ATE234906T1 - Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern - Google Patents

Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern

Info

Publication number
ATE234906T1
ATE234906T1 AT99973765T AT99973765T ATE234906T1 AT E234906 T1 ATE234906 T1 AT E234906T1 AT 99973765 T AT99973765 T AT 99973765T AT 99973765 T AT99973765 T AT 99973765T AT E234906 T1 ATE234906 T1 AT E234906T1
Authority
AT
Austria
Prior art keywords
wafer
exposed
modifying
wafers
processing fluid
Prior art date
Application number
AT99973765T
Other languages
English (en)
Inventor
L Charles Hardy
Jennifer L Trice
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE234906T1 publication Critical patent/ATE234906T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
AT99973765T 1999-03-10 1999-06-08 Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern ATE234906T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/266,208 US6238592B1 (en) 1999-03-10 1999-03-10 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
PCT/US1999/012762 WO2000053691A1 (en) 1999-03-10 1999-06-08 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Publications (1)

Publication Number Publication Date
ATE234906T1 true ATE234906T1 (de) 2003-04-15

Family

ID=23013625

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99973765T ATE234906T1 (de) 1999-03-10 1999-06-08 Bearbeitungsflüssigkeit und verfahren zur modifikation von struturierten halbleiterscheiben zur herstellung von halbleitern

Country Status (13)

Country Link
US (1) US6238592B1 (de)
EP (1) EP1163311B1 (de)
JP (1) JP4074434B2 (de)
KR (1) KR100577127B1 (de)
CN (1) CN1141353C (de)
AT (1) ATE234906T1 (de)
AU (1) AU4336399A (de)
BR (1) BR9917199A (de)
DE (1) DE69906155T2 (de)
HK (1) HK1043807B (de)
MY (1) MY117212A (de)
TW (1) TWI260342B (de)
WO (1) WO2000053691A1 (de)

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Also Published As

Publication number Publication date
WO2000053691A1 (en) 2000-09-14
KR20010110655A (ko) 2001-12-13
EP1163311A1 (de) 2001-12-19
BR9917199A (pt) 2002-01-08
HK1043807A1 (en) 2002-09-27
KR100577127B1 (ko) 2006-05-10
AU4336399A (en) 2000-09-28
DE69906155D1 (de) 2003-04-24
JP2002538284A (ja) 2002-11-12
US6238592B1 (en) 2001-05-29
MY117212A (en) 2004-05-31
TWI260342B (en) 2006-08-21
HK1043807B (en) 2004-03-05
CN1337983A (zh) 2002-02-27
CN1141353C (zh) 2004-03-10
EP1163311B1 (de) 2003-03-19
JP4074434B2 (ja) 2008-04-09
DE69906155T2 (de) 2004-02-12

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