ATE230526T1 - Electrostatische halterorrichtung - Google Patents

Electrostatische halterorrichtung

Info

Publication number
ATE230526T1
ATE230526T1 AT99971977T AT99971977T ATE230526T1 AT E230526 T1 ATE230526 T1 AT E230526T1 AT 99971977 T AT99971977 T AT 99971977T AT 99971977 T AT99971977 T AT 99971977T AT E230526 T1 ATE230526 T1 AT E230526T1
Authority
AT
Austria
Prior art keywords
electrodes
holder device
maintaining
electrostatic
treatment
Prior art date
Application number
AT99971977T
Other languages
English (en)
Inventor
Yvon Pellegrin
Jose Hernandez
Richard Claude
William Hale
Original Assignee
Semco Engineering S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semco Engineering S A filed Critical Semco Engineering S A
Application granted granted Critical
Publication of ATE230526T1 publication Critical patent/ATE230526T1/de

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
AT99971977T 1998-11-10 1999-11-10 Electrostatische halterorrichtung ATE230526T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9814161A FR2785737B1 (fr) 1998-11-10 1998-11-10 Dispositif de maintien electrostatique
PCT/FR1999/002767 WO2000028654A1 (fr) 1998-11-10 1999-11-10 Dispositif de maintien electrostatique

Publications (1)

Publication Number Publication Date
ATE230526T1 true ATE230526T1 (de) 2003-01-15

Family

ID=9532599

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99971977T ATE230526T1 (de) 1998-11-10 1999-11-10 Electrostatische halterorrichtung

Country Status (9)

Country Link
EP (1) EP1138111B1 (de)
JP (1) JP4763890B2 (de)
AT (1) ATE230526T1 (de)
AU (1) AU1166500A (de)
CA (1) CA2350653C (de)
DE (1) DE69904755T2 (de)
DK (1) DK1138111T3 (de)
FR (1) FR2785737B1 (de)
WO (1) WO2000028654A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7232591B2 (en) * 2002-04-09 2007-06-19 Matsushita Electric Industrial Co., Ltd. Method of using an adhesive for temperature control during plasma processing
FR2878371B1 (fr) * 2004-11-25 2007-03-02 Semco Engineering Sa Sa Dispositif de maintien electrostatique a plusieurs sources d'alimentation
WO2014157014A1 (ja) * 2013-03-29 2014-10-02 株式会社クリエイティブ テクノロジー チャック装置
US12578066B2 (en) 2016-05-04 2026-03-17 Infinity X1 Llc Adaptive flashlight control module
TW201740771A (zh) 2016-05-04 2017-11-16 Idea Pond Llc 自動感應手電筒控制組件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724510A (en) * 1986-12-12 1988-02-09 Tegal Corporation Electrostatic wafer clamp
JPS63257481A (ja) * 1987-04-14 1988-10-25 Abisare:Kk 静電保持装置
US5001594A (en) * 1989-09-06 1991-03-19 Mcnc Electrostatic handling device
JPH0435043A (ja) * 1990-05-31 1992-02-05 Fujitsu Ltd 静電チャック装置
US5055964A (en) * 1990-09-07 1991-10-08 International Business Machines Corporation Electrostatic chuck having tapered electrodes
JPH04132239A (ja) * 1990-09-21 1992-05-06 Fujitsu Ltd ウエハーチャック
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
WO1994011944A1 (en) * 1992-11-06 1994-05-26 Varian Associates, Inc. Electrostatic wafer clamp
JPH0855900A (ja) * 1994-08-11 1996-02-27 Fujitsu Ltd 静電吸着方法とその装置と半導体装置の製造方法
JP4079992B2 (ja) * 1994-10-17 2008-04-23 バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法
JP3191139B2 (ja) * 1994-12-14 2001-07-23 株式会社日立製作所 試料保持装置
JP3911787B2 (ja) * 1996-09-19 2007-05-09 株式会社日立製作所 試料処理装置及び試料処理方法

Also Published As

Publication number Publication date
WO2000028654A1 (fr) 2000-05-18
DK1138111T3 (da) 2003-04-22
CA2350653A1 (fr) 2000-05-18
FR2785737B1 (fr) 2001-01-05
JP2003520416A (ja) 2003-07-02
AU1166500A (en) 2000-05-29
EP1138111B1 (de) 2003-01-02
DE69904755T2 (de) 2003-10-16
JP4763890B2 (ja) 2011-08-31
CA2350653C (fr) 2008-01-15
EP1138111A1 (de) 2001-10-04
DE69904755D1 (de) 2003-02-06
FR2785737A1 (fr) 2000-05-12

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