JPH11195568A5 - - Google Patents

Info

Publication number
JPH11195568A5
JPH11195568A5 JP1997361012A JP36101297A JPH11195568A5 JP H11195568 A5 JPH11195568 A5 JP H11195568A5 JP 1997361012 A JP1997361012 A JP 1997361012A JP 36101297 A JP36101297 A JP 36101297A JP H11195568 A5 JPH11195568 A5 JP H11195568A5
Authority
JP
Japan
Prior art keywords
sample
separating
separation
substrate
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997361012A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11195568A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP36101297A priority Critical patent/JPH11195568A/ja
Priority claimed from JP36101297A external-priority patent/JPH11195568A/ja
Priority to SG1998005839A priority patent/SG70141A1/en
Priority to US09/211,757 priority patent/US6418999B1/en
Priority to SG200100215A priority patent/SG87916A1/en
Priority to TW87120972A priority patent/TW429464B/zh
Priority to DE1998627459 priority patent/DE69827459T2/de
Priority to AT98310462T priority patent/ATE281909T1/de
Priority to EP19980310462 priority patent/EP0925888B1/de
Priority to AU98190/98A priority patent/AU717785B2/en
Priority to KR10-1998-0058984A priority patent/KR100366722B1/ko
Publication of JPH11195568A publication Critical patent/JPH11195568A/ja
Priority to US10/151,527 priority patent/US6521078B2/en
Priority to US10/318,231 priority patent/US6860963B2/en
Publication of JPH11195568A5 publication Critical patent/JPH11195568A5/ja
Withdrawn legal-status Critical Current

Links

JP36101297A 1997-12-26 1997-12-26 試料の分離装置及びその方法並びに基板の製造方法 Withdrawn JPH11195568A (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP36101297A JPH11195568A (ja) 1997-12-26 1997-12-26 試料の分離装置及びその方法並びに基板の製造方法
SG1998005839A SG70141A1 (en) 1997-12-26 1998-12-15 Sample separating apparatus and method and substrate manufacturing method
US09/211,757 US6418999B1 (en) 1997-12-26 1998-12-15 Sample separating apparatus and method, and substrate manufacturing method
SG200100215A SG87916A1 (en) 1997-12-26 1998-12-15 Sample separating apparatus and method, and substrate manufacturing method
TW87120972A TW429464B (en) 1997-12-26 1998-12-16 Sample separating apparatus and method, and substrate manufacturing method
EP19980310462 EP0925888B1 (de) 1997-12-26 1998-12-18 Vorrichtung und Verfahren zum Spalten
AT98310462T ATE281909T1 (de) 1997-12-26 1998-12-18 Vorrichtung und verfahren zum spalten
DE1998627459 DE69827459T2 (de) 1997-12-26 1998-12-18 Vorrichtung und Verfahren zum Spalten
AU98190/98A AU717785B2 (en) 1997-12-26 1998-12-24 Sample separating apparatus and method, and substrate manufacturing method
KR10-1998-0058984A KR100366722B1 (ko) 1997-12-26 1998-12-26 샘플분리장치와방법및기판제조방법
US10/151,527 US6521078B2 (en) 1997-12-26 2002-05-20 Sample separating apparatus and method, and substrate manufacturing method
US10/318,231 US6860963B2 (en) 1997-12-26 2002-12-12 Sample separating apparatus and method, and substrate manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36101297A JPH11195568A (ja) 1997-12-26 1997-12-26 試料の分離装置及びその方法並びに基板の製造方法

Publications (2)

Publication Number Publication Date
JPH11195568A JPH11195568A (ja) 1999-07-21
JPH11195568A5 true JPH11195568A5 (de) 2005-07-28

Family

ID=18471822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36101297A Withdrawn JPH11195568A (ja) 1997-12-26 1997-12-26 試料の分離装置及びその方法並びに基板の製造方法

Country Status (1)

Country Link
JP (1) JPH11195568A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884592B2 (ja) * 2000-03-15 2012-02-29 株式会社半導体エネルギー研究所 発光装置の作製方法及び表示装置の作製方法
JP5764616B2 (ja) * 2013-06-10 2015-08-19 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP7037459B2 (ja) * 2018-09-10 2022-03-16 キオクシア株式会社 半導体製造装置および半導体装置の製造方法

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