이를 위한갭필 장치
US7786019B2 (en) * 2006-12-18 2010-08-31 Applied Materials, Inc. Multi-step photomask etching with chlorine for uniformity control
KR20100022146A (ko) * 2008-08-19 2010-03-02 삼성전자주식회사 플라즈마 공정장치 및 그 방법
JP2010118549A (ja) 2008-11-13 2010-05-27 Tokyo Electron Ltd プラズマエッチング方法及びプラズマエッチング装置
US8758638B2 (en) * 2011-05-10 2014-06-24 Applied Materials, Inc. Copper oxide removal techniques
US9401263B2 (en) * 2013-09-19 2016-07-26 Globalfoundries Inc. Feature etching using varying supply of power pulses
US10204794B2 (en) 2013-12-23 2019-02-12 Intel Corporation Advanced etching technologies for straight, tall and uniform fins across multiple fin pitch structures
US10332810B2 (en) 2016-10-24 2019-06-25 Kla-Tencor Corp. Process modules integrated into a metrology and/or inspection tool
JP6846387B2 (ja) * 2018-06-22 2021-03-24 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US11043387B2 (en) * 2019-10-30 2021-06-22 Applied Materials, Inc. Methods and apparatus for processing a substrate
JP7405347B2 (ja) 2021-05-18 2023-12-26 地方独立行政法人大阪産業技術研究所 尖度応答スペクトルを用いた振動制御装置
US12581926B2 (en) * 2021-07-14 2026-03-17 Applied Materials Inc. Methods and apparatus for processing a substrate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500563A (en) * 1982-12-15 1985-02-19 Pacific Western Systems, Inc. Independently variably controlled pulsed R.F. plasma chemical vapor processing
US4464223A (en) * 1983-10-03 1984-08-07 Tegal Corp. Plasma reactor apparatus and method
KR890004881B1 (ko) * 1983-10-19 1989-11-30 가부시기가이샤 히다찌세이사꾸쇼 플라즈마 처리 방법 및 그 장치
EP0149089B1 (de) * 1984-01-06 1989-11-23 Tegal Corporation Mehrfrequenz-Plasmagerät mit einer einzelnen Elektrode
KR900007687B1 (ko) * 1986-10-17 1990-10-18 가부시기가이샤 히다찌세이사꾸쇼 플라즈마처리방법 및 장치
JPH02109328A (ja) * 1988-10-18 1990-04-23 Nec Corp ドライエッチング方法およびそ装置
EP0395415B1 (de) * 1989-04-27 1995-03-15 Fujitsu Limited Gerät und Verfahren zur Bearbeitung einer Halbleitervorrichtung unter Verwendung eines durch Mikrowellen erzeugten Plasmas
US5332441A (en) * 1991-10-31 1994-07-26 International Business Machines Corporation Apparatus for gettering of particles during plasma processing
JP2988122B2 (ja) * 1992-05-14 1999-12-06 日本電気株式会社 ドライエッチング装置および半導体装置の製造方法
JP2941572B2 (ja) * 1992-08-11 1999-08-25 三菱電機株式会社 プラズマエッチング装置及び半導体装置の製造方法
US5261965A (en) * 1992-08-28 1993-11-16 Texas Instruments Incorporated Semiconductor wafer cleaning using condensed-phase processing
US5352324A (en) * 1992-11-05 1994-10-04 Hitachi, Ltd. Etching method and etching apparatus therefor

Also Published As

Publication number Publication date
EP0734046B1 (de) 2000-04-05
DE69607509D1 (de) 2000-05-11
JPH08339989A (ja) 1996-12-24
DE69607509T2 (de) 2000-08-10
EP0734046A2 (de) 1996-09-25
KR960035871A (ko) 1996-10-28
KR100403115B1 (ko) 2004-02-11
EP0734046A3 (de) 1996-10-02
US5614060A (en) 1997-03-25

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