ATE397992T1 - Verfahren und vorrichtung zum tauchbeloten - Google Patents

Verfahren und vorrichtung zum tauchbeloten

Info

Publication number
ATE397992T1
ATE397992T1 AT02250154T AT02250154T ATE397992T1 AT E397992 T1 ATE397992 T1 AT E397992T1 AT 02250154 T AT02250154 T AT 02250154T AT 02250154 T AT02250154 T AT 02250154T AT E397992 T1 ATE397992 T1 AT E397992T1
Authority
AT
Austria
Prior art keywords
solder
leads
circuit board
plate
piloting
Prior art date
Application number
AT02250154T
Other languages
English (en)
Inventor
Michael Tombs
Charles Kent
Original Assignee
Pillarhouse Int Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pillarhouse Int Ltd filed Critical Pillarhouse Int Ltd
Application granted granted Critical
Publication of ATE397992T1 publication Critical patent/ATE397992T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT02250154T 2001-01-10 2002-01-10 Verfahren und vorrichtung zum tauchbeloten ATE397992T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0100626A GB2371006B (en) 2001-01-10 2001-01-10 Nozzle for soldering apparatus

Publications (1)

Publication Number Publication Date
ATE397992T1 true ATE397992T1 (de) 2008-07-15

Family

ID=9906572

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02250154T ATE397992T1 (de) 2001-01-10 2002-01-10 Verfahren und vorrichtung zum tauchbeloten

Country Status (5)

Country Link
US (1) US7650851B2 (de)
EP (1) EP1222988B1 (de)
AT (1) ATE397992T1 (de)
DE (2) DE20200554U1 (de)
GB (1) GB2371006B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050069668A1 (en) * 2003-09-30 2005-03-31 Daodang Hung Q. Disk lubricant tank insert to suppress lubricant surface waves
US7358856B2 (en) * 2004-03-18 2008-04-15 Savi Technology, Inc. Two-phase commit synchronizing seal state
JP4370225B2 (ja) * 2004-08-19 2009-11-25 住友電装株式会社 プリント基板への端子実装方法、該方法で形成した端子実装プリント基板および該端子実装プリント基板を収容している電気接続箱
WO2011105034A1 (ja) * 2010-02-26 2011-09-01 パナソニック株式会社 半田付け装置
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten
DE102018105388A1 (de) * 2018-03-08 2019-09-12 Ersa Gmbh Lötdüse und Lötanlage
US20190337075A1 (en) * 2018-05-01 2019-11-07 Artos Engineering Company Systems and devices for improved solder dispensing
JP7340388B2 (ja) * 2019-08-21 2023-09-07 株式会社デンソーテン はんだ付け装置
EP3785837B1 (de) * 2019-08-27 2024-10-02 Illinois Tool Works, Inc. Düse, system und verfahren
EP3785838B1 (de) * 2019-08-27 2022-07-20 Illinois Tool Works, Inc. Lötbaugruppe, verfahren und verwendung

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2770875A (en) * 1952-06-09 1956-11-20 Motorola Inc Soldering machine
US3056370A (en) * 1955-10-14 1962-10-02 Fry S Metal Foundries Ltd Apparatus for soldering
US3196829A (en) * 1963-02-21 1965-07-27 Fry S Metal Foundries Ltd Soldering machines
US3151592A (en) * 1963-05-20 1964-10-06 Howard W Wegener Sump and nozzle for soldering machines
US3303983A (en) 1964-11-12 1967-02-14 Gen Dynamics Corp Ultrasonic soldering apparatus
US3565319A (en) * 1967-05-15 1971-02-23 Banner Ind Inc Apparatus for application of solder to circuit boards
US4527731A (en) * 1983-03-31 1985-07-09 At&T Technologies, Inc. Method and apparatus for applying stripes of solder to articles
US4545520A (en) * 1983-08-30 1985-10-08 At&T Technologies, Inc. Method and system for soldering insulation coated parts
EP0147000A1 (de) 1983-12-15 1985-07-03 Hollis Automation Inc. Massen-Lötwellensystem-I
US4684056A (en) * 1985-05-03 1987-08-04 Electrovert Limited Vibratory wave soldering
US4739919A (en) * 1987-06-15 1988-04-26 Northern Telecom Limited Masking of circuit boards for wave soldering
US4981249A (en) * 1988-08-31 1991-01-01 Matsushita Electric Industrial Co., Ltd. Automatic jet soldering apparatus
US5203489A (en) * 1991-12-06 1993-04-20 Electrovert Ltd. Gas shrouded wave soldering
US5227589A (en) * 1991-12-23 1993-07-13 Motorola, Inc. Plated-through interconnect solder thief
US5611480A (en) * 1992-03-03 1997-03-18 Pillarhouse International Limited Soldering process
US5679927A (en) * 1993-05-13 1997-10-21 Communications Technology Corporation Buried service wire closure
US5604333A (en) * 1994-11-30 1997-02-18 Intel Corporation Process and structure for a solder thief on circuit boards
DE19506874C1 (de) 1995-02-16 1996-04-25 Ersa Loettechnik Gmbh Schwall-Lötdüse
US5679929A (en) * 1995-07-28 1997-10-21 Solectron Corporqtion Anti-bridging pads for printed circuit boards and interconnecting substrates
JPH09107181A (ja) 1995-08-07 1997-04-22 Nippon Superia Shiya:Kk 噴流式はんだ付け装置
JPH09323165A (ja) 1996-06-04 1997-12-16 Sharp Corp 噴流半田槽ノズル
JPH1070360A (ja) * 1996-08-28 1998-03-10 Toshiba Corp 半田付装置
GB9703790D0 (en) * 1997-02-24 1997-04-16 Pillarhouse Int Ltd Soldering apparatus
GB2360237B (en) * 2000-03-16 2003-09-03 Evenoak Ltd Nozzle for soldering apparatus

Also Published As

Publication number Publication date
GB2371006B (en) 2005-05-04
US20020110636A1 (en) 2002-08-15
DE60227015D1 (de) 2008-07-24
EP1222988A3 (de) 2003-02-12
EP1222988A2 (de) 2002-07-17
EP1222988B1 (de) 2008-06-11
DE20200554U1 (de) 2002-05-29
GB0100626D0 (en) 2001-02-21
GB2371006A (en) 2002-07-17
US7650851B2 (en) 2010-01-26

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties