ATE246071T1 - Verfahren und vorrichtung zur in-situ endpunktbestimmung und zur optimierung eines chemisch-mechanischen polierverfahrens mit linear poliergerät - Google Patents
Verfahren und vorrichtung zur in-situ endpunktbestimmung und zur optimierung eines chemisch-mechanischen polierverfahrens mit linear poliergerätInfo
- Publication number
- ATE246071T1 ATE246071T1 AT98304242T AT98304242T ATE246071T1 AT E246071 T1 ATE246071 T1 AT E246071T1 AT 98304242 T AT98304242 T AT 98304242T AT 98304242 T AT98304242 T AT 98304242T AT E246071 T1 ATE246071 T1 AT E246071T1
- Authority
- AT
- Austria
- Prior art keywords
- belt
- removal rate
- chemical
- end point
- optimizing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
- H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/869,655 US6146248A (en) | 1997-05-28 | 1997-05-28 | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE246071T1 true ATE246071T1 (de) | 2003-08-15 |
Family
ID=25354009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT98304242T ATE246071T1 (de) | 1997-05-28 | 1998-05-28 | Verfahren und vorrichtung zur in-situ endpunktbestimmung und zur optimierung eines chemisch-mechanischen polierverfahrens mit linear poliergerät |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6146248A (de) |
| EP (1) | EP0893203B1 (de) |
| JP (1) | JPH1177524A (de) |
| KR (1) | KR19980087549A (de) |
| AT (1) | ATE246071T1 (de) |
| DE (1) | DE69816726T2 (de) |
| TW (1) | TW440888B (de) |
Families Citing this family (85)
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-
1997
- 1997-05-28 US US08/869,655 patent/US6146248A/en not_active Expired - Fee Related
-
1998
- 1998-05-28 KR KR1019980020318A patent/KR19980087549A/ko not_active Ceased
- 1998-05-28 AT AT98304242T patent/ATE246071T1/de not_active IP Right Cessation
- 1998-05-28 JP JP18677498A patent/JPH1177524A/ja active Pending
- 1998-05-28 EP EP98304242A patent/EP0893203B1/de not_active Expired - Lifetime
- 1998-05-28 DE DE69816726T patent/DE69816726T2/de not_active Expired - Fee Related
- 1998-11-24 TW TW087108349A patent/TW440888B/zh not_active IP Right Cessation
-
2000
- 2000-03-16 US US09/527,171 patent/US6261155B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6261155B1 (en) | 2001-07-17 |
| DE69816726T2 (de) | 2004-08-05 |
| EP0893203A2 (de) | 1999-01-27 |
| TW440888B (en) | 2001-06-16 |
| JPH1177524A (ja) | 1999-03-23 |
| US6146248A (en) | 2000-11-14 |
| EP0893203A3 (de) | 2000-01-12 |
| DE69816726D1 (de) | 2003-09-04 |
| EP0893203B1 (de) | 2003-07-30 |
| KR19980087549A (ko) | 1998-12-05 |
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