ATE227194T1 - Polierkissen fur einen halbleitersubstrat - Google Patents

Polierkissen fur einen halbleitersubstrat

Info

Publication number
ATE227194T1
ATE227194T1 AT98918462T AT98918462T ATE227194T1 AT E227194 T1 ATE227194 T1 AT E227194T1 AT 98918462 T AT98918462 T AT 98918462T AT 98918462 T AT98918462 T AT 98918462T AT E227194 T1 ATE227194 T1 AT E227194T1
Authority
AT
Austria
Prior art keywords
polishing pad
semiconductor substrate
porous substrate
polishing
celled
Prior art date
Application number
AT98918462T
Other languages
English (en)
Inventor
Roland K Sevilla
Frank B Kaufman
Sriram P Anjur
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE227194T1 publication Critical patent/ATE227194T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT98918462T 1997-04-18 1998-04-17 Polierkissen fur einen halbleitersubstrat ATE227194T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4564697P 1997-04-18 1997-04-18
US5256597P 1997-07-15 1997-07-15
PCT/US1998/007908 WO1998047662A1 (en) 1997-04-18 1998-04-17 Polishing pad for a semiconductor substrate

Publications (1)

Publication Number Publication Date
ATE227194T1 true ATE227194T1 (de) 2002-11-15

Family

ID=26723048

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98918462T ATE227194T1 (de) 1997-04-18 1998-04-17 Polierkissen fur einen halbleitersubstrat

Country Status (12)

Country Link
US (1) US6062968A (de)
EP (1) EP1011922B1 (de)
JP (1) JP2001522316A (de)
KR (1) KR20010006518A (de)
CN (1) CN1258241A (de)
AT (1) ATE227194T1 (de)
AU (1) AU7138198A (de)
DE (1) DE69809265T2 (de)
ES (1) ES2187960T3 (de)
IL (1) IL132412A0 (de)
TW (1) TW447027B (de)
WO (1) WO1998047662A1 (de)

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JP2001522316A (ja) 2001-11-13
KR20010006518A (ko) 2001-01-26
US6062968A (en) 2000-05-16
ES2187960T3 (es) 2003-06-16
DE69809265T2 (de) 2003-03-27
TW447027B (en) 2001-07-21
IL132412A0 (en) 2001-03-19
EP1011922A1 (de) 2000-06-28
EP1011922B1 (de) 2002-11-06
WO1998047662A1 (en) 1998-10-29
DE69809265D1 (de) 2002-12-12
AU7138198A (en) 1998-11-13
CN1258241A (zh) 2000-06-28

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