ATE204424T1 - Verfahren und vorrichtung zur prüfung von leiterplatten mit verschiedenen vergrösserungen - Google Patents

Verfahren und vorrichtung zur prüfung von leiterplatten mit verschiedenen vergrösserungen

Info

Publication number
ATE204424T1
ATE204424T1 AT95900530T AT95900530T ATE204424T1 AT E204424 T1 ATE204424 T1 AT E204424T1 AT 95900530 T AT95900530 T AT 95900530T AT 95900530 T AT95900530 T AT 95900530T AT E204424 T1 ATE204424 T1 AT E204424T1
Authority
AT
Austria
Prior art keywords
printed circuit
circuit board
inspection
inspection system
size
Prior art date
Application number
AT95900530T
Other languages
English (en)
Inventor
Harold Wasserman
Original Assignee
Control Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Control Automation Inc filed Critical Control Automation Inc
Application granted granted Critical
Publication of ATE204424T1 publication Critical patent/ATE204424T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Tests Of Electronic Circuits (AREA)
AT95900530T 1993-11-03 1994-11-03 Verfahren und vorrichtung zur prüfung von leiterplatten mit verschiedenen vergrösserungen ATE204424T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/147,342 US5517235A (en) 1993-11-03 1993-11-03 Method and apparatus for inspecting printed circuit boards at different magnifications
PCT/US1994/012703 WO1995012952A1 (en) 1993-11-03 1994-11-03 Method and apparatus for inspecting printed circuit boards at different magnifications

Publications (1)

Publication Number Publication Date
ATE204424T1 true ATE204424T1 (de) 2001-09-15

Family

ID=22521186

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95900530T ATE204424T1 (de) 1993-11-03 1994-11-03 Verfahren und vorrichtung zur prüfung von leiterplatten mit verschiedenen vergrösserungen

Country Status (6)

Country Link
US (1) US5517235A (de)
EP (1) EP0728399B1 (de)
AT (1) ATE204424T1 (de)
CA (1) CA2175696A1 (de)
DE (1) DE69427989T2 (de)
WO (1) WO1995012952A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5442443A (en) * 1993-04-08 1995-08-15 Polaroid Corporation Stereoscopic photon tunneling microscope
KR0168243B1 (ko) * 1994-12-19 1999-05-01 다떼이시 요시오 관측 영역 설정 방법 및 그 장치와, 이 관측 영역 설정 방법을 이용한 외관 검사 방법 및 그 장치
US5739846A (en) * 1996-02-05 1998-04-14 Universal Instruments Corporation Method of inspecting component placement accuracy for each first selected circuit board to be assembled of a batch
IE80676B1 (en) * 1996-08-02 1998-11-18 M V Research Limited A measurement system
US6075883A (en) 1996-11-12 2000-06-13 Robotic Vision Systems, Inc. Method and system for imaging an object or pattern
US5760893A (en) * 1996-12-24 1998-06-02 Teradyne, Inc. Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture
JPH10267628A (ja) * 1997-01-23 1998-10-09 Hitachi Ltd ３次元形状検出方法およびその装置並びに基板の製造方法
US5862973A (en) * 1997-01-30 1999-01-26 Teradyne, Inc. Method for inspecting solder paste in printed circuit board manufacture
US5995648A (en) * 1997-03-18 1999-11-30 Cognex Corporation Image processing system and method using subsampling with constraints such as time and uncertainty constraints
US6084663A (en) * 1997-04-07 2000-07-04 Hewlett-Packard Company Method and an apparatus for inspection of a printed circuit board assembly
EP0871027A3 (de) * 1997-04-07 1999-05-19 Hewlett-Packard Company Prüfung gedruckter Leiterplatten
US6381355B1 (en) 1997-08-19 2002-04-30 The Hong Kong University Of Science And Technology Inspection method for comparison of articles
US6061086A (en) * 1997-09-11 2000-05-09 Canopular East Inc. Apparatus and method for automated visual inspection of objects
US6674888B1 (en) * 1998-02-27 2004-01-06 Applied Materials, Inc. Tuning method for a processing machine
DE10025751A1 (de) * 2000-05-24 2001-12-06 Atg Test Systems Gmbh Verfahren zum Untersuchen einer leiterplatte an einem vorbestimmten Bereich der Leiterplatte und Vorrichtung zum Durchführen des Verfahrens
US6963076B1 (en) * 2000-07-31 2005-11-08 Xerox Corporation System and method for optically sensing defects in OPC devices
US20030031596A1 (en) * 2001-08-09 2003-02-13 Yokogawa Electric Corporation Biochip reader and fluorometric imaging apparatus
JP4179079B2 (ja) * 2002-08-30 2008-11-12 株式会社ニコン 電子カメラ及びその制御プログラム
US6996264B2 (en) * 2002-10-18 2006-02-07 Leco Corporation Indentation hardness test system
US20040150822A1 (en) * 2003-01-30 2004-08-05 Samsung Electronics Co., Ltd. Soldering inspection apparatus
US7869645B2 (en) * 2008-07-22 2011-01-11 Seiko Epson Corporation Image capture and calibratiion
US8090184B2 (en) 2008-07-23 2012-01-03 Seiko Epson Corporation Fault detection of a printed dot-pattern bitmap
US8269836B2 (en) * 2008-07-24 2012-09-18 Seiko Epson Corporation Image capture, alignment, and registration
WO2010068331A1 (en) 2008-12-10 2010-06-17 Applied Materials, Inc. Enhanced vision system for screen printing pattern alignment
US11216687B2 (en) * 2019-05-15 2022-01-04 Getac Technology Corporation Image detection scanning method for object surface defects and image detection scanning system thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4160263A (en) * 1978-05-15 1979-07-03 George R. Cogar Dual or multiple objective video microscope for superimposing spaced images
US4389669A (en) * 1981-02-27 1983-06-21 Ilc Data Device Corporation Opto-video inspection system
US4485409A (en) * 1982-03-29 1984-11-27 Measuronics Corporation Data acquisition system for large format video display
US4673988A (en) * 1985-04-22 1987-06-16 E.I. Du Pont De Nemours And Company Electronic mosaic imaging process
US4978220A (en) * 1988-03-04 1990-12-18 Cimflex Teknowledge Corporation Compensating system for inspecting potentially warped printed circuit boards
US5060065A (en) * 1990-02-23 1991-10-22 Cimflex Teknowledge Corporation Apparatus and method for illuminating a printed circuit board for inspection
US5245421A (en) * 1990-09-19 1993-09-14 Control Automation, Incorporated Apparatus for inspecting printed circuit boards with surface mounted components

Also Published As

Publication number Publication date
DE69427989D1 (de) 2001-09-20
US5517235A (en) 1996-05-14
EP0728399B1 (de) 2001-08-16
EP0728399A4 (de) 1996-07-10
EP0728399A1 (de) 1996-08-28
DE69427989T2 (de) 2002-04-11
CA2175696A1 (en) 1995-05-11
WO1995012952A1 (en) 1995-05-11

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Legal Events

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