ATE242518T1 - Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art - Google Patents

Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art

Info

Publication number
ATE242518T1
ATE242518T1 AT00909436T AT00909436T ATE242518T1 AT E242518 T1 ATE242518 T1 AT E242518T1 AT 00909436 T AT00909436 T AT 00909436T AT 00909436 T AT00909436 T AT 00909436T AT E242518 T1 ATE242518 T1 AT E242518T1
Authority
AT
Austria
Prior art keywords
chip
antenna
electronic device
producing
contactless card
Prior art date
Application number
AT00909436T
Other languages
English (en)
Inventor
P Patrice
Michael Zafrany
Original Assignee
Gemplus Card Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card Int filed Critical Gemplus Card Int
Application granted granted Critical
Publication of ATE242518T1 publication Critical patent/ATE242518T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AT00909436T 1999-03-12 2000-03-06 Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art ATE242518T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9903102A FR2790849B1 (fr) 1999-03-12 1999-03-12 Procede de fabrication pour dispositif electronique du type carte sans contact
PCT/FR2000/000555 WO2000055808A1 (fr) 1999-03-12 2000-03-06 Procede de fabrication pour dispositif electronique du type carte sans contact

Publications (1)

Publication Number Publication Date
ATE242518T1 true ATE242518T1 (de) 2003-06-15

Family

ID=9543140

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00909436T ATE242518T1 (de) 1999-03-12 2000-03-06 Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art

Country Status (8)

Country Link
US (1) US6677186B1 (de)
EP (1) EP1163637B1 (de)
CN (1) CN1343340A (de)
AT (1) ATE242518T1 (de)
AU (1) AU3172400A (de)
DE (1) DE60003167T2 (de)
FR (1) FR2790849B1 (de)
WO (1) WO2000055808A1 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2775810B1 (fr) 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
IL127569A0 (en) 1998-09-16 1999-10-28 Comsense Technologies Ltd Interactive toys
WO2000021020A2 (en) 1998-10-02 2000-04-13 Comsense Technologies, Ltd. Card for interaction with a computer
US6607136B1 (en) 1998-09-16 2003-08-19 Beepcard Inc. Physical presence digital authentication system
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US8019609B2 (en) 1999-10-04 2011-09-13 Dialware Inc. Sonic/ultrasonic authentication method
DE10114355A1 (de) * 2001-03-22 2002-10-17 Intec Holding Gmbh Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte
US9219708B2 (en) 2001-03-22 2015-12-22 DialwareInc. Method and system for remotely authenticating identification devices
AU2002249532A1 (en) * 2001-03-22 2002-10-08 Beepcard Inc. Manufacture of self-powered identification devices
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
KR100910769B1 (ko) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 Ｉｃ 카드 및, 그것의 제조 방법
FR2847365B1 (fr) * 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
JP2004185208A (ja) * 2002-12-02 2004-07-02 Sony Corp Ｉｃカード
DE10257111B4 (de) * 2002-12-05 2005-12-22 Mühlbauer Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
JP4479209B2 (ja) * 2003-10-10 2010-06-09 パナソニック株式会社 電子回路装置およびその製造方法並びに電子回路装置の製造装置
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7452748B1 (en) * 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US20060109130A1 (en) * 2004-11-22 2006-05-25 Hattick John B Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
EP1900263A4 (de) * 2005-07-04 2011-03-23 Univ Griffith Herstellung elektronischer komponenten in kunststoff
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
EP2001077A1 (de) * 2007-05-21 2008-12-10 Gemplus Verfahren zur Herstellung einer Vorrichtung, die eine Transponderantenne verbunden mit Kontaktbereichen umfasst, und so erhaltene Vorrichtung
EP2034429A1 (de) * 2007-09-05 2009-03-11 Assa Abloy AB Herstellungsverfahren für eine Karte und mit diesem Verfahren hergestellte Karte
DE102007050102A1 (de) * 2007-10-16 2009-04-23 Smartrac Ip B.V. Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul
US20120256004A1 (en) * 2011-04-07 2012-10-11 Redbud Systems, LLC Selectively enabled rfid tag
DE102011115315A1 (de) * 2011-09-29 2013-04-04 Infineon Technologies Ag Chipkarten-Modul für eine Chipkarte
US9122968B2 (en) * 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
WO2014006787A1 (ja) * 2012-07-04 2014-01-09 パナソニック株式会社 電子部品実装構造体、ｉｃカード、ｃｏｆパッケージ
US10622700B2 (en) * 2016-05-18 2020-04-14 X-Celeprint Limited Antenna with micro-transfer-printed circuit element
FR3058545B1 (fr) * 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
CN109409486B (zh) * 2018-10-31 2020-01-31 江苏恒宝智能系统技术有限公司 一种智能卡及其加工方法
AU2020380119B2 (en) * 2019-03-11 2025-10-09 Ellipse World, Inc. Packaged electronic module and manufacturing method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US5826328A (en) * 1996-03-25 1998-10-27 International Business Machines Method of making a thin radio frequency transponder
ATE194242T1 (de) * 1996-08-02 2000-07-15 Schlumberger Systems & Service Kombinierte chipkarte
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
FR2769441A1 (fr) * 1997-10-07 1999-04-09 Philips Electronics Nv Carte electronique sans contact et son procede de fabrication
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
FR2778308B1 (fr) * 1998-04-30 2006-05-26 Schlumberger Systems & Service Procede de realisation d'un composant electronique et composant electronique
FR2780551B1 (fr) * 1998-06-29 2001-09-07 Inside Technologies Micromodule electronique integre et procede de fabrication d'un tel micromodule
FR2781298B1 (fr) * 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux

Also Published As

Publication number Publication date
AU3172400A (en) 2000-10-04
DE60003167D1 (de) 2003-07-10
CN1343340A (zh) 2002-04-03
FR2790849B1 (fr) 2001-04-27
EP1163637A1 (de) 2001-12-19
FR2790849A1 (fr) 2000-09-15
DE60003167T2 (de) 2004-05-06
US6677186B1 (en) 2004-01-13
EP1163637B1 (de) 2003-06-04
WO2000055808A1 (fr) 2000-09-21

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Legal Events

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