ATE228037T1 - Verfahren zur galvanischen herstellung eines rakels - Google Patents

Verfahren zur galvanischen herstellung eines rakels

Info

Publication number
ATE228037T1
ATE228037T1 AT97923561T AT97923561T ATE228037T1 AT E228037 T1 ATE228037 T1 AT E228037T1 AT 97923561 T AT97923561 T AT 97923561T AT 97923561 T AT97923561 T AT 97923561T AT E228037 T1 ATE228037 T1 AT E228037T1
Authority
AT
Austria
Prior art keywords
electroformed
squeegee blade
disclosed
squeegee
printed wiring
Prior art date
Application number
AT97923561T
Other languages
English (en)
Inventor
Karl W Fischbeck
Gary T Marks
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of ATE228037T1 publication Critical patent/ATE228037T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N10/00—Blankets or like coverings; Coverings for wipers for intaglio printing
    • B41N10/005—Coverings for wipers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Physical Vapour Deposition (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT97923561T 1996-05-03 1997-05-05 Verfahren zur galvanischen herstellung eines rakels ATE228037T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/646,380 US5746127A (en) 1996-05-03 1996-05-03 Electroformed squeegee blade for surface mount screen printing
PCT/US1997/007630 WO1997041969A1 (en) 1996-05-03 1997-05-05 Electroformed squeegee blade for surface mount screen printing

Publications (1)

Publication Number Publication Date
ATE228037T1 true ATE228037T1 (de) 2002-12-15

Family

ID=24592816

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97923561T ATE228037T1 (de) 1996-05-03 1997-05-05 Verfahren zur galvanischen herstellung eines rakels

Country Status (9)

Country Link
US (1) US5746127A (de)
EP (1) EP1015130B1 (de)
AT (1) ATE228037T1 (de)
AU (1) AU2933597A (de)
DE (1) DE69717319T2 (de)
DK (1) DK1015130T3 (de)
ES (1) ES2187777T3 (de)
PT (1) PT1015130E (de)
WO (1) WO1997041969A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2754474B1 (fr) * 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
DE69737281T2 (de) * 1996-12-10 2007-12-20 Matsushita Electric Industrial Co., Ltd., Kadoma Vorrichtung und Verfahren zum Drucken von Lötpaste
US5947021A (en) * 1997-11-04 1999-09-07 Photo Stencil, Inc. Metal squeegee blade with a titanium nitride coating
TW409490B (en) * 1998-12-31 2000-10-21 World Wiser Electronics Inc The equipment for plug hole process and the method thereof
US6550662B2 (en) * 2001-04-03 2003-04-22 Kyocera Wireless Corporation Chip rework solder tool
US6659002B2 (en) * 2001-10-31 2003-12-09 International Business Machines Corporation Screening apparatus with trailing squeegee and method of screening
US7105277B2 (en) * 2002-09-24 2006-09-12 Matsushita Electric Industrial Co., Ltd. Printing plate, circuit board and method of printing circuit board
US7726239B2 (en) * 2005-08-24 2010-06-01 Seagate Technology Llc Controlled deposition of printing material
US20070232055A1 (en) * 2006-03-31 2007-10-04 Richard Earl Corley Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component
US20130213247A1 (en) * 2012-02-17 2013-08-22 Samsung Electronics Co., Ltd. Stencil apparatus for printing solder paste
CN103287063B (zh) * 2012-02-29 2015-11-18 三星电子株式会社 用于印刷焊膏的漏印板设备
AU2014374104B2 (en) 2013-12-31 2020-02-20 Kenvue Brands Llc Process for forming a multi layered shaped film
CN105873573B (zh) 2013-12-31 2020-11-24 强生消费者公司 形成成型膜产品的方法
CN105873737A (zh) 2013-12-31 2016-08-17 强生消费者公司 形成多层成型膜产品的单程方法
JP6913248B2 (ja) * 2018-06-05 2021-08-04 ヤマハ発動機株式会社 印刷装置
US10960607B2 (en) * 2018-12-13 2021-03-30 General Electric Company Systems and methods for monitoring powder spreading in additive manufacturing systems
TWI698287B (zh) * 2019-08-27 2020-07-11 華碩電腦股份有限公司 液態金屬散熱膏塗佈方法及使用液態金屬散熱膏的散熱模組

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930455A (en) * 1974-09-19 1976-01-06 Harry Bremer Boat hull construction
JPH0288787A (ja) * 1988-09-27 1990-03-28 Matsushita Electric Works Ltd 電鋳刃
US5078082A (en) * 1989-08-16 1992-01-07 Smt East Corporation Method and apparatus for applying bonding material to a populated mounting surface
US5044306A (en) * 1990-06-11 1991-09-03 Gunter Erdmann Solder applying mechanism
JP3004416B2 (ja) * 1991-09-13 2000-01-31 理想科学工業株式会社 孔版印刷装置のインキ供給用スキージ装置
JP3025361B2 (ja) * 1992-02-07 2000-03-27 理想科学工業株式会社 孔版印刷装置のブレード式スキージ装置
US5478699A (en) * 1992-03-12 1995-12-26 Amtx, Inc. Method for preparing a screen printing stencil
US5254362A (en) * 1992-10-23 1993-10-19 Motorola, Inc. Method and apparatus for deposition of solder paste on a printed wiring board
US5387044A (en) * 1993-12-15 1995-02-07 Accardo; Thomas A. Screen filler applicator for the screen printing industry

Also Published As

Publication number Publication date
ES2187777T3 (es) 2003-06-16
DK1015130T3 (da) 2003-03-17
EP1015130B1 (de) 2002-11-20
AU2933597A (en) 1997-11-26
WO1997041969A1 (en) 1997-11-13
PT1015130E (pt) 2003-03-31
EP1015130A1 (de) 2000-07-05
EP1015130A4 (de) 2000-07-05
US5746127A (en) 1998-05-05
DE69717319D1 (de) 2003-01-02
DE69717319T2 (de) 2003-04-03

Similar Documents

Publication Publication Date Title
ATE228037T1 (de) Verfahren zur galvanischen herstellung eines rakels
DE69842001D1 (de) Galvanisches verfahren zur herstellung einer mehrlagenstruktur
DE59503657D1 (de) Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten
US4651417A (en) Method for forming printed circuit board
EP0186185A3 (de) Kontinuierliches Verfahren zur Herstellung metallischer Muster auf einem Dunnfilmsubstrat
DE69322970D1 (de) Herstellung und benutzung einer siebdruckschablone mit erhöhten kanten
DE59801021D1 (de) Wässriges bad und verfahren zum elektrolytischen abscheiden von kupferschichten
AU748566C (en) Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
DE69834548D1 (de) Ein elektrolytisch verfahren zur herstellung einer ein mineral enthaltende beschichtung
DE59712914D1 (de) Verfahren zur Herstellung von starren und flexiblen Schaltungen
EP0402315A3 (de) Verfahren zur Herstellung eines metallischen Musters auf einem Substrat
DE59004525D1 (de) Verfahren zur beschichtung elektrisch leitfähiger substrate.
WO2004021749A3 (en) Manufacture of flexible printed circuit boards
JPS59215790A (ja) 印刷回路板の製造法
ATE162923T1 (de) Verfahren zur herstellung einer leiterplatte.
EP0820095A3 (de) Herstellungsverfahren für eine Zwischenschicht
JPH10250032A (ja) 印刷用メタルマスク
KR970032314A (ko) 회로기판 제조방법
JPH09506468A (ja) プリント回路基板の製造方法
JP3517286B2 (ja) 電着転写用原版およびその製造方法
JPH08290686A (ja) 印刷用メタルマスク
TW280086B (en) A manufacture method for integrated printing circuits
GB2217918A (en) Method of manufacturing printed circuit boards
JPS61124600A (ja) フレ−ムパタ−ンの形成方法
TW429568B (en) Method for thick film coating via hole sidewalls

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1015130

Country of ref document: EP

REN Ceased due to non-payment of the annual fee