ATE215972T1 - Fluorpolymerfüllstoffe enthaltende klebstoffzusammensetzungen und ihre verwendung - Google Patents

Fluorpolymerfüllstoffe enthaltende klebstoffzusammensetzungen und ihre verwendung

Info

Publication number
ATE215972T1
ATE215972T1 AT97932561T AT97932561T ATE215972T1 AT E215972 T1 ATE215972 T1 AT E215972T1 AT 97932561 T AT97932561 T AT 97932561T AT 97932561 T AT97932561 T AT 97932561T AT E215972 T1 ATE215972 T1 AT E215972T1
Authority
AT
Austria
Prior art keywords
fillers
fluropolymer
compositions containing
adhesive compositions
preparation
Prior art date
Application number
AT97932561T
Other languages
English (en)
Inventor
Stephen M Dershem
Deborah D Forray
Original Assignee
Quantum Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Materials Inc filed Critical Quantum Materials Inc
Application granted granted Critical
Publication of ATE215972T1 publication Critical patent/ATE215972T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F259/00—Macromolecular compounds obtained by polymerising monomers on to polymers of halogen containing monomers as defined in group C08F14/00
    • C08F259/08—Macromolecular compounds obtained by polymerising monomers on to polymers of halogen containing monomers as defined in group C08F14/00 on to polymers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
AT97932561T 1996-07-29 1997-07-08 Fluorpolymerfüllstoffe enthaltende klebstoffzusammensetzungen und ihre verwendung ATE215972T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/688,206 US5717034A (en) 1996-07-29 1996-07-29 Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
PCT/US1997/011945 WO1998004602A1 (en) 1996-07-29 1997-07-08 Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor

Publications (1)

Publication Number Publication Date
ATE215972T1 true ATE215972T1 (de) 2002-04-15

Family

ID=24763543

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97932561T ATE215972T1 (de) 1996-07-29 1997-07-08 Fluorpolymerfüllstoffe enthaltende klebstoffzusammensetzungen und ihre verwendung

Country Status (10)

Country Link
US (1) US5717034A (de)
EP (1) EP0915919B1 (de)
JP (1) JP3814301B2 (de)
KR (1) KR100309974B1 (de)
CN (1) CN1298753C (de)
AT (1) ATE215972T1 (de)
AU (1) AU3599097A (de)
DE (1) DE69711884D1 (de)
MY (1) MY118047A (de)
WO (1) WO1998004602A1 (de)

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US6831132B2 (en) * 2002-03-28 2004-12-14 Henkel Corporation Film adhesives containing maleimide compounds and methods for use thereof
CN101488480A (zh) * 2002-06-17 2009-07-22 亨凯尔公司 间层电介质和预施涂的模片连接粘合剂材料
US7199249B2 (en) * 2002-07-03 2007-04-03 Henkel Corporation Free radically polymerizable coupling agents
US6882058B2 (en) * 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US7884174B2 (en) * 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US8513375B2 (en) * 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
CN102585760A (zh) * 2004-03-19 2012-07-18 住友电木株式会社 树脂组合物及采用该树脂组合物制作的半导体装置
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
US7795362B2 (en) * 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
US8043534B2 (en) * 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) * 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US8287686B2 (en) * 2006-07-24 2012-10-16 Designer Molecules, Inc. Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
US8344076B2 (en) * 2006-12-19 2013-01-01 Designer Molecules, Inc. Hydrolytically resistant thermoset monomers
WO2008077141A1 (en) * 2006-12-19 2008-06-26 Designer Molecules, Inc. Rubber epoxy curatives and methods for use thereof
US20080262191A1 (en) * 2007-01-26 2008-10-23 Mizori Farhad G Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
WO2008124797A1 (en) * 2007-04-09 2008-10-16 Designer Molecules, Inc. Curatives for epoxy compositions
US8431655B2 (en) 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
US8039663B2 (en) 2007-04-09 2011-10-18 Designer Molecules, Inc. Monomers derived from pentacyclopentadecane dimethanol
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US20100056671A1 (en) * 2007-04-12 2010-03-04 Designer Molecules, Inc. Polyfunctional epoxy oligomers
US8063161B2 (en) * 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US7928153B2 (en) 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
US8398898B2 (en) * 2008-02-23 2013-03-19 Designer Molecules, Inc. Soluble metal salts for use as conductivity promoters
WO2009117729A2 (en) 2008-03-21 2009-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8013104B2 (en) * 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8158748B2 (en) 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US8217120B2 (en) * 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US8008419B2 (en) * 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8288591B2 (en) * 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8415812B2 (en) * 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties
CN104137240A (zh) * 2012-02-24 2014-11-05 日立化成株式会社 半导体用粘接剂、助熔剂、半导体装置的制造方法以及半导体装置
US10000670B2 (en) 2012-07-30 2018-06-19 Henkel IP & Holding GmbH Silver sintering compositions with fluxing or reducing agents for metal adhesion
JP5893233B1 (ja) 2013-02-01 2016-03-23 スリーエム イノベイティブ プロパティズ カンパニー 感圧性接着剤組成物及びそれを含む接着物品
TWI632207B (zh) 2013-07-01 2018-08-11 德商漢高智慧財產控股公司 奈米粒子墨水組成物、方法及應用
KR102172950B1 (ko) 2013-08-16 2020-11-03 헨켈 아이피 앤드 홀딩 게엠베하 서브마이크론 은 입자 잉크 조성물, 방법 및 응용
WO2015048575A1 (en) * 2013-09-26 2015-04-02 Designer Molecules, Inc. Low dielectric constant, low dielectric dissipation factor coatings, films and adhesives
TWI651387B (zh) 2013-09-30 2019-02-21 漢高智慧財產控股公司 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物
JP6679488B2 (ja) 2014-01-02 2020-04-15 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ナノ粒子フィラーを含むフィルム
CN115216150A (zh) 2014-02-24 2022-10-21 汉高知识产权控股有限责任公司 导热性预涂底部填充配制物及其用途
JP7519752B2 (ja) 2015-05-08 2024-07-22 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 焼結可能フィルムおよびペーストおよびその使用方法
KR102525468B1 (ko) 2015-07-29 2023-04-26 헨켈 아게 운트 코. 카게아아 3d tsv 패키지를 위한 사전-적용된 언더필 필름을 위한 장벽 필름-함유 구성방식 및 그의 용도
CN108602976A (zh) 2015-08-03 2018-09-28 汉高知识产权控股有限责任公司 通过沉积高导电性组合物实现电磁干扰屏蔽保护
CN108137903B (zh) 2015-10-07 2020-08-21 汉高知识产权控股有限责任公司 配制物及其用于3d tsv封装的用途
WO2017087228A1 (en) 2015-11-17 2017-05-26 Henkel IP & Holding GmbH Resin compositions for underfill film for three dimensional through silica via (tsv) packages and compositions useful for the preparation thereof
TWI738735B (zh) 2016-05-27 2021-09-11 德商漢高智慧財產控股公司 藉由毛細流動以於電子封裝中進行間隙塗覆及／或於其中或其間充填的組合物及其使用方法
JP7183159B2 (ja) 2016-08-30 2022-12-05 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 高屈折率を有する光安定性接着剤組成物、及びそのアセンブリ、物品、発光素子
TWI778976B (zh) 2016-09-15 2022-10-01 德商漢高股份有限及兩合公司 用於塗布與間隙填充應用之含石墨烯材料
KR102820190B1 (ko) 2019-12-20 2025-06-13 헨켈 아게 운트 코. 카게아아 금속 결합을 위한 구리 합금을 함유하는 은 소결 조성물
CN115785337B (zh) * 2022-12-09 2023-09-19 广东工业大学 一种低介电、高导热硅酮胶复合物及其制备方法和应用

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Also Published As

Publication number Publication date
DE69711884D1 (de) 2002-05-16
AU3599097A (en) 1998-02-20
WO1998004602A1 (en) 1998-02-05
KR20000000510A (ko) 2000-01-15
MY118047A (en) 2004-08-30
CN1298753C (zh) 2007-02-07
EP0915919A1 (de) 1999-05-19
EP0915919B1 (de) 2002-04-10
KR100309974B1 (ko) 2001-11-07
JP3814301B2 (ja) 2006-08-30
JP2000514496A (ja) 2000-10-31
CN1226903A (zh) 1999-08-25
US5717034A (en) 1998-02-10

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties