ATE215105T1 - Photostrukturierbare dielektrische zusammensetzungen - Google Patents
Photostrukturierbare dielektrische zusammensetzungenInfo
- Publication number
- ATE215105T1 ATE215105T1 AT97946879T AT97946879T ATE215105T1 AT E215105 T1 ATE215105 T1 AT E215105T1 AT 97946879 T AT97946879 T AT 97946879T AT 97946879 T AT97946879 T AT 97946879T AT E215105 T1 ATE215105 T1 AT E215105T1
- Authority
- AT
- Austria
- Prior art keywords
- polymer
- photoinitiator
- dielectric compositions
- polycyclic
- photostructurable dielectric
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 2
- 229920000642 polymer Polymers 0.000 abstract 3
- 125000003367 polycyclic group Chemical group 0.000 abstract 2
- 230000007062 hydrolysis Effects 0.000 abstract 1
- 238000006460 hydrolysis reaction Methods 0.000 abstract 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 125000001424 substituent group Chemical group 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
- C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
- C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Inorganic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Graft Or Block Polymers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3041096P | 1996-11-04 | 1996-11-04 | |
| PCT/US1997/020032 WO1998020394A1 (en) | 1996-11-04 | 1997-11-04 | Photodefinable dielectric compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE215105T1 true ATE215105T1 (de) | 2002-04-15 |
Family
ID=21854074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT97946879T ATE215105T1 (de) | 1996-11-04 | 1997-11-04 | Photostrukturierbare dielektrische zusammensetzungen |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6121340A (de) |
| EP (1) | EP0906588B1 (de) |
| AT (1) | ATE215105T1 (de) |
| AU (1) | AU5196998A (de) |
| CA (1) | CA2271382A1 (de) |
| DE (1) | DE69711378T2 (de) |
| ES (1) | ES2178017T3 (de) |
| TW (1) | TW493106B (de) |
| WO (1) | WO1998020394A1 (de) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000015014A (ko) * | 1998-08-26 | 2000-03-15 | 김영환 | 신규의 포토레지스트용 단량체, 중합체 및 이를 이용한 포토레지스트 조성물 |
| JP4714955B2 (ja) * | 1999-09-29 | 2011-07-06 | 日本ゼオン株式会社 | 環状オレフィン系付加重合体およびその製造方法 |
| JP4821943B2 (ja) * | 2001-05-30 | 2011-11-24 | Jsr株式会社 | 環状オレフィン系付加型共重合体の架橋体、架橋用組成物および架橋体の製造方法 |
| KR100816931B1 (ko) * | 2000-10-04 | 2008-03-25 | 제이에스알 가부시끼가이샤 | 시클릭 올레핀 부가 공중합체 조성물 및 가교-결합된 물질 |
| JP4737451B2 (ja) * | 2000-12-22 | 2011-08-03 | Jsr株式会社 | 架橋樹脂フィルム、およびその用途 |
| KR100583297B1 (ko) * | 2001-04-27 | 2006-05-24 | 미쓰이 가가쿠 가부시키가이샤 | 불소 함유 시클로올레핀 중합체, 이들의 시클로올레핀단량체, 이 중합체의 제조방법 및 이 중합체의 용도 |
| JP4645787B2 (ja) * | 2001-05-30 | 2011-03-09 | Jsr株式会社 | 液晶配向膜形成基板および液晶表示素子 |
| US20060020068A1 (en) | 2004-07-07 | 2006-01-26 | Edmund Elce | Photosensitive compositions based on polycyclic polymers for low stress, high temperature films |
| US7022790B2 (en) * | 2002-07-03 | 2006-04-04 | Sumitomo Bakelite Company, Ltd. | Photosensitive compositions based on polycyclic polymers |
| EP1551906A4 (de) * | 2002-10-16 | 2006-11-02 | Georgia Tech Res Inst | Polymere, verfahren zur verwendung dieser und verfahren zur zerlegung dieser |
| US6790914B2 (en) * | 2002-11-29 | 2004-09-14 | Jsr Corporation | Resin film and applications thereof |
| WO2004074933A2 (en) * | 2003-02-20 | 2004-09-02 | Promerus Llc | Dissolution rate modifiers for photoresist compositions |
| US20070063188A1 (en) * | 2003-04-11 | 2007-03-22 | Rantala Juha T | Low-k dielectric material |
| US7098525B2 (en) | 2003-05-08 | 2006-08-29 | 3M Innovative Properties Company | Organic polymers, electronic devices, and methods |
| US7279777B2 (en) | 2003-05-08 | 2007-10-09 | 3M Innovative Properties Company | Organic polymers, laminates, and capacitors |
| US7101654B2 (en) * | 2004-01-14 | 2006-09-05 | Promerus Llc | Norbornene-type monomers and polymers containing pendent lactone or sultone groups |
| US7378456B2 (en) * | 2004-01-30 | 2008-05-27 | Promerus Llc | Directly photodefinable polymer compositions and methods thereof |
| US20050192409A1 (en) * | 2004-02-13 | 2005-09-01 | Rhodes Larry F. | Polymers of polycyclic olefins having a polyhedral oligosilsesquioxane pendant group and uses thereof |
| JP4629367B2 (ja) * | 2004-05-31 | 2011-02-09 | 東レ・ダウコーニング株式会社 | 活性エネルギー線硬化型オルガノポリシロキサン樹脂組成物、光伝送部材およびその製造方法 |
| US7875686B2 (en) * | 2004-08-18 | 2011-01-25 | Promerus Llc | Polycycloolefin polymeric compositions for semiconductor applications |
| US7294568B2 (en) * | 2004-08-20 | 2007-11-13 | Intel Corporation | Formation of air gaps in an interconnect structure using a thin permeable hard mask and resulting structures |
| US8092628B2 (en) * | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
| US8771927B2 (en) * | 2009-04-15 | 2014-07-08 | Brewer Science Inc. | Acid-etch resistant, protective coatings |
| JP5212659B2 (ja) | 2010-07-30 | 2013-06-19 | 信越化学工業株式会社 | 高気体透過性環状オレフィン付加重合体の製造方法 |
| WO2015147792A1 (en) | 2014-03-24 | 2015-10-01 | Intel Corporation | Integration methods to fabricate internal spacers for nanowire devices |
| JP6550275B2 (ja) * | 2015-06-15 | 2019-07-24 | 東京応化工業株式会社 | ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品 |
| US9896527B2 (en) | 2016-03-01 | 2018-02-20 | Saudi Arabian Oil Company | Highly selective polynorbornene homopolymer membranes for natural gas upgrading |
| US20170370783A1 (en) * | 2016-06-24 | 2017-12-28 | The Regents Of The University Of Michigan | Nanoscale Temperature Sensor |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3330815A (en) * | 1964-03-24 | 1967-07-11 | Union Carbide Corp | Novel polynorbornenes, process for production thereof, and products produced therefrom |
| US3838115A (en) * | 1971-02-02 | 1974-09-24 | Copolymer Rubber & Chem Corp | Silyl-norbornene and interpolymers prepared of same |
| DE2314543C3 (de) * | 1973-03-23 | 1980-09-11 | Chemische Werke Huels Ag, 4370 Marl | Verfahren zur Herstellung von polymeren Kohlenwasserstoffen mit reaktiven Silylseitengruppen |
| US3920714A (en) * | 1972-11-16 | 1975-11-18 | Weber Heinrich | Process for the production of polymeric hydrocarbons with reactive silyl side groups |
| US5179171A (en) * | 1985-05-24 | 1993-01-12 | Mitsui Petrochemical Industries, Ltd. | Random copolymer, and process for production thereof |
| US5011730A (en) * | 1987-08-14 | 1991-04-30 | The B. F. Goodrich Company | Bulk polymerized cycloolefin circuit boards |
| JPH0242441A (ja) * | 1988-03-31 | 1990-02-13 | Nippon Zeon Co Ltd | 光学用薄膜体 |
| US5071701A (en) * | 1989-11-22 | 1991-12-10 | B. F. Goodrich Corporation | Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards |
| JP3087421B2 (ja) * | 1992-01-31 | 2000-09-11 | 日本ゼオン株式会社 | 反応性ケイ素基含有ノルボルネン系ポリマーの製造方法 |
| US5407970A (en) * | 1993-04-13 | 1995-04-18 | Minnesota Mining And Manufacturing Company | Radiation-curable poly(α-olefin) adhesives containing pendant olefinic funtionality |
| JPH07104474A (ja) * | 1993-09-30 | 1995-04-21 | Nippon Zeon Co Ltd | 感光性樹脂組成物 |
| US5468819A (en) * | 1993-11-16 | 1995-11-21 | The B.F. Goodrich Company | Process for making polymers containing a norbornene repeating unit by addition polymerization using an organo (nickel or palladium) complex |
| FR2724022B1 (fr) * | 1994-08-25 | 1996-09-20 | Alcatel Fibres Optiques | Fibre optique comprenant une couche protectrice, et procede de fabrication d'une telle fibre |
-
1997
- 1997-11-04 AT AT97946879T patent/ATE215105T1/de not_active IP Right Cessation
- 1997-11-04 US US08/964,080 patent/US6121340A/en not_active Expired - Lifetime
- 1997-11-04 DE DE69711378T patent/DE69711378T2/de not_active Expired - Lifetime
- 1997-11-04 AU AU51969/98A patent/AU5196998A/en not_active Abandoned
- 1997-11-04 WO PCT/US1997/020032 patent/WO1998020394A1/en not_active Ceased
- 1997-11-04 CA CA002271382A patent/CA2271382A1/en not_active Abandoned
- 1997-11-04 ES ES97946879T patent/ES2178017T3/es not_active Expired - Lifetime
- 1997-11-04 EP EP97946879A patent/EP0906588B1/de not_active Expired - Lifetime
- 1997-11-06 TW TW086116589A patent/TW493106B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US6121340A (en) | 2000-09-19 |
| TW493106B (en) | 2002-07-01 |
| EP0906588A1 (de) | 1999-04-07 |
| CA2271382A1 (en) | 1998-05-14 |
| AU5196998A (en) | 1998-05-29 |
| WO1998020394A1 (en) | 1998-05-14 |
| EP0906588B1 (de) | 2002-03-27 |
| DE69711378T2 (de) | 2002-10-24 |
| DE69711378D1 (de) | 2002-05-02 |
| ES2178017T3 (es) | 2002-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification | ||
| REN | Ceased due to non-payment of the annual fee |