ATE424040T1 - Wasserdurchlässiges klebeband für die verarbeitung von halbleitern - Google Patents

Wasserdurchlässiges klebeband für die verarbeitung von halbleitern

Info

Publication number
ATE424040T1
ATE424040T1 AT00106824T AT00106824T ATE424040T1 AT E424040 T1 ATE424040 T1 AT E424040T1 AT 00106824 T AT00106824 T AT 00106824T AT 00106824 T AT00106824 T AT 00106824T AT E424040 T1 ATE424040 T1 AT E424040T1
Authority
AT
Austria
Prior art keywords
water
adhesive tape
permeable adhesive
image
processing semiconductors
Prior art date
Application number
AT00106824T
Other languages
English (en)
Inventor
Walter Dr Eevers
Ann Issaris
Yoshiaki Mitsuoka
Yuuzou Akada
Original Assignee
Nitto Denko Corp
Nitto Europe Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp, Nitto Europe Nv filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE424040T1 publication Critical patent/ATE424040T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249958—Void-containing component is synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y10T428/249984—Adhesive or bonding component contains voids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2631—Coating or impregnation provides heat or fire protection
    • Y10T442/2713—Halogen containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2738—Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2738—Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith
    • Y10T442/2746—Heat-activatable adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2738—Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith
    • Y10T442/2754—Pressure-sensitive adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/674—Nonwoven fabric with a preformed polymeric film or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/674—Nonwoven fabric with a preformed polymeric film or sheet
    • Y10T442/679—Natural or synthetic rubber sheet or film

Landscapes

  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Materials For Medical Uses (AREA)
AT00106824T 2000-03-30 2000-03-30 Wasserdurchlässiges klebeband für die verarbeitung von halbleitern ATE424040T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00106824A EP1139415B1 (de) 2000-03-30 2000-03-30 Wasserdurchlässiges Klebeband für die Verarbeitung von Halbleitern

Publications (1)

Publication Number Publication Date
ATE424040T1 true ATE424040T1 (de) 2009-03-15

Family

ID=8168289

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00106824T ATE424040T1 (de) 2000-03-30 2000-03-30 Wasserdurchlässiges klebeband für die verarbeitung von halbleitern

Country Status (8)

Country Link
US (2) US20010055928A1 (de)
EP (1) EP1139415B1 (de)
JP (1) JP3824874B2 (de)
KR (1) KR100427566B1 (de)
AT (1) ATE424040T1 (de)
DE (1) DE60041632D1 (de)
SG (1) SG100662A1 (de)
TW (1) TW576861B (de)

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JP3484396B2 (ja) 2000-05-09 2004-01-06 新光電気工業株式会社 ウェハーの切断方法
US6720522B2 (en) * 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
DE10054159A1 (de) * 2000-11-02 2002-05-16 Wacker Siltronic Halbleitermat Verfahren zur Montage von Halbleiterscheiben
US6765174B2 (en) 2001-02-05 2004-07-20 Denso Corporation Method for machining grooves by a laser and honeycomb structure forming die and method for producing the same die
JP4087144B2 (ja) * 2001-04-23 2008-05-21 古河電気工業株式会社 レーザーダイシング用粘着テープ
JP2003173988A (ja) * 2001-12-04 2003-06-20 Furukawa Electric Co Ltd:The 半導体ウェハのダイシング方法
US6777647B1 (en) * 2003-04-16 2004-08-17 Scimed Life Systems, Inc. Combination laser cutter and cleaner
KR100557875B1 (ko) * 2003-08-21 2006-03-10 주식회사 애드텍 Ｐｖｃ 지지체를 포함하는 감압형 다이싱용 점착제테이프의 제조방법 및 점착제 테이프
JP4748941B2 (ja) * 2004-02-27 2011-08-17 リンテック株式会社 粘着シート
WO2005083023A1 (ja) * 2004-02-27 2005-09-09 Lintec Corporation 粘着シート
AU2005252530B2 (en) * 2004-06-14 2010-02-18 Lintec Corporation Adhesive sheet
JP4018096B2 (ja) 2004-10-05 2007-12-05 松下電器産業株式会社 半導体ウェハの分割方法、及び半導体素子の製造方法
JP4777104B2 (ja) * 2006-03-16 2011-09-21 富士通セミコンダクター株式会社 半導体装置包装用カバーテープ及び半導体装置用包装体
JP2008060170A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
JP2008085303A (ja) * 2006-08-29 2008-04-10 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
US9216850B2 (en) 2006-09-26 2015-12-22 Intercontinental Great Brands Llc Rupturable substrate
AU2007300728B2 (en) * 2006-09-26 2011-07-14 Intercontinental Great Brands Llc Rupturable blister package
JP2008117945A (ja) * 2006-11-06 2008-05-22 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
JP2008117943A (ja) * 2006-11-06 2008-05-22 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
JP2008270505A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp ウォータージェットレーザダイシング用粘着シート
JP5000370B2 (ja) * 2007-04-20 2012-08-15 日東電工株式会社 ウォータージェットレーザダイシング用粘着シート
WO2009031421A1 (ja) * 2007-09-07 2009-03-12 Dic Corporation 両面粘着テープ
JP5217557B2 (ja) * 2008-03-27 2013-06-19 パナソニック株式会社 電子部品の製造方法
BR112012020382A2 (pt) 2010-02-15 2016-05-10 Res & Tecnology Gmbh Const sistema de acabamento externo
KR101035353B1 (ko) * 2010-09-15 2011-05-20 주식회사 애니 테이프 통기성 자외선 핫멜트 테이프 및 그 제조방법
JP2012184324A (ja) * 2011-03-04 2012-09-27 Nitto Denko Corp 薄膜基板固定用粘接着シート
TWI409886B (zh) * 2011-08-05 2013-09-21 力成科技股份有限公司 防止晶粒破裂之晶粒拾取方法與裝置
WO2013048415A1 (en) 2011-09-29 2013-04-04 Intel Corporation Low temperature thin wafer backside vacuum process with backgrinding tape
KR101393895B1 (ko) * 2011-11-02 2014-05-13 (주)엘지하우시스 절단성이 우수한 반도체 웨이퍼 표면보호용 점착필름
JP5950669B2 (ja) * 2012-04-16 2016-07-13 日東電工株式会社 粘着シート及び粘着剤組成物
US10147630B2 (en) * 2014-06-11 2018-12-04 John Cleaon Moore Sectional porous carrier forming a temporary impervious support
JP6301243B2 (ja) * 2014-12-11 2018-03-28 三菱電機株式会社 半導体評価装置および半導体評価方法
JP6529684B2 (ja) * 2017-03-30 2019-06-12 古河電気工業株式会社 表面処理銅箔及びこれを用いた銅張積層板
US11791212B2 (en) 2019-12-13 2023-10-17 Micron Technology, Inc. Thin die release for semiconductor device assembly

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JPH0616524B2 (ja) * 1984-03-12 1994-03-02 日東電工株式会社 半導体ウエハ固定用接着薄板
JPS63136527A (ja) * 1986-11-27 1988-06-08 Nec Corp 半導体基板処理用粘着シ−ト
JPH02112258A (ja) * 1988-10-21 1990-04-24 Seiko Epson Corp 半導体装置用粘着テープ
JPH0736633B2 (ja) * 1990-10-31 1995-04-19 松下電器産業株式会社 スピーカ前面シート
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Also Published As

Publication number Publication date
KR20010095140A (ko) 2001-11-03
JP2001316648A (ja) 2001-11-16
TW576861B (en) 2004-02-21
US20010055928A1 (en) 2001-12-27
KR100427566B1 (ko) 2004-04-27
SG100662A1 (en) 2003-12-26
EP1139415B1 (de) 2009-02-25
US20070110955A1 (en) 2007-05-17
DE60041632D1 (de) 2009-04-09
EP1139415A1 (de) 2001-10-04
JP3824874B2 (ja) 2006-09-20
US7608328B2 (en) 2009-10-27

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