ATE223109T1 - Metall-halbleiter feldeffekttransistor hoher leistung und hoher frequenz, hergestellt aus siliziumcarbid - Google Patents

Metall-halbleiter feldeffekttransistor hoher leistung und hoher frequenz, hergestellt aus siliziumcarbid

Info

Publication number
ATE223109T1
ATE223109T1 AT92305417T AT92305417T ATE223109T1 AT E223109 T1 ATE223109 T1 AT E223109T1 AT 92305417 T AT92305417 T AT 92305417T AT 92305417 T AT92305417 T AT 92305417T AT E223109 T1 ATE223109 T1 AT E223109T1
Authority
AT
Austria
Prior art keywords
epitaxial layer
silicon carbide
effect transistor
semiconductor field
high frequency
Prior art date
Application number
AT92305417T
Other languages
English (en)
Inventor
John W Palmour
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Application granted granted Critical
Publication of ATE223109T1 publication Critical patent/ATE223109T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/80FETs having rectifying junction gate electrodes
    • H10D30/87FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
AT92305417T 1991-06-14 1992-06-12 Metall-halbleiter feldeffekttransistor hoher leistung und hoher frequenz, hergestellt aus siliziumcarbid ATE223109T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/715,560 US5270554A (en) 1991-06-14 1991-06-14 High power high frequency metal-semiconductor field-effect transistor formed in silicon carbide

Publications (1)

Publication Number Publication Date
ATE223109T1 true ATE223109T1 (de) 2002-09-15

Family

ID=24874555

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92305417T ATE223109T1 (de) 1991-06-14 1992-06-12 Metall-halbleiter feldeffekttransistor hoher leistung und hoher frequenz, hergestellt aus siliziumcarbid

Country Status (6)

Country Link
US (1) US5270554A (de)
EP (1) EP0518683B1 (de)
JP (1) JP3499884B2 (de)
AT (1) ATE223109T1 (de)
DE (1) DE69232748T2 (de)
ES (1) ES2181671T3 (de)

Families Citing this family (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6344663B1 (en) 1992-06-05 2002-02-05 Cree, Inc. Silicon carbide CMOS devices
US5925895A (en) * 1993-10-18 1999-07-20 Northrop Grumman Corporation Silicon carbide power MESFET with surface effect supressive layer
JP3085078B2 (ja) * 1994-03-04 2000-09-04 富士電機株式会社 炭化けい素電子デバイスの製造方法
KR0153878B1 (ko) * 1994-06-07 1998-10-15 쿠미하시 요시유키 탄화규소반도체장치와 그 제조방법
US5686737A (en) * 1994-09-16 1997-11-11 Cree Research, Inc. Self-aligned field-effect transistor for high frequency applications
US5766343A (en) * 1995-01-17 1998-06-16 The United States Of America As Represented By The Secretary Of The Navy Lower bandgap, lower resistivity, silicon carbide heteroepitaxial material, and method of making same
US6002148A (en) * 1995-06-30 1999-12-14 Motorola, Inc. Silicon carbide transistor and method
SE9601176D0 (sv) * 1996-03-27 1996-03-27 Abb Research Ltd A method for producing a semiconductor device having semiconductor layers of SiC by the use of an implanting step and a device produced thereby
SE9601175D0 (sv) * 1996-03-27 1996-03-27 Abb Research Ltd A method for producing a semiconductor device by the use of an implanting step and a device produced thereby
US5719409A (en) * 1996-06-06 1998-02-17 Cree Research, Inc. Silicon carbide metal-insulator semiconductor field effect transistor
DE19712561C1 (de) * 1997-03-25 1998-04-30 Siemens Ag SiC-Halbleiteranordnung mit hoher Kanalbeweglichkeit
US5969378A (en) * 1997-06-12 1999-10-19 Cree Research, Inc. Latch-up free power UMOS-bipolar transistor
US6121633A (en) * 1997-06-12 2000-09-19 Cree Research, Inc. Latch-up free power MOS-bipolar transistor
EP1014455B1 (de) 1997-07-25 2006-07-12 Nichia Corporation Halbleitervorrichtung aus einer nitridverbindung
US6559038B2 (en) 1997-11-18 2003-05-06 Technologies And Devices International, Inc. Method for growing p-n heterojunction-based structures utilizing HVPE techniques
US6472300B2 (en) 1997-11-18 2002-10-29 Technologies And Devices International, Inc. Method for growing p-n homojunction-based structures utilizing HVPE techniques
US6599133B2 (en) 1997-11-18 2003-07-29 Technologies And Devices International, Inc. Method for growing III-V compound semiconductor structures with an integral non-continuous quantum dot layer utilizing HVPE techniques
US6555452B2 (en) 1997-11-18 2003-04-29 Technologies And Devices International, Inc. Method for growing p-type III-V compound material utilizing HVPE techniques
US6849862B2 (en) * 1997-11-18 2005-02-01 Technologies And Devices International, Inc. III-V compound semiconductor device with an AlxByInzGa1-x-y-zN1-a-bPaAsb non-continuous quantum dot layer
US6476420B2 (en) 1997-11-18 2002-11-05 Technologies And Devices International, Inc. P-N homojunction-based structures utilizing HVPE growth III-V compound layers
US6890809B2 (en) * 1997-11-18 2005-05-10 Technologies And Deviles International, Inc. Method for fabricating a P-N heterojunction device utilizing HVPE grown III-V compound layers and resultant device
US6479839B2 (en) 1997-11-18 2002-11-12 Technologies & Devices International, Inc. III-V compounds semiconductor device with an AlxByInzGa1-x-y-zN non continuous quantum dot layer
US6559467B2 (en) 1997-11-18 2003-05-06 Technologies And Devices International, Inc. P-n heterojunction-based structures utilizing HVPE grown III-V compound layers
US20020047135A1 (en) * 1997-11-18 2002-04-25 Nikolaev Audrey E. P-N junction-based structures utilizing HVPE grown III-V compound layers
US6150680A (en) * 1998-03-05 2000-11-21 Welch Allyn, Inc. Field effect semiconductor device having dipole barrier
US6027954A (en) * 1998-05-29 2000-02-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Gas sensing diode and method of manufacturing
US6803243B2 (en) 2001-03-15 2004-10-12 Cree, Inc. Low temperature formation of backside ohmic contacts for vertical devices
US6884644B1 (en) 1998-09-16 2005-04-26 Cree, Inc. Low temperature formation of backside ohmic contacts for vertical devices
SE520119C2 (sv) * 1998-10-13 2003-05-27 Ericsson Telefon Ab L M Förfarande och anordning för hopkoppling av radiofrekvens-SiC-fälteffekttransistorer för högeffekttillämpningar
SE9900358D0 (sv) * 1999-02-03 1999-02-03 Ind Mikroelektronikcentrum Ab A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor
CA2361752C (en) * 1999-02-03 2011-05-10 Acreo Ab A lateral field effect transistor of sic, a method for production thereof and a use of such a transistor
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
WO2000052796A1 (en) 1999-03-04 2000-09-08 Nichia Corporation Nitride semiconductor laser element
US6396080B2 (en) 1999-05-18 2002-05-28 Cree, Inc Semi-insulating silicon carbide without vanadium domination
US6218680B1 (en) 1999-05-18 2001-04-17 Cree, Inc. Semi-insulating silicon carbide without vanadium domination
US6366266B1 (en) 1999-09-02 2002-04-02 Micron Technology, Inc. Method and apparatus for programmable field emission display
US6686616B1 (en) * 2000-05-10 2004-02-03 Cree, Inc. Silicon carbide metal-semiconductor field effect transistors
SE520109C2 (sv) 2000-05-17 2003-05-27 Ericsson Telefon Ab L M Effekttransistorer för radiofrekvenser
US6956238B2 (en) * 2000-10-03 2005-10-18 Cree, Inc. Silicon carbide power metal-oxide semiconductor field effect transistors having a shorting channel and methods of fabricating silicon carbide metal-oxide semiconductor field effect transistors having a shorting channel
WO2002054449A2 (en) * 2001-01-03 2002-07-11 Mississippi State University Silicon carbide and related wide-bandgap transistors on semi-insulating epitaxy for high-speed, high-power applications
JP2002252233A (ja) * 2001-02-22 2002-09-06 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US6909119B2 (en) * 2001-03-15 2005-06-21 Cree, Inc. Low temperature formation of backside ohmic contacts for vertical devices
US6507046B2 (en) * 2001-05-11 2003-01-14 Cree, Inc. High-resistivity silicon carbide substrate for semiconductor devices with high break down voltage
JP2003007976A (ja) * 2001-06-25 2003-01-10 Mitsubishi Electric Corp 半導体装置及びモジュール装置
US6906350B2 (en) * 2001-10-24 2005-06-14 Cree, Inc. Delta doped silicon carbide metal-semiconductor field effect transistors having a gate disposed in a double recess structure
US6956239B2 (en) * 2002-11-26 2005-10-18 Cree, Inc. Transistors having buried p-type layers beneath the source region
US7221010B2 (en) * 2002-12-20 2007-05-22 Cree, Inc. Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors
US7898047B2 (en) * 2003-03-03 2011-03-01 Samsung Electronics Co., Ltd. Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices
US7112860B2 (en) * 2003-03-03 2006-09-26 Cree, Inc. Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices
US7074643B2 (en) * 2003-04-24 2006-07-11 Cree, Inc. Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same
US6979863B2 (en) * 2003-04-24 2005-12-27 Cree, Inc. Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same
KR100553935B1 (ko) * 2003-08-20 2006-02-24 엘지.필립스 엘시디 주식회사 액정표시장치 및 그 제조방법
EP1690290A4 (de) * 2003-12-04 2008-10-22 Bae Systems Information Auf gan basierender permeabler basis-transistor und herstellungsverfahren
US20050127399A1 (en) * 2003-12-12 2005-06-16 Meadows Ronald C. Non-uniform gate pitch semiconductor devices
US7135747B2 (en) * 2004-02-25 2006-11-14 Cree, Inc. Semiconductor devices having thermal spacers
US7470967B2 (en) * 2004-03-12 2008-12-30 Semisouth Laboratories, Inc. Self-aligned silicon carbide semiconductor devices and methods of making the same
EP1743373B1 (de) 2004-03-19 2013-05-08 Fairchild Semiconductor Corporation Schottkydiode mit dauerhaftem Kontakt aus Siliziumcarbid und Verfahren zur Herstellung
JP4708722B2 (ja) * 2004-03-25 2011-06-22 新日本無線株式会社 炭化珪素半導体装置の製造方法
US7275357B2 (en) * 2004-03-30 2007-10-02 Cnh America Llc Cotton module program control using yield monitor signal
US7118970B2 (en) * 2004-06-22 2006-10-10 Cree, Inc. Methods of fabricating silicon carbide devices with hybrid well regions
US7238224B2 (en) * 2004-10-29 2007-07-03 Hewlett-Packard Development Company, L.P. Fluid-gas separator
US20060091606A1 (en) * 2004-10-28 2006-05-04 Gary Paugh Magnetic building game
US7265399B2 (en) * 2004-10-29 2007-09-04 Cree, Inc. Asymetric layout structures for transistors and methods of fabricating the same
US7348612B2 (en) * 2004-10-29 2008-03-25 Cree, Inc. Metal-semiconductor field effect transistors (MESFETs) having drains coupled to the substrate and methods of fabricating the same
JP2006165387A (ja) * 2004-12-09 2006-06-22 Sumitomo Electric Ind Ltd 双方向型電界効果トランジスタおよびマトリクスコンバータ
US7326962B2 (en) * 2004-12-15 2008-02-05 Cree, Inc. Transistors having buried N-type and P-type regions beneath the source region and methods of fabricating the same
CN101361189B (zh) * 2005-01-25 2011-02-16 莫克斯托尼克斯股份有限公司 高性能fet器件和方法
US7247550B2 (en) * 2005-02-08 2007-07-24 Teledyne Licensing, Llc Silicon carbide-based device contact and contact fabrication method
US7476594B2 (en) * 2005-03-30 2009-01-13 Cree, Inc. Methods of fabricating silicon nitride regions in silicon carbide and resulting structures
US7391057B2 (en) * 2005-05-18 2008-06-24 Cree, Inc. High voltage silicon carbide devices having bi-directional blocking capabilities
US7615801B2 (en) * 2005-05-18 2009-11-10 Cree, Inc. High voltage silicon carbide devices having bi-directional blocking capabilities
US7414268B2 (en) 2005-05-18 2008-08-19 Cree, Inc. High voltage silicon carbide MOS-bipolar devices having bi-directional blocking capabilities
US20060261346A1 (en) * 2005-05-18 2006-11-23 Sei-Hyung Ryu High voltage silicon carbide devices having bi-directional blocking capabilities and methods of fabricating the same
US7528040B2 (en) 2005-05-24 2009-05-05 Cree, Inc. Methods of fabricating silicon carbide devices having smooth channels
US8203185B2 (en) * 2005-06-21 2012-06-19 Cree, Inc. Semiconductor devices having varying electrode widths to provide non-uniform gate pitches and related methods
US20070018199A1 (en) 2005-07-20 2007-01-25 Cree, Inc. Nitride-based transistors and fabrication methods with an etch stop layer
US7402844B2 (en) * 2005-11-29 2008-07-22 Cree, Inc. Metal semiconductor field effect transistors (MESFETS) having channels of varying thicknesses and related methods
US7368971B2 (en) * 2005-12-06 2008-05-06 Cree, Inc. High power, high frequency switch circuits using strings of power transistors
JP5194380B2 (ja) 2006-04-28 2013-05-08 日産自動車株式会社 半導体装置
US8049272B2 (en) * 2006-06-16 2011-11-01 Cree, Inc. Transistors having implanted channel layers and methods of fabricating the same
US7821015B2 (en) * 2006-06-19 2010-10-26 Semisouth Laboratories, Inc. Silicon carbide and related wide-bandgap transistors on semi insulating epitaxy
US7728402B2 (en) 2006-08-01 2010-06-01 Cree, Inc. Semiconductor devices including schottky diodes with controlled breakdown
US8432012B2 (en) 2006-08-01 2013-04-30 Cree, Inc. Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same
US8710510B2 (en) 2006-08-17 2014-04-29 Cree, Inc. High power insulated gate bipolar transistors
US7646043B2 (en) * 2006-09-28 2010-01-12 Cree, Inc. Transistors having buried p-type layers coupled to the gate
US8823057B2 (en) 2006-11-06 2014-09-02 Cree, Inc. Semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices
US7582518B2 (en) * 2006-11-14 2009-09-01 Northrop Grumman Space & Mission Systems Corp. High electron mobility transistor semiconductor device and fabrication method thereof
US7880172B2 (en) * 2007-01-31 2011-02-01 Cree, Inc. Transistors having implanted channels and implanted P-type regions beneath the source region
US8835987B2 (en) 2007-02-27 2014-09-16 Cree, Inc. Insulated gate bipolar transistors including current suppressing layers
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
US8232558B2 (en) 2008-05-21 2012-07-31 Cree, Inc. Junction barrier Schottky diodes with current surge capability
US8288220B2 (en) * 2009-03-27 2012-10-16 Cree, Inc. Methods of forming semiconductor devices including epitaxial layers and related structures
US8294507B2 (en) 2009-05-08 2012-10-23 Cree, Inc. Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
US8193848B2 (en) 2009-06-02 2012-06-05 Cree, Inc. Power switching devices having controllable surge current capabilities
US8629509B2 (en) 2009-06-02 2014-01-14 Cree, Inc. High voltage insulated gate bipolar transistors with minority carrier diverter
US8541787B2 (en) 2009-07-15 2013-09-24 Cree, Inc. High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability
US8354690B2 (en) 2009-08-31 2013-01-15 Cree, Inc. Solid-state pinch off thyristor circuits
JP4985757B2 (ja) * 2009-12-25 2012-07-25 株式会社デンソー 炭化珪素半導体装置
JP2011159714A (ja) * 2010-01-29 2011-08-18 Denso Corp 炭化珪素半導体装置およびその製造方法
US9117739B2 (en) 2010-03-08 2015-08-25 Cree, Inc. Semiconductor devices with heterojunction barrier regions and methods of fabricating same
US8415671B2 (en) 2010-04-16 2013-04-09 Cree, Inc. Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices
US9029945B2 (en) 2011-05-06 2015-05-12 Cree, Inc. Field effect transistor devices with low source resistance
US9142662B2 (en) 2011-05-06 2015-09-22 Cree, Inc. Field effect transistor devices with low source resistance
CN102339868B (zh) * 2011-09-01 2013-08-14 西安电子科技大学 带反型隔离层结构的金属半导体场效应晶体管及制作方法
US8664665B2 (en) 2011-09-11 2014-03-04 Cree, Inc. Schottky diode employing recesses for elements of junction barrier array
WO2013036370A1 (en) 2011-09-11 2013-03-14 Cree, Inc. High current density power module comprising transistors with improved layout
US8618582B2 (en) 2011-09-11 2013-12-31 Cree, Inc. Edge termination structure employing recesses for edge termination elements
US9373617B2 (en) 2011-09-11 2016-06-21 Cree, Inc. High current, low switching loss SiC power module
US9640617B2 (en) 2011-09-11 2017-05-02 Cree, Inc. High performance power module
US8680587B2 (en) 2011-09-11 2014-03-25 Cree, Inc. Schottky diode
TW201417149A (zh) * 2012-10-31 2014-05-01 Lg伊諾特股份有限公司 磊晶晶圓
CN102931272A (zh) * 2012-11-23 2013-02-13 中国科学院微电子研究所 一种具有增益的紫外探测器结构及其制备方法
US9281196B2 (en) 2013-12-31 2016-03-08 Taiwan Semiconductor Manufacturing Co., Ltd. Method to reduce etch variation using ion implantation
US10134839B2 (en) * 2015-05-08 2018-11-20 Raytheon Company Field effect transistor structure having notched mesa
CN105261641A (zh) * 2015-08-21 2016-01-20 西安电子科技大学 异质结高电子迁移率自旋场效应晶体管及制造方法
CN105261642B (zh) * 2015-08-21 2019-04-12 西安电子科技大学 异质结高电子迁移率自旋场效应晶体管及制造方法
CN105304705B (zh) * 2015-08-21 2019-01-11 西安电子科技大学 异质结高电子迁移率自旋场效应晶体管及制造方法
US10818659B2 (en) 2018-10-16 2020-10-27 Globalfoundries Inc. FinFET having upper spacers adjacent gate and source/drain contacts
US10580701B1 (en) 2018-10-23 2020-03-03 Globalfoundries Inc. Methods of making a self-aligned gate contact structure and source/drain metallization structures on integrated circuit products
TW202220315A (zh) 2020-05-26 2022-05-16 立陶宛商布羅利思感測科技公司 具有可調式光學模式及載子分布於波導之光電裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134363A (en) * 1977-04-28 1978-11-22 Fujitsu Ltd Semiconductor device
JPS54155482U (de) * 1978-04-21 1979-10-29
US4762806A (en) * 1983-12-23 1988-08-09 Sharp Kabushiki Kaisha Process for producing a SiC semiconductor device
JPS60142568A (ja) * 1983-12-29 1985-07-27 Sharp Corp 炭化珪素電界効果トランジスタの製造方法
JPS60154674A (ja) * 1984-01-25 1985-08-14 Hitachi Ltd 電子装置の製造方法
JP2615390B2 (ja) * 1985-10-07 1997-05-28 工業技術院長 炭化シリコン電界効果トランジスタの製造方法
EP0252179B1 (de) * 1986-07-11 1992-05-27 International Business Machines Corporation Verfahren zur Herstellung einer unterätzten Maskenkontur
JPS6347983A (ja) * 1986-08-18 1988-02-29 Sharp Corp 炭化珪素電界効果トランジスタ
JPH0797660B2 (ja) * 1987-10-20 1995-10-18 三洋電機株式会社 SiC青色発光ダイオード
JPH0797659B2 (ja) * 1987-10-20 1995-10-18 三洋電機株式会社 SiC青色発光ダイオード
US4947218A (en) * 1987-11-03 1990-08-07 North Carolina State University P-N junction diodes in silicon carbide
JPH0798684B2 (ja) * 1988-01-19 1995-10-25 日本碍子株式会社 高密度SiC焼結体の製造方法
JP2612040B2 (ja) * 1988-06-28 1997-05-21 株式会社豊田中央研究所 β−SiCを用いたMOS・FET及びその製造方法
JPH0770695B2 (ja) * 1989-03-27 1995-07-31 シャープ株式会社 炭化珪素半導体装置の製造方法

Also Published As

Publication number Publication date
DE69232748T2 (de) 2003-08-07
JP3499884B2 (ja) 2004-02-23
ES2181671T3 (es) 2003-03-01
EP0518683A1 (de) 1992-12-16
EP0518683B1 (de) 2002-08-28
DE69232748D1 (de) 2002-10-02
JPH05175239A (ja) 1993-07-13
US5270554A (en) 1993-12-14

Similar Documents

Publication Publication Date Title
ATE223109T1 (de) Metall-halbleiter feldeffekttransistor hoher leistung und hoher frequenz, hergestellt aus siliziumcarbid
US5536953A (en) Wide bandgap semiconductor device including lightly doped active region
KR850005154A (ko) 화합물 반도체 집적회로 장치
SE9900008D0 (sv) Halvledaranordning och sätt att tillverka densamma
GB1465244A (en) Deep depletion insulated gate field effect transistors
DE69718477D1 (de) Siliciumcarbid-metall-isolator-halbleiter-feldeffekttransistor
EP1315212A4 (de) Halbleiterbauelement und verfahren zu seiner herstellung
GB1497626A (en) Field effect transistor
GB1153428A (en) Improvements in Semiconductor Devices.
GB1507091A (en) Schottky-gate field-effect transistors
JPH0624208B2 (ja) 半導体装置
DE69841384D1 (de) Leistungshalbleiteranordnung mit halbisolierendem Substrat
US5578512A (en) Power MESFET structure and fabrication process with high breakdown voltage and enhanced source to drain current
GB1152708A (en) Improvements in or relating to Semiconductor Devices.
KR900000584B1 (ko) 반도체 집적회로 장치
KR920015643A (ko) 전계효과트랜지스터
KR900019250A (ko) 화합물 반도체 장치
JPH02203566A (ja) Mos型半導体装置
GB1180758A (en) Improvements in or relating to Semiconductor Devices
KR960002889A (ko) 반도체 장치 및 그 제조방법
GB1108774A (en) Transistors
JPS5588372A (en) Lateral type transistor
GB1022159A (en) Transistors
JPH02153539A (ja) 化合物半導体装置
JPH04370977A (ja) 量子化電界効果トランジスタ

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties