ATE211044T1 - Polymere maske für sandstrahlen und verfahren zu deren anwendung - Google Patents

Polymere maske für sandstrahlen und verfahren zu deren anwendung

Info

Publication number
ATE211044T1
ATE211044T1 AT95103487T AT95103487T ATE211044T1 AT E211044 T1 ATE211044 T1 AT E211044T1 AT 95103487 T AT95103487 T AT 95103487T AT 95103487 T AT95103487 T AT 95103487T AT E211044 T1 ATE211044 T1 AT E211044T1
Authority
AT
Austria
Prior art keywords
sandblast
aqueous composition
resist
resist ink
sandblasting
Prior art date
Application number
AT95103487T
Other languages
English (en)
Inventor
Ikuo Suzuki
Original Assignee
Aicello Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aicello Chemical Co filed Critical Aicello Chemical Co
Application granted granted Critical
Publication of ATE211044T1 publication Critical patent/ATE211044T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Respiratory Apparatuses And Protective Means (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT95103487T 1994-03-14 1995-03-10 Polymere maske für sandstrahlen und verfahren zu deren anwendung ATE211044T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6900894A JP2901129B2 (ja) 1994-03-14 1994-03-14 サンドブラストレジストインキ

Publications (1)

Publication Number Publication Date
ATE211044T1 true ATE211044T1 (de) 2002-01-15

Family

ID=13390147

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95103487T ATE211044T1 (de) 1994-03-14 1995-03-10 Polymere maske für sandstrahlen und verfahren zu deren anwendung

Country Status (4)

Country Link
EP (1) EP0672500B1 (de)
JP (1) JP2901129B2 (de)
AT (1) ATE211044T1 (de)
DE (1) DE69524655T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5776408A (en) * 1996-08-23 1998-07-07 Eastman Kodak Company Method of engraving green ceramic articles
FR2770434A1 (fr) * 1997-11-05 1999-05-07 Jean Michel Hostein Procede de gravure a l'aide d'un masque de sablage - masque obtenu selon le procede
EP1197530A1 (de) * 2000-10-13 2002-04-17 Kissel & Wolf GmbH Siebdruckbarer Dispersionslack
EP1197351A1 (de) * 2000-10-13 2002-04-17 Kissel & Wolf GmbH Verfahren zur Herstellung eines Musters auf einem Substrat
JP4108067B2 (ja) 2004-06-21 2008-06-25 株式会社ピーアンドピーエフ 泡状殺菌・消毒・清浄剤用の組成物
FR2874843B1 (fr) * 2004-09-03 2006-12-08 Azynox Soc Par Actions Simplif Procede de gravure a matite variable par microbillage
JP5223229B2 (ja) * 2007-04-24 2013-06-26 コニカミノルタホールディングス株式会社 サンドブラスト用マスクを形成するためのインクジェットインクとそれを用いた凹凸画像形成方法
JP5852448B2 (ja) * 2012-01-20 2016-02-03 太陽ホールディングス株式会社 サンドブラストレジスト組成物、及びそれを用いた表面加工方法
EP3578296A1 (de) 2018-06-04 2019-12-11 Audi Ag Verfahren zum selektiven mattieren einer oberfläche
DE102019211858A1 (de) * 2019-08-07 2021-02-11 Audi Ag Verfahren zum Maskieren von zu mattierenden Oberflächen
CN112264281A (zh) * 2020-10-28 2021-01-26 哈尔滨电机厂有限责任公司 一种发电机组加工面喷砂防护方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152294A (en) * 1978-05-23 1979-11-30 Sakata Shokai Ltd Pattern preparing method
JPS60104938A (ja) * 1982-05-13 1985-06-10 Asahi Chem Ind Co Ltd 固体表面加工用マスク転写材
JPS608100A (ja) * 1983-06-28 1985-01-16 旭化成株式会社 吹き付け食刻方法
JPS6020862A (ja) * 1983-07-12 1985-02-02 Asahi Chem Ind Co Ltd サンドブラストによる段彫方法
JPS6020860A (ja) * 1983-07-12 1985-02-02 Hayakawa Rubber Co Ltd サンドブラスト彫刻法
US4764449A (en) * 1985-11-01 1988-08-16 The Chromaline Corporation Adherent sandblast photoresist laminate
DD248133A1 (de) * 1986-04-14 1987-07-29 Torgau Flachglas Siebdruckpaste
WO1992007303A1 (fr) * 1990-10-22 1992-04-30 Aicello Chemical Co., Ltd. Procede de gravure avec masque a image, et film stratifie photosensible pour ledit masque
JPH0651811B2 (ja) * 1990-11-05 1994-07-06 第一工業製薬株式会社 透湿性高分子アロイフィルムの製造方法
GB9116021D0 (en) * 1991-07-25 1991-09-11 Woodberry Bros & Haines Ltd Etching and engraving processes
JPH0578541A (ja) * 1991-09-20 1993-03-30 Sekisui Chem Co Ltd ポリ酢酸ビニル系エマルジヨン組成物
JP3167812B2 (ja) * 1992-11-20 2001-05-21 東京応化工業株式会社 サンドブラスト用感光性樹脂組成物及びこれを用いた積層フィルム

Also Published As

Publication number Publication date
DE69524655T2 (de) 2002-05-29
JP2901129B2 (ja) 1999-06-07
JPH07252444A (ja) 1995-10-03
EP0672500B1 (de) 2001-12-19
EP0672500A3 (de) 1996-05-29
DE69524655D1 (de) 2002-01-31
EP0672500A2 (de) 1995-09-20

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties