ATE218245T1 - Flächiges teil für halbleitergehäuse - Google Patents

Flächiges teil für halbleitergehäuse

Info

Publication number
ATE218245T1
ATE218245T1 AT96110773T AT96110773T ATE218245T1 AT E218245 T1 ATE218245 T1 AT E218245T1 AT 96110773 T AT96110773 T AT 96110773T AT 96110773 T AT96110773 T AT 96110773T AT E218245 T1 ATE218245 T1 AT E218245T1
Authority
AT
Austria
Prior art keywords
earth metal
alkaline earth
plate type
type member
semiconductor device
Prior art date
Application number
AT96110773T
Other languages
English (en)
Inventor
Mitsunori Kobayashi
Akira Fukui
Kouichi Takashima
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Application granted granted Critical
Publication of ATE218245T1 publication Critical patent/ATE218245T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/22—Conductive package substrates serving as an interconnection, e.g. metal plates having an heterogeneous or anisotropic structure

Landscapes

  • Powder Metallurgy (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
AT96110773T 1995-08-03 1996-07-02 Flächiges teil für halbleitergehäuse ATE218245T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7198302A JPH0945815A (ja) 1995-08-03 1995-08-03 半導体用パッケージ、該パッケージ用板状部材及びその製造方法

Publications (1)

Publication Number Publication Date
ATE218245T1 true ATE218245T1 (de) 2002-06-15

Family

ID=16388879

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96110773T ATE218245T1 (de) 1995-08-03 1996-07-02 Flächiges teil für halbleitergehäuse

Country Status (5)

Country Link
US (1) US5990548A (de)
EP (1) EP0757383B1 (de)
JP (1) JPH0945815A (de)
AT (1) ATE218245T1 (de)
DE (1) DE69621387T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100968A (ja) * 2001-09-21 2003-04-04 Toyota Industries Corp 放熱材及びその製造方法
DE102016125348B4 (de) * 2016-12-22 2020-06-25 Rogers Germany Gmbh Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines Trägersubstrats

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
JPS5946050A (ja) * 1982-09-09 1984-03-15 Narumi China Corp 半導体用セラミツクパツケ−ジ
US4965659A (en) * 1987-06-30 1990-10-23 Sumitomo Electric Industries, Ltd. Member for a semiconductor structure
JP2517024B2 (ja) * 1987-12-08 1996-07-24 新光電気工業株式会社 セラミックパッケ―ジとその製造方法
JPH01272733A (ja) * 1988-04-25 1989-10-31 Mitsubishi Shindoh Co Ltd 半導体装置用Ｃｕ合金製リードフレーム材
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
KR940010455B1 (ko) * 1992-09-24 1994-10-22 김영길 고강도, 우수한 전기전도도 및 열적안정성을 갖는 동(Cu)합금 및 그 제조방법

Also Published As

Publication number Publication date
EP0757383A3 (de) 1998-09-30
JPH0945815A (ja) 1997-02-14
EP0757383B1 (de) 2002-05-29
DE69621387D1 (de) 2002-07-04
DE69621387T2 (de) 2002-10-17
EP0757383A2 (de) 1997-02-05
US5990548A (en) 1999-11-23

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee