ATE233131T1 - System zum reinigen von halbleiterscheiben mit megasonischer wanderwelle - Google Patents

System zum reinigen von halbleiterscheiben mit megasonischer wanderwelle

Info

Publication number
ATE233131T1
ATE233131T1 AT99307796T AT99307796T ATE233131T1 AT E233131 T1 ATE233131 T1 AT E233131T1 AT 99307796 T AT99307796 T AT 99307796T AT 99307796 T AT99307796 T AT 99307796T AT E233131 T1 ATE233131 T1 AT E233131T1
Authority
AT
Austria
Prior art keywords
megasonic
wave
cleaning semiconductor
semiconductor discs
cleaning
Prior art date
Application number
AT99307796T
Other languages
English (en)
Inventor
Hiroyuki Akatsu
Soichi Nadahara
Original Assignee
Ibm
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm, Toshiba Kk filed Critical Ibm
Application granted granted Critical
Publication of ATE233131T1 publication Critical patent/ATE233131T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Cleaning By Liquid Or Steam (AREA)
AT99307796T 1998-11-10 1999-10-04 System zum reinigen von halbleiterscheiben mit megasonischer wanderwelle ATE233131T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/189,429 US6021789A (en) 1998-11-10 1998-11-10 Wafer cleaning system with progressive megasonic wave

Publications (1)

Publication Number Publication Date
ATE233131T1 true ATE233131T1 (de) 2003-03-15

Family

ID=22697291

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99307796T ATE233131T1 (de) 1998-11-10 1999-10-04 System zum reinigen von halbleiterscheiben mit megasonischer wanderwelle

Country Status (5)

Country Link
US (1) US6021789A (de)
EP (1) EP1000673B1 (de)
JP (1) JP2000150440A (de)
AT (1) ATE233131T1 (de)
DE (1) DE69905538T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
DE10030718A1 (de) * 2000-06-23 2002-01-10 Univ Ilmenau Tech Verfahren und Vorrichtung zum Reinigen von Gegenständen mit Schallwellen
AU2001270205A1 (en) * 2000-06-26 2002-01-08 Applied Materials, Inc. Method and apparatus for wafer cleaning
US7451774B2 (en) * 2000-06-26 2008-11-18 Applied Materials, Inc. Method and apparatus for wafer cleaning
US6763378B1 (en) * 2000-10-12 2004-07-13 International Business Machines Corporation Synchronous TCP/IP port monitor for enhanced computer system security
US7105985B2 (en) * 2001-04-23 2006-09-12 Product Systems Incorporated Megasonic transducer with focused energy resonator
JP4114188B2 (ja) 2001-06-12 2008-07-09 アクリオン テクノロジーズ， インコーポレイテッド メガソニック洗浄乾燥システム
US7100304B2 (en) * 2001-06-12 2006-09-05 Akrion Technologies, Inc. Megasonic cleaner and dryer
US20030015494A1 (en) * 2001-07-20 2003-01-23 Seagate Technology Llc Single layer resist lift-off process and apparatus for submicron structures
WO2003047306A2 (en) * 2001-11-02 2003-06-05 Product Systems Incorporated Radial power megasonic transducer
US7185661B2 (en) * 2002-05-06 2007-03-06 Akrion Technologies, Inc. Reciprocating megasonic probe
US6880560B2 (en) * 2002-11-18 2005-04-19 Techsonic Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
EP1635960A2 (de) * 2003-06-06 2006-03-22 P.C.T. Systems, Inc. Verfahren und vorrichtung zur bearbeitung von substraten mit megaschallenergie
AU2003903660A0 (en) * 2003-07-16 2003-07-31 Soniclean Pty Ltd A space adaptable ultrasonic cleaning apparatus
NZ543157A (en) * 2003-10-22 2008-09-26 Soniclean Pty Ltd An improved active wine barrel
NZ543156A (en) * 2003-10-22 2008-09-26 Soniclean Pty Ltd An apparatus and method for cleaning and recycling water used in cleaning of barrels
WO2006010997A1 (en) * 2004-07-16 2006-02-02 Darren Miles Bates An apparatus and method of ultrasonic cleaning
US7418525B2 (en) * 2004-10-29 2008-08-26 International Business Machines Corporation Shared simultaneously-connected removable drives and servers each housing an I/O controller which maintains an uninterrupted protocol connection
US7958899B2 (en) * 2007-08-21 2011-06-14 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning apparatus and substrate cleaning method
DE102007040851A1 (de) 2007-08-29 2009-03-05 Wacker Chemie Ag Verfahren zum Reinigen von polykristallinem Silicium
US8051863B2 (en) * 2007-10-18 2011-11-08 Lam Research Corporation Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus
SG174616A1 (en) * 2009-03-31 2011-11-28 Acm Research Shanghai Inc Methods and apparatus for cleaning semiconductor wafers
CN101927242B (zh) * 2009-06-25 2014-08-20 盛美半导体设备（上海）有限公司 半导体硅片的清洗方法和装置
US8539969B2 (en) * 2010-07-30 2013-09-24 Sematech, Inc. Gigasonic brush for cleaning surfaces
WO2014151990A1 (en) * 2013-03-14 2014-09-25 Koolance, Inc. Phonograph record cleaner
US10345211B2 (en) * 2016-03-28 2019-07-09 Hemlock Semiconductor Operations Llc Method of determining a concentration of a material not dissolved by silicon etchants contaminating a product

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2985003A (en) * 1957-01-11 1961-05-23 Gen Motors Corp Sonic washer
US3117768A (en) * 1960-11-21 1964-01-14 Branson Instr Ultrasonic transducers
US4064885A (en) * 1976-10-26 1977-12-27 Branson Ultrasonics Corporation Apparatus for cleaning workpieces by ultrasonic energy
US4326553A (en) * 1980-08-28 1982-04-27 Rca Corporation Megasonic jet cleaner apparatus
GB2097890B (en) * 1981-05-01 1985-06-12 Boulton Ltd William Ultrasonic cleaning
FR2524909B1 (fr) * 1982-04-08 1985-10-11 Framatome Sa Procede de degraissage de pieces au moyen d'ultra-sons et dispositif de mise en oeuvre de ce procede
JPS6116528A (ja) * 1985-06-14 1986-01-24 Hitachi Ltd ウエハ洗浄装置
US4768256A (en) * 1986-11-07 1988-09-06 Motoda Electronics Co., Ltd. Ultrasonic wiper
US4869278A (en) * 1987-04-29 1989-09-26 Bran Mario E Megasonic cleaning apparatus
JPH025538A (ja) * 1988-06-24 1990-01-10 Fujitsu Ltd モールド金型及び樹脂封止型半導体装置の製造方法
US4909266A (en) * 1989-03-10 1990-03-20 Frank Massa Ultrasonic cleaning system
WO1990014175A1 (fr) * 1989-05-17 1990-11-29 Minsky Radiotekhnichesky Institut Dispositif de traitement ultrasonique d'articles dans un milieu liquide
JPH0319337A (ja) * 1989-06-16 1991-01-28 Mitsubishi Electric Corp ウエハ異物除去装置
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
JP2877216B2 (ja) * 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
US5383484A (en) * 1993-07-16 1995-01-24 Cfmt, Inc. Static megasonic cleaning system for cleaning objects
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
US5626913A (en) * 1994-03-09 1997-05-06 Tokyo Electron Limited Resist processing method and apparatus
JP2830733B2 (ja) * 1994-03-25 1998-12-02 日本電気株式会社 電解水生成方法および電解水生成機構
US5601655A (en) * 1995-02-14 1997-02-11 Bok; Hendrik F. Method of cleaning substrates
TW355815B (en) * 1996-05-28 1999-04-11 Canon Kasei Kk Cleaning methods of porous surface and semiconductor surface

Also Published As

Publication number Publication date
US6021789A (en) 2000-02-08
DE69905538D1 (de) 2003-04-03
JP2000150440A (ja) 2000-05-30
EP1000673B1 (de) 2003-02-26
EP1000673A3 (de) 2000-09-20
EP1000673A2 (de) 2000-05-17
DE69905538T2 (de) 2003-11-20

Similar Documents

Publication Publication Date Title
ATE233131T1 (de) System zum reinigen von halbleiterscheiben mit megasonischer wanderwelle
CA2229975A1 (en) Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
KR900000817B1 (en) Semiconductor ic device manufacturing method
TW338015B (en) Improved method and apparatus for chemical mechanical polishing
DE69024681D1 (de) Schleifeinrichtung für Halbleiterplättchen
DE60232469D1 (de) Leitender Polierkörper zum elektrochemisch-mechanischen Polieren
KR930022483A (ko) 초음파 교반을 이용한 슬러리 폴리셔
IT8026865A0 (it) Sistema per il trattamento ed il trasferimento di elementi stratificati sottili (wafer) a semiconduttori.
TW366548B (en) Trench bump block and the application of the same
EP1522567A4 (de) Zusammensetzung und verfahren zur vorübergehenden befestigung eines festkörpers
US5715851A (en) Wafer cassette and cleaning system adopting the same
TW367530B (en) Multiple substrate processing apparatus for enhanced throughput
DE69913317D1 (de) Reinigungs-/schwabbeleinheit für halbleiterbearbeitungsvorrichtung
MY131407A (en) Method for uniform polish in microelectronic device
ES2002935A6 (es) Un metodo para hacer un miembro conectivo microelectronico elastico
JPS5333590A (en) Production of substrate for semiconductor integrated circuit
JPS5380157A (en) Manufacture of semiconductor device
JPS5680174A (en) Semiconductor pressure transducer
TWI266366B (en) Method of improving non-uniformity of chemical mechanical polish
EP1080842A4 (de) Verfahren und vorrichtung zum schleifen einer halbleiterscheibe
KR970052044A (ko) 반도체제조장치의 웨이퍼클램프
JPH04247276A (ja) 超音波洗浄装置
JP2000036477A (ja) 研磨、洗浄、乾燥一貫処理装置
KR960019557A (ko) 메가소닉을 이용한 기판 세정방법
JPS5412544A (en) Elastic surface wave unit

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties