ATE240553T1 - Einrichtung und verfahren zum einschalten einer funktion in einem vielspeichermodul - Google Patents
Einrichtung und verfahren zum einschalten einer funktion in einem vielspeichermodulInfo
- Publication number
- ATE240553T1 ATE240553T1 AT96944435T AT96944435T ATE240553T1 AT E240553 T1 ATE240553 T1 AT E240553T1 AT 96944435 T AT96944435 T AT 96944435T AT 96944435 T AT96944435 T AT 96944435T AT E240553 T1 ATE240553 T1 AT E240553T1
- Authority
- AT
- Austria
- Prior art keywords
- circuit
- memory
- enabling
- accessing
- circuits
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/16—Error detection or correction of the data by redundancy in hardware
- G06F11/20—Error detection or correction of the data by redundancy in hardware using active fault-masking, e.g. by switching out faulty elements or by switching in spare elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
- G11C29/808—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout using a flexible replacement scheme
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Dram (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Static Random-Access Memory (AREA)
- Transceivers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/577,840 US5825697A (en) | 1995-12-22 | 1995-12-22 | Circuit and method for enabling a function in a multiple memory device module |
| PCT/US1996/020113 WO1997025674A1 (en) | 1995-12-22 | 1996-12-19 | Circuit and method for enabling a function in a multiple memory device module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE240553T1 true ATE240553T1 (de) | 2003-05-15 |
Family
ID=24310366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT96944435T ATE240553T1 (de) | 1995-12-22 | 1996-12-19 | Einrichtung und verfahren zum einschalten einer funktion in einem vielspeichermodul |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US5825697A (de) |
| EP (1) | EP0868693B1 (de) |
| JP (1) | JP4009686B2 (de) |
| KR (1) | KR100441817B1 (de) |
| AT (1) | ATE240553T1 (de) |
| AU (1) | AU1424297A (de) |
| DE (1) | DE69628196T2 (de) |
| WO (1) | WO1997025674A1 (de) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5825697A (en) * | 1995-12-22 | 1998-10-20 | Micron Technology, Inc. | Circuit and method for enabling a function in a multiple memory device module |
| US6258609B1 (en) | 1996-09-30 | 2001-07-10 | Micron Technology, Inc. | Method and system for making known good semiconductor dice |
| DE19735406A1 (de) * | 1997-08-14 | 1999-02-18 | Siemens Ag | Halbleiterbauelement und Verfahren zum Testen und Betreiben eines Halbleiterbauelementes |
| KR100359856B1 (ko) | 1998-06-30 | 2003-01-08 | 주식회사 하이닉스반도체 | 앤티퓨즈를갖는내부전압발생기 |
| KR100519512B1 (ko) | 1998-12-30 | 2005-11-25 | 주식회사 하이닉스반도체 | 앤티퓨즈를 이용한 저전력 칼럼 리페어 회로 |
| KR100504433B1 (ko) * | 1999-01-09 | 2005-07-29 | 주식회사 하이닉스반도체 | 앤티퓨즈를 이용한 메모리소자의 리페어 회로 |
| US6240033B1 (en) | 1999-01-11 | 2001-05-29 | Hyundai Electronics Industries Co., Ltd. | Antifuse circuitry for post-package DRAM repair |
| DE10026737A1 (de) * | 2000-05-30 | 2001-12-13 | Infineon Technologies Ag | Verfahren zum bausteinspezifischen Reparieren eines Moduls |
| US6732304B1 (en) | 2000-09-21 | 2004-05-04 | Inapac Technology, Inc. | Chip testing within a multi-chip semiconductor package |
| US7240254B2 (en) * | 2000-09-21 | 2007-07-03 | Inapac Technology, Inc | Multiple power levels for a chip within a multi-chip semiconductor package |
| US7444575B2 (en) * | 2000-09-21 | 2008-10-28 | Inapac Technology, Inc. | Architecture and method for testing of an integrated circuit device |
| US6754866B1 (en) | 2001-09-28 | 2004-06-22 | Inapac Technology, Inc. | Testing of integrated circuit devices |
| US6812726B1 (en) * | 2002-11-27 | 2004-11-02 | Inapac Technology, Inc. | Entering test mode and accessing of a packaged semiconductor device |
| US7313740B2 (en) * | 2002-07-25 | 2007-12-25 | Inapac Technology, Inc. | Internally generating patterns for testing in an integrated circuit device |
| US7404117B2 (en) * | 2005-10-24 | 2008-07-22 | Inapac Technology, Inc. | Component testing and recovery |
| US8001439B2 (en) | 2001-09-28 | 2011-08-16 | Rambus Inc. | Integrated circuit testing module including signal shaping interface |
| US8286046B2 (en) | 2001-09-28 | 2012-10-09 | Rambus Inc. | Integrated circuit testing module including signal shaping interface |
| US7245141B2 (en) | 2002-11-27 | 2007-07-17 | Inapac Technology, Inc. | Shared bond pad for testing a memory within a packaged semiconductor device |
| US8166361B2 (en) | 2001-09-28 | 2012-04-24 | Rambus Inc. | Integrated circuit testing module configured for set-up and hold time testing |
| US20040019841A1 (en) * | 2002-07-25 | 2004-01-29 | Ong Adrian E. | Internally generating patterns for testing in an integrated circuit device |
| US7061263B1 (en) | 2001-11-15 | 2006-06-13 | Inapac Technology, Inc. | Layout and use of bond pads and probe pads for testing of integrated circuits devices |
| US7466160B2 (en) * | 2002-11-27 | 2008-12-16 | Inapac Technology, Inc. | Shared memory bus architecture for system with processor and memory units |
| US8063650B2 (en) | 2002-11-27 | 2011-11-22 | Rambus Inc. | Testing fuse configurations in semiconductor devices |
| US7673193B1 (en) * | 2005-08-18 | 2010-03-02 | Rambus Inc. | Processor-memory unit for use in system-in-package and system-in-module devices |
| US7006394B2 (en) * | 2004-06-07 | 2006-02-28 | Micron Technology, Inc. | Apparatus and method for semiconductor device repair with reduced number of programmable elements |
| US7006393B2 (en) * | 2004-06-07 | 2006-02-28 | Micron Technology, Inc. | Method and apparatus for semiconductor device repair with reduced number of programmable elements |
| US7218561B2 (en) * | 2004-06-07 | 2007-05-15 | Micron Technology, Inc. | Apparatus and method for semiconductor device repair with reduced number of programmable elements |
| US20080082763A1 (en) | 2006-10-02 | 2008-04-03 | Metaram, Inc. | Apparatus and method for power management of memory circuits by a system or component thereof |
| US10013371B2 (en) | 2005-06-24 | 2018-07-03 | Google Llc | Configurable memory circuit system and method |
| US9507739B2 (en) | 2005-06-24 | 2016-11-29 | Google Inc. | Configurable memory circuit system and method |
| US8335894B1 (en) | 2008-07-25 | 2012-12-18 | Google Inc. | Configurable memory system with interface circuit |
| US9171585B2 (en) | 2005-06-24 | 2015-10-27 | Google Inc. | Configurable memory circuit system and method |
| US8397013B1 (en) | 2006-10-05 | 2013-03-12 | Google Inc. | Hybrid memory module |
| US7609567B2 (en) | 2005-06-24 | 2009-10-27 | Metaram, Inc. | System and method for simulating an aspect of a memory circuit |
| US8244971B2 (en) | 2006-07-31 | 2012-08-14 | Google Inc. | Memory circuit system and method |
| US8359187B2 (en) | 2005-06-24 | 2013-01-22 | Google Inc. | Simulating a different number of memory circuit devices |
| US8089795B2 (en) | 2006-02-09 | 2012-01-03 | Google Inc. | Memory module with memory stack and interface with enhanced capabilities |
| US8055833B2 (en) | 2006-10-05 | 2011-11-08 | Google Inc. | System and method for increasing capacity, performance, and flexibility of flash storage |
| JP5242397B2 (ja) | 2005-09-02 | 2013-07-24 | メタラム インコーポレイテッド | Dramをスタックする方法及び装置 |
| US7779311B2 (en) * | 2005-10-24 | 2010-08-17 | Rambus Inc. | Testing and recovery in a multilayer device |
| US9632929B2 (en) | 2006-02-09 | 2017-04-25 | Google Inc. | Translating an address associated with a command communicated between a system and memory circuits |
| DE102006021043A1 (de) * | 2006-05-05 | 2007-11-08 | Qimonda Ag | Halbleiter-Bauelement, insbesondere Zwischenspeicher-Bauelement, sowie Verfahren zum Betreiben eines Halbleiter-Bauelements |
| US7385861B1 (en) * | 2006-08-18 | 2008-06-10 | Ambarella, Inc. | Synchronization circuit for DDR IO interface |
| WO2008042403A2 (en) | 2006-10-03 | 2008-04-10 | Inapac Technologies, Inc. | Memory accessing circuit system |
| US7561027B2 (en) * | 2006-10-26 | 2009-07-14 | Hewlett-Packard Development Company, L.P. | Sensing device |
| KR100913971B1 (ko) * | 2007-11-30 | 2009-08-26 | 주식회사 하이닉스반도체 | 안티퓨즈 리페어 제어 회로 및 그를 갖는 디램을 포함하는반도체 장치 |
| JP5726080B2 (ja) * | 2008-09-30 | 2015-05-27 | ドイッチェ テレコム アーゲー | 非接触型インターフェース装置を権限に応じて制御する方法および通信システム |
| EP2441007A1 (de) | 2009-06-09 | 2012-04-18 | Google, Inc. | Programmierung von dimm-abschlusswiderstandswerten |
| US9256493B2 (en) * | 2011-12-28 | 2016-02-09 | Intel Corporation | Memory module architecture |
| US10761588B2 (en) * | 2018-08-09 | 2020-09-01 | Micron Technology, Inc. | Power configuration component including selectable configuration profiles corresponding to operating characteristics of the power configuration component |
| US11670379B2 (en) * | 2020-12-04 | 2023-06-06 | Micron Technology, Inc. | Sense line structures in capacitive sense NAND memory |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3668644A (en) * | 1970-02-09 | 1972-06-06 | Burroughs Corp | Failsafe memory system |
| US5126971A (en) * | 1989-12-22 | 1992-06-30 | Magnex Corporation | Thin film magnetic core memory and method of making same |
| US5161157A (en) * | 1990-03-12 | 1992-11-03 | Xicor, Inc. | Field-programmable redundancy apparatus for memory arrays |
| DE69122481T2 (de) * | 1990-12-14 | 1997-02-20 | Sgs Thomson Microelectronics | Halbleiterspeicher mit Multiplex-Redundanz |
| US5241496A (en) * | 1991-08-19 | 1993-08-31 | Micron Technology, Inc. | Array of read-only memory cells, eacch of which has a one-time, voltage-programmable antifuse element constructed within a trench shared by a pair of cells |
| JPH06203595A (ja) * | 1991-08-30 | 1994-07-22 | Texas Instr Inc <Ti> | ユニバーサル・モジューラ・メモリ |
| US5110754A (en) * | 1991-10-04 | 1992-05-05 | Micron Technology, Inc. | Method of making a DRAM capacitor for use as an programmable antifuse for redundancy repair/options on a DRAM |
| US5257229A (en) * | 1992-01-31 | 1993-10-26 | Sgs-Thomson Microelectronics, Inc. | Column redundancy architecture for a read/write memory |
| US5301143A (en) * | 1992-12-31 | 1994-04-05 | Micron Semiconductor, Inc. | Method for identifying a semiconductor die using an IC with programmable links |
| US5412593A (en) * | 1994-01-12 | 1995-05-02 | Texas Instruments Incorporated | Fuse and antifuse reprogrammable link for integrated circuits |
| KR960016807B1 (ko) * | 1994-06-30 | 1996-12-21 | 삼성전자 주식회사 | 반도체 메모리 장치의 리던던시 회로 |
| JP3273440B2 (ja) * | 1994-10-19 | 2002-04-08 | マイクロン・テクノロジー・インコーポレーテッド | 部分的に良好なメモリ集積回路から使用可能な部分を得るための効率的な方法 |
| US5566107A (en) * | 1995-05-05 | 1996-10-15 | Micron Technology, Inc. | Programmable circuit for enabling an associated circuit |
| US5825697A (en) * | 1995-12-22 | 1998-10-20 | Micron Technology, Inc. | Circuit and method for enabling a function in a multiple memory device module |
| US5764574A (en) * | 1996-06-20 | 1998-06-09 | Nevill; Leland R. | Method and apparatus for back-end repair of multi-chip modules |
-
1995
- 1995-12-22 US US08/577,840 patent/US5825697A/en not_active Expired - Lifetime
-
1996
- 1996-12-19 DE DE69628196T patent/DE69628196T2/de not_active Expired - Lifetime
- 1996-12-19 WO PCT/US1996/020113 patent/WO1997025674A1/en not_active Ceased
- 1996-12-19 KR KR10-1998-0704770A patent/KR100441817B1/ko not_active Expired - Lifetime
- 1996-12-19 AU AU14242/97A patent/AU1424297A/en not_active Abandoned
- 1996-12-19 AT AT96944435T patent/ATE240553T1/de not_active IP Right Cessation
- 1996-12-19 JP JP52522097A patent/JP4009686B2/ja not_active Expired - Lifetime
- 1996-12-19 EP EP96944435A patent/EP0868693B1/de not_active Expired - Lifetime
-
1998
- 1998-03-12 US US09/042,129 patent/US5920516A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5920516A (en) | 1999-07-06 |
| EP0868693B1 (de) | 2003-05-14 |
| JP4009686B2 (ja) | 2007-11-21 |
| KR19990076659A (ko) | 1999-10-15 |
| DE69628196D1 (de) | 2003-06-18 |
| AU1424297A (en) | 1997-08-01 |
| KR100441817B1 (ko) | 2004-10-12 |
| JP2000503152A (ja) | 2000-03-14 |
| WO1997025674A1 (en) | 1997-07-17 |
| EP0868693A1 (de) | 1998-10-07 |
| US5825697A (en) | 1998-10-20 |
| DE69628196T2 (de) | 2004-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |