ATE256915T1 - Durch ein gehäuse umschlossener verschliessbarer halbleiterscheibenhalter - Google Patents

Durch ein gehäuse umschlossener verschliessbarer halbleiterscheibenhalter

Info

Publication number
ATE256915T1
ATE256915T1 AT94922053T AT94922053T ATE256915T1 AT E256915 T1 ATE256915 T1 AT E256915T1 AT 94922053 T AT94922053 T AT 94922053T AT 94922053 T AT94922053 T AT 94922053T AT E256915 T1 ATE256915 T1 AT E256915T1
Authority
AT
Austria
Prior art keywords
housing
holder
disk holder
semiconductor wafer
semiconductor disk
Prior art date
Application number
AT94922053T
Other languages
English (en)
Inventor
James E Holliday
Gary M Gallagher
Original Assignee
Empak Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Empak Inc filed Critical Empak Inc
Application granted granted Critical
Publication of ATE256915T1 publication Critical patent/ATE256915T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/137Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138Wafers positioned vertically within cassette

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measuring Fluid Pressure (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
AT94922053T 1994-03-11 1994-06-29 Durch ein gehäuse umschlossener verschliessbarer halbleiterscheibenhalter ATE256915T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/209,227 US5472086A (en) 1994-03-11 1994-03-11 Enclosed sealable purgible semiconductor wafer holder
PCT/US1994/007357 WO1995024348A1 (en) 1994-03-11 1994-06-29 Enclosed sealable purgible semiconductor wafer holder

Publications (1)

Publication Number Publication Date
ATE256915T1 true ATE256915T1 (de) 2004-01-15

Family

ID=22777887

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94922053T ATE256915T1 (de) 1994-03-11 1994-06-29 Durch ein gehäuse umschlossener verschliessbarer halbleiterscheibenhalter

Country Status (6)

Country Link
US (2) US5472086A (de)
EP (1) EP0749393B1 (de)
JP (1) JP3202991B2 (de)
AT (1) ATE256915T1 (de)
DE (1) DE69433428T2 (de)
WO (1) WO1995024348A1 (de)

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JP3257328B2 (ja) * 1995-03-16 2002-02-18 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
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US6168364B1 (en) * 1999-04-19 2001-01-02 Tdk Corporation Vacuum clean box, clean transfer method and apparatus therefor
US6561894B1 (en) 1999-04-19 2003-05-13 Tdk Corporation Clean box, clean transfer method and apparatus therefor
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US7252199B2 (en) * 2004-03-26 2007-08-07 Entegris, Inc. Disk cassette system
US7584851B2 (en) * 2004-10-08 2009-09-08 Seagate Technology Llc Container for disk drives
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US7810639B2 (en) * 2006-02-10 2010-10-12 Seagate Technology Llc Container for consumer electronics
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US20080019811A1 (en) * 2006-07-11 2008-01-24 Michael Krolak Method and apparatus for vertical wafer transport, buffer and storage
EP2166566A4 (de) * 2007-07-09 2010-12-29 Kondoh Ind Ltd Einrichtung zum eindringen von trockenluft oder stickstoffgas in einen halbleiterwafer-lagerbehälter und die einrichtung verwendende vorrichtung zur entfernung von statischer wafer-ladung
US20100020440A1 (en) * 2008-07-25 2010-01-28 Seagate Technology Llc Low profile substrate shipper
TWI346638B (en) * 2008-12-26 2011-08-11 Gudeng Prec Industral Co Ltd A purging valve and a wafer container having the purging valve
TW201302573A (zh) 2011-05-03 2013-01-16 安堤格里斯公司 具有微粒屏蔽之晶圓容器
US20120288355A1 (en) * 2011-05-11 2012-11-15 Ming-Teng Hsieh Method for storing wafers
JP5888288B2 (ja) * 2013-06-26 2016-03-16 株式会社ダイフク 物品保管設備の検査装置
US10566226B2 (en) * 2014-11-11 2020-02-18 Applied Materials, Inc. Multi-cassette carrying case
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP2025518008A (ja) 2022-05-27 2025-06-12 インテグリス・インコーポレーテッド フィルタモジュール
WO2025031577A1 (de) * 2023-08-08 2025-02-13 Hermos Ag Anzeige- und identifikationseinheit für transportbehältnisse für wafer oder fotomasken in halbleiterfabriken

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Also Published As

Publication number Publication date
DE69433428T2 (de) 2004-10-07
EP0749393A4 (de) 1997-07-02
WO1995024348A1 (en) 1995-09-14
US5755332A (en) 1998-05-26
EP0749393A1 (de) 1996-12-27
US5472086A (en) 1995-12-05
JP3202991B2 (ja) 2001-08-27
JPH09507726A (ja) 1997-08-05
EP0749393B1 (de) 2003-12-17
DE69433428D1 (de) 2004-01-29

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