ATE246577T1 - Verfahren zum spalten - Google Patents

Verfahren zum spalten

Info

Publication number
ATE246577T1
ATE246577T1 AT98310411T AT98310411T ATE246577T1 AT E246577 T1 ATE246577 T1 AT E246577T1 AT 98310411 T AT98310411 T AT 98310411T AT 98310411 T AT98310411 T AT 98310411T AT E246577 T1 ATE246577 T1 AT E246577T1
Authority
AT
Austria
Prior art keywords
porous layer
bonded substrate
image
substrate stack
jet
Prior art date
Application number
AT98310411T
Other languages
English (en)
Inventor
Kazuaki Omi
Takao Yonehara
Kiyofumi Sakaguchi
Kazutaka Yanagita
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE246577T1 publication Critical patent/ATE246577T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1374—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing with means projecting fluid against work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49821—Disassembling by altering or destroying work part or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/364—By fluid blast and/or suction

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Materials For Photolithography (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Inorganic Insulating Materials (AREA)
AT98310411T 1997-12-26 1998-12-18 Verfahren zum spalten ATE246577T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36101497A JP4323577B2 (ja) 1997-12-26 1997-12-26 分離方法および半導体基板の製造方法

Publications (1)

Publication Number Publication Date
ATE246577T1 true ATE246577T1 (de) 2003-08-15

Family

ID=18471832

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98310411T ATE246577T1 (de) 1997-12-26 1998-12-18 Verfahren zum spalten

Country Status (9)

Country Link
US (1) US6436226B1 (de)
EP (1) EP0925887B1 (de)
JP (1) JP4323577B2 (de)
KR (1) KR19990063514A (de)
CN (1) CN1153264C (de)
AT (1) ATE246577T1 (de)
AU (1) AU736845B2 (de)
DE (1) DE69816955T2 (de)
SG (1) SG76581A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG68035A1 (en) 1997-03-27 1999-10-19 Canon Kk Method and apparatus for separating composite member using fluid
EP1107295A3 (de) 1999-12-08 2005-04-13 Canon Kabushiki Kaisha Trennverfahren für ein Verbundbauteil, Herstellungsverfahren für Dünnfilm, Vorrichtung zur Trennung eines Verbundbauteils
JP2002075915A (ja) * 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
JP2002075917A (ja) * 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
KR100383265B1 (ko) * 2001-01-17 2003-05-09 삼성전자주식회사 웨이퍼 보호 테이프 제거용 반도체 제조장치
FR2823373B1 (fr) * 2001-04-10 2005-02-04 Soitec Silicon On Insulator Dispositif de coupe de couche d'un substrat, et procede associe
JP2002340989A (ja) * 2001-05-15 2002-11-27 Semiconductor Energy Lab Co Ltd 測定方法、検査方法及び検査装置
JP2002353423A (ja) 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び処理方法
JP2003017667A (ja) 2001-06-29 2003-01-17 Canon Inc 部材の分離方法及び分離装置
JP2003017668A (ja) * 2001-06-29 2003-01-17 Canon Inc 部材の分離方法及び分離装置
US7187162B2 (en) * 2002-12-16 2007-03-06 S.O.I.Tec Silicon On Insulator Technologies S.A. Tools and methods for disuniting semiconductor wafers
US20050150597A1 (en) * 2004-01-09 2005-07-14 Silicon Genesis Corporation Apparatus and method for controlled cleaving
DE102010010334B4 (de) * 2010-03-04 2012-01-19 Satisloh Ag Vorrichtung zum Abblocken von optischen Werkstücken, insbesondere Brillengläsern
US9765289B2 (en) * 2012-04-18 2017-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning methods and compositions
JP6145415B2 (ja) * 2014-02-27 2017-06-14 東京エレクトロン株式会社 剥離方法、プログラム、コンピュータ記憶媒体、剥離装置及び剥離システム
KR102305505B1 (ko) * 2014-09-29 2021-09-24 삼성전자주식회사 웨이퍼 서포팅 시스템 디본딩 이니시에이터 및 웨이퍼 서포팅 시스템 디본딩 방법
DE102014118017A1 (de) 2014-12-05 2016-06-09 Ev Group E. Thallner Gmbh Substratstapelhalterung, Container und Verfahren zur Trennung eines Substratstapels
CN105931997B (zh) * 2015-02-27 2019-02-05 胡迪群 暂时性复合式载板
CN109148333A (zh) * 2018-08-03 2019-01-04 武汉新芯集成电路制造有限公司 一种晶圆分离装置及方法
KR102204732B1 (ko) * 2019-11-11 2021-01-19 (주)더숨 Soi 기판 제조 방법
WO2024039868A1 (en) * 2022-08-19 2024-02-22 Lumileds Llc Open-ended holder device for removing sapphire substrate
WO2024204570A1 (ja) * 2023-03-31 2024-10-03 芝浦メカトロニクス株式会社 基板分離装置、基板処理装置および基板分離方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507898A (en) * 1981-04-13 1985-04-02 International Harvester Company Abrasive liquid jet cutting apparatus
US4703591A (en) * 1985-04-15 1987-11-03 Libbey-Owens-Ford Co. Ultra-high pressure abrasive jet cutting of glass
US4702042A (en) * 1984-09-27 1987-10-27 Libbey-Owens-Ford Co. Cutting strengthened glass
US4962879A (en) 1988-12-19 1990-10-16 Duke University Method for bubble-free bonding of silicon wafers
KR950014609B1 (ko) 1990-08-03 1995-12-11 캐논 가부시끼가이샤 반도체부재 및 반도체부재의 제조방법
FR2681472B1 (fr) 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
US5212451A (en) 1992-03-09 1993-05-18 Xerox Corporation Single balanced beam electrostatic voltmeter modulator
FR2699852B1 (fr) * 1992-12-29 1995-03-17 Gaz De France Procédé et dispositif d'usinage à jet de fluide haute pression asservi.
US5339715A (en) * 1993-09-02 1994-08-23 Davidson Textron Inc. Programmable pressure control system
JP3257580B2 (ja) 1994-03-10 2002-02-18 キヤノン株式会社 半導体基板の作製方法
FR2725074B1 (fr) 1994-09-22 1996-12-20 Commissariat Energie Atomique Procede de fabrication d'une structure comportant une couche mince semi-conductrice sur un substrat
KR0165467B1 (ko) * 1995-10-31 1999-02-01 김광호 웨이퍼 디본더 및 이를 이용한 웨이퍼 디본딩법
US6159824A (en) * 1997-05-12 2000-12-12 Silicon Genesis Corporation Silicon-on-silicon wafer bonding process using a thin film blister-separation method

Also Published As

Publication number Publication date
US6436226B1 (en) 2002-08-20
DE69816955D1 (de) 2003-09-11
JPH11195569A (ja) 1999-07-21
CN1153264C (zh) 2004-06-09
EP0925887B1 (de) 2003-08-06
AU9818798A (en) 1999-07-15
KR19990063514A (ko) 1999-07-26
DE69816955T2 (de) 2004-06-17
SG76581A1 (en) 2000-11-21
EP0925887A1 (de) 1999-06-30
CN1221973A (zh) 1999-07-07
JP4323577B2 (ja) 2009-09-02
AU736845B2 (en) 2001-08-02

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Legal Events

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